Texas Instruments SN74V283-6GGM

Overview

SN74V283-6GGM from Texas Instruments is a 32768 × 18 / 65536 × 9 high-speed CMOS FIFO memory with independent read/write clocks, 166-MHz operation, 6-ns read/write cycle time, and user-selectable ×9/×18 bus sizing - deployed in network buffering, video frame synchronization, and DSP interface applications.

For engineers reviewing the SN74V283-6GGM datasheet, SN74V283-6GGM pinout, SN74V283-6GGM application, or SN74V283-6GGM equivalent, key selection criteria include FWFT vs. standard timing mode, programmable almost-empty/full flag offsets, big/little-endian data formatting, zero-latency retransmit capability, and 5-V-tolerant input compatibility with 3.3-V core logic.

Technical Context

This FIFO implements dual-clock asynchronous architecture with fully independent RCLK and WCLK domains (0–166 MHz), enabling simultaneous read/write without arbitration. It supports both first-word fall-through (FWFT) and standard timing modes, selected at master reset via FWFT/SI pin.

Bus configuration is dynamically set by IW/OW pins during master reset, enabling ×9-in/×18-out, ×18-in/×9-out, and other combinations. Retransmit functionality resets the read pointer to address zero on RT assertion, with zero-latency mode selectable via RM pin during initialization.

Key Specifications

Pinout & Package

SN74V283-6GGM is housed in a 100-pin Ball Grid Array (BGA) package designated GGM per TI's SCAS669D datasheet. This RoHS-compliant, surface-mount package measures 11 mm × 11 mm with 0.8-mm ball pitch and exposes all functional I/Os, power, and ground terminals as defined in the official top-view pinout.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FIFO memory applications.

Compared with SN74V273-6PZ, SN74V283-6GGM offers double memory depth and superior thermal performance in BGA packaging, while SN74V293-6GGM extends depth further without altering interface behavior - making SN74V283-6GGM the optimal balance of capacity, density, and signal integrity for mid-range high-speed buffering.

Availability

SN74V283-6GGM is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, and industrial protocol gateways requiring stable component supply, long-lifecycle support, and guaranteed traceable sourcing.

Supply support for SN74V283-6GGM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 50 years of innovation in high-performance timing and interface ICs.

The SN74V283-6GGM belongs to TI's high-speed FIFO memory product line, engineered specifically for deterministic data buffering in network, video, and DSP-intensive systems demanding sub-10-ns timing precision and flexible bus-matching.

FAQ

What is the maximum operating frequency of the SN74V283-6GGM?

The SN74V283-6GGM supports up to 166 MHz on both read and write clocks, with 6-ns read/write cycle time confirmed in TI's SCAS669D datasheet. This frequency applies to both RCLK and WCLK independently, and operation is guaranteed across the full commercial temperature range (0°C to 70°C) with 3.3-V ± 0.3-V supply.

Does the SN74V283-6GGM support first-word fall-through (FWFT) mode?

Yes, the SN74V283-6GGM supports FWFT mode, selected during master reset via the FWFT/SI pin. In FWFT mode, the first word written to an empty FIFO appears on Q0–Q17 after three RCLK rising edges without requiring REN assertion - enabling immediate data availability for time-critical read paths.

How is bus width configured on the SN74V283-6GGM?

Bus width is configured using IW (input width) and OW (output width) pins during master reset. Per Table 1 in SCAS669D, combinations include ×18-in/×18-out (IW=L, OW=L), ×18-in/×9-out (IW=L, OW=H), ×9-in/×18-out (IW=H, OW=L), and ×9-in/×9-out (IW=H, OW=H). Unused data bits must be tied low (inputs) or left unconnected (outputs).

Can the SN74V283-6GGM perform zero-latency retransmit?

Yes, zero-latency retransmit is supported on the SN74V283-6GGM. When RM is held low during master reset, asserting RT on a rising RCLK edge places the first retransmitted word directly onto Q0–Q17 within that same clock edge - eliminating pipeline delay for real-time replay or diagnostic access.

What package type is used for the SN74V283-6GGM?

The SN74V283-6GGM uses a 100-ball BGA package designated GGM per TI's official documentation. It measures 11 mm × 11 mm with 0.8-mm ball pitch, features exposed thermal pad, and complies with JEDEC MO-220 standards - optimized for high-density routing and thermal performance in high-speed designs.