Texas Instruments SN74V293-15GGM

Overview

SN74V293-15GGM from Texas Instruments is a 65536 × 18/131072 × 9, 3.3-V CMOS first-in, first-out (FIFO) memory with independent read/write clocks, user-selectable ×9/×18 bus sizing, and FWFT/standard timing modes. It delivers 166-MHz operation, 6-ns read/write cycle time, and zero-latency retransmit capability for high-throughput data buffering in DSP interfacing and telecom systems.

For engineers reviewing the SN74V293-15GGM datasheet, SN74V293-15GGM pinout, SN74V293-15GGM application, or SN74V293-15GGM equivalent, key selection criteria include its 65536-word depth, dual-clock domain support, programmable almost-empty/almost-full flags with eight default offsets, big/little-endian byte formatting, and 5-V-tolerant inputs for mixed-voltage system integration.

Technical Context

This FIFO implements a dual-port, asynchronous RAM array with independent read and write pointer logic, configurable flag generation (EF/OR, FF/IR, HF, PAE, PAF), and serial/parallel offset programming via LD-controlled registers. Its retransmit function resets the read pointer on RT assertion, with latency mode selected by RM during master reset.

The device supports four bus-matching configurations (×9/×9, ×9/×18, ×18/×9, ×18/×18) determined by IW and OW pins at master reset, and enables FWFT mode-where the first word appears on Q outputs after three RCLK edges without REN-versus standard mode requiring explicit REN activation for all reads.

Key Specifications

Pinout & Package

SN74V293-15GGM is packaged in a 100-pin Ball Grid Array (BGA) with GGM suffix, compliant with JEDEC MO-220, 12 mm × 12 mm body size, 0.8-mm ball pitch. Pin functions are validated per SCAS669D datasheet Figure 1 and Table 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FIFO memory applications.

Compared with IDT72V2105L15PF and NB3N502FG, SN74V293-15GGM uniquely combines maximum depth (65536 × 18), FWFT timing, 5-V-tolerant inputs, and full flag programmability-making it the sole option for high-reliability, mixed-voltage, deep-buffering systems requiring zero-latency retransmit and bus-matching agility.

Availability

SN74V293-15GGM is available at Aetrix Electronics and suitable for network packet buffering, DSP interfacing, and telecom line card applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for SN74V293-15GGM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal technologies, with over 90 years of innovation in high-performance data-path components.

The SN74V293-15GGM belongs to TI's high-speed FIFO memory product line, engineered specifically for deep, low-latency data buffering in telecommunications infrastructure, video processing, and DSP-centric embedded systems.

FAQ

What is the maximum operating frequency of the SN74V293-15GGM?

The SN74V293-15GGM supports a maximum clock frequency of 166 MHz for both read and write operations, enabling sustained data throughput up to 2.99 Gbps in ×18 mode. This specification is guaranteed across commercial temperature range (0°C to 70°C) and 3.3-V ±0.3-V supply, as verified in the SCAS669D datasheet timing characteristics table.

Does the SN74V293-15GGM support 5-V logic inputs?

Yes, the SN74V293-15GGM features 5-V-tolerant inputs on all control and data pins (WEN, REN, MRS, D0–D17, etc.), allowing direct connection to 5-V microcontrollers or FPGAs without level-shifting circuitry while operating from a 3.3-V supply-confirmed in the "Electrical Characteristics" section of the SCAS669D datasheet.

How does the First-Word Fall-Through (FWFT) mode work in the SN74V293-15GGM?

In FWFT mode-enabled by high FWFT/SI during master reset-the first word written to an empty SN74V293-15GGM appears on Q0–Q17 outputs after exactly three RCLK rising edges, without requiring REN assertion. Subsequent words still require REN, and OR/IR flags replace EF/FF for status signaling-detailed in the functional description and timing diagrams of SCAS669D.

Can the SN74V293-15GGM be used in systems requiring different endian formats?

Yes, the SN74V293-15GGM supports both big-endian and little-endian data ordering via the BE pin during master reset. When configured for ×18-to-×9 conversion, BE determines whether the MSB or LSB portion of the 18-bit word is presented first on Q0–Q8-enabling seamless integration with ARM, PowerPC, or TI C6x processors with differing native byte order.

What package type is used for the SN74V293-15GGM?

The SN74V293-15GGM uses a 100-pin Ball Grid Array (BGA) package designated GGM, measuring 12 mm × 12 mm with 0.8-mm ball pitch and complying with JEDEC MO-220 standards. This package is explicitly listed in the SCAS669D datasheet "Orderable Information" table and confirmed in the mechanical drawings.