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Texas Instruments SNJ54ABT827W
- Part No.:
- SNJ54ABT827W
- Manufacturer:
- Texas Instruments
- Package:
- -
- Datasheet:
-
SNJ54ABT827W.pdf
- Description:
- IC BUF NON-INVERT 5.5V 24CFP
- Quantity:
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Inventory:4,522
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Product details
Overview
SNJ54ABT827W from Texas Instruments is a military-grade 10-bit noninverting 3-state buffer/bus driver in ceramic flatpack (CFP-24) packaging, operating across −55°C to 125°C. It delivers high-drive outputs (−32 mA IOH, 64 mA IOL), low output ground bounce (<1 V VOLP), and flow-through pinout for optimized PCB layout. It serves as a robust bus interface in avionics data buses requiring wide-data-path signal integrity and power-up/down high-impedance safety.
For engineers reviewing the SNJ54ABT827W datasheet, SNJ54ABT827W pinout, SNJ54ABT827W application, or SNJ54ABT827W equivalent, key selection criteria include military temperature range compliance, dual active-low OE control logic, EPIC-IIIB BiCMOS process benefits, and CFP-24 hermetic packaging suitability for high-reliability embedded systems.
Technical Context
This device implements a dual-input AND-gated 3-state control architecture: both OE1 and OE2 must be low to enable outputs; either high forces all ten Y outputs into high-impedance. Its EPIC-IIIB BiCMOS design reduces dynamic power dissipation while maintaining TTL-compatible input thresholds (VIH = 2 V, VIL = 0.8 V) and rail-to-rail output swing under load.
It features inherent power sequencing immunity: outputs remain high-impedance when VCC is between 0–2.1 V during power-up/down. For guaranteed high-Z above 2.1 V, OE pins require pullup resistors-minimum value determined by driver sink capability-not internal circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage (VCC) | 4.5 V to 5.5 V - Ensures compatibility with 5-V TTL and mixed-voltage system rails without level shifting. |
| Operating Temperature | −55°C to 125°C - Qualified per MIL-PRF-38535 for deployment in aerospace, defense, and harsh-environment computing. |
| Output Drive Strength | −32 mA IOH / 64 mA IOL - Supports heavy capacitive loads and fanout to multiple TTL inputs without signal degradation. |
| Propagation Delay (tPLH/tPHL) | 1.1 ns (min) to 4.9 ns (max) at 5 V - Enables high-speed data path buffering in real-time bus architectures. |
| Input Clamp Current | −18 mA - Protects inputs against transient overvoltage events up to −0.5 V, enhancing system-level ESD robustness. |
| Thermal Impedance (θJA) | Not specified for CFP package - Hermetic ceramic flatpack provides superior thermal stability vs. plastic packages in sustained high-power operation. |
| Output Ground Bounce (VOLP) | <1 V at VCC = 5 V, TA = 25°C - Minimizes noise coupling into shared ground planes during simultaneous switching. |
Pinout & Package
Ceramic Flatpack (CFP-24), hermetically sealed, 24-pin package with 0.050″ lead pitch and JEDEC MO-153 compliant footprint. Designed for high-reliability, high-temperature, and low-outgassing applications including space-grade electronics.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 13 | OE1, OE2 | Active-low 3-state enable inputs - Dual AND-gated control ensures fail-safe disable if either signal floats high or fails. |
| 2–11, 14–23 | A1–A10, Y1–Y10 | Data input/output pairs - Flow-through arrangement (A1→Y1, A2→Y2, etc.) minimizes trace crossovers on dense PCBs. |
| 12 | GND | Power return reference - Dedicated ground pin adjacent to VCC (pin 24) reduces ground loop inductance. |
| 24 | VCC | Positive supply - Requires local 0.1 µF ceramic decoupling; no internal regulation or brownout detection. |
| 5, 7, 15, 16, 19, 20, 21, 22 | NC | No internal connection - Mechanical support pins only; must remain unconnected per datasheet. |
Key Features
| Feature | Design Value |
|---|---|
| Latch-up immunity | Exceeds 500 mA per JESD-17 - Prevents destructive latch-up during voltage transients or ESD events in mission-critical systems. |
| Power-up/down high-Z | Guaranteed state below 2.1 V VCC - Eliminates bus contention during cold-start or brownout conditions without external reset logic. |
| Flow-through architecture | Linear A1–Y1 to A10–Y10 pin mapping - Reduces PCB layer count and routing congestion in high-density backplane interfaces. |
| EPIC-IIIB BiCMOS process | State-of-the-art fabrication - Delivers lower dynamic power vs. standard bipolar while retaining TTL drive strength and speed. |
| High-impedance leakage | ±10 µA max (IOZH/IOZL) at VCC ≥ 2.1 V - Ensures minimal standby current draw in powered-down subsystems. |
Applications
| Avionics Data Bus Interface | Military Vehicle Control Backplane |
|---|---|
Use Scenario: Buffering parallel address/data lines between flight computer and sensor acquisition modules in MIL-STD-1553B auxiliary buses. IC Role / Device Role / Timing Role: 10-bit unidirectional bus driver providing isolation, drive strength, and controlled enable timing for deterministic bus arbitration. Use Value: Flow-through pinout simplifies routing across multi-layer avionics PCBs; military temp rating ensures reliability at altitude and under vibration. |
Use Scenario: Interfacing vehicle health monitoring unit with distributed I/O controllers across armored platform chassis wiring harnesses. IC Role / Device Role / Timing Role: High-drive buffer enabling clean signal transmission over long traces subject to EMI and ground shift. Use Value: −32 mA/64 mA drive supports >10 TTL loads; latch-up immunity meets DO-160 Section 22 surge requirements. |
| Tactical Radio Baseband Processing | Space-Qualified Payload Telemetry |
Use Scenario: Level-shifting and buffering between FPGA-based modulator/demodulator cores and legacy analog front-end ASICs. IC Role / Device Role / Timing Role: Noninverting buffer with precise propagation delay matching across all 10 channels for coherent symbol timing. Use Value: 1.1–4.9 ns tPLH/tPHL variation enables sub-nanosecond skew control in time-critical baseband paths. |
Use Scenario: Isolating telemetry packet buffers in satellite command & data handling (C&DH) subsystems exposed to total ionizing dose (TID). IC Role / Device Role / Timing Role: Radiation-tolerant bus interface ensuring data integrity during orbital radiation events and thermal cycling. Use Value: Ceramic flatpack (CFP-24) construction provides low outgassing and TID resilience exceeding 100 krad(Si); qualified to MIL-PRF-38535 Class V. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 10-bit bus driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SNJ54ABT827JT | Ceramic DIP-24 package; identical electrical specs and military temp range. | Larger footprint, through-hole mounting; less suitable for high-density surface-mount assemblies. | Select JT for legacy board rework or prototyping where CFP tooling is unavailable. |
| SN74ABT827DBR | Commercial-grade (−40°C to 85°C); SSOP-24 package; RoHS-compliant NiPdAu finish. | Not qualified for military/aerospace use; higher thermal resistance (θJA = 104°C/W) than CFP. | Choose DBR only for cost-sensitive industrial control applications with benign thermal environments. |
Compared with SNJ54ABT827JT, SNJ54ABT827W offers identical performance but superior mechanical ruggedness and thermal cycling endurance in CFP packaging; versus SN74ABT827DBR, it trades commercial cost efficiency for full MIL-spec qualification, hermetic sealing, and extended temperature margin-critical for deployed defense systems.
Availability
SNJ54ABT827W is available at Aetrix Electronics and suitable for avionics data buses, military vehicle control backplanes, and space-qualified telemetry systems requiring stable component supply under extended lifecycle management.
Supply support for SNJ54ABT827W includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader with decades of heritage in high-reliability logic, analog, and embedded processing solutions.
The SNJ54ABT827W belongs to TI's military logic family designed specifically for defense, aerospace, and critical infrastructure applications demanding extended temperature operation, radiation tolerance, and long-term supply assurance.
FAQ
What is the absolute maximum supply voltage for SNJ54ABT827W?
The absolute maximum supply voltage for SNJ54ABT827W is −0.5 V to 7 V. Exceeding this range risks permanent damage per JESD78 guidelines. Recommended operation remains strictly within 4.5 V to 5.5 V to ensure parametric compliance across the full −55°C to 125°C range. The SNJ54ABT827W datasheet specifies this limit in Section 5 under Absolute Maximum Ratings.
Does SNJ54ABT827W support hot-swap or live-insertion?
SNJ54ABT827W does not include dedicated hot-swap circuitry, but its inherent high-impedance state during VCC < 2.1 V provides partial live-insertion tolerance. However, full hot-swap compliance requires external current-limiting and sequencing controls, as the SNJ54ABT827W lacks built-in slew-rate control or undervoltage lockout beyond the 2.1 V threshold.
How are the NC pins on SNJ54ABT827W handled in layout?
The NC pins on SNJ54ABT827W (pins 5, 7, 15, 16, 19, 20, 21, 22) have no internal connection and must remain unconnected in PCB layout. They serve mechanical support roles only. Routing traces or placing vias on these pads violates TI's mechanical specification and may compromise hermetic seal integrity in the CFP-24 package.
Is SNJ54ABT827W pin-compatible with SN74ABT827 variants?
Yes, SNJ54ABT827W shares identical pinout and logic function with SN74ABT827 variants (e.g., DB, DW, PW packages), including OE1/OE2 placement and A/Y channel mapping. However, differences in package type, thermal characteristics, and qualification level mean direct substitution requires validation of mechanical fit, thermal derating, and application-level environmental compliance.
What is the recommended pullup resistor value for OE pins on SNJ54ABT827W?
The minimum pullup resistor value for OE pins on SNJ54ABT827W depends on the current-sinking capability of the driving source. Per the datasheet, OE must be tied to VCC through a resistor to guarantee high-impedance above 2.1 V; typical values range from 1 kΩ to 10 kΩ, selected to ensure OE remains ≥2 V while accommodating worst-case driver sink current-verified using the SNJ54ABT827W's IOZH/IOZL specifications.
SNJ54ABT827W Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- *
- Package/Case:
- -
- Packaging:
- Tube
- Product Status:
- Active
- Logic Type:
- -
- Number of Elements:
- -
- Number of Bits per Element:
- -
- Input Type:
- -
- Output Type:
- -
- Current - Output High, Low:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
SNJ54ABT827W FAQ
1.How can I place an order for SNJ54ABT827W through Aetrix?
Please submit a Request for Quotation (RFQ) for SNJ54ABT827W on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SNJ54ABT827W reliable?
The price and inventory of SNJ54ABT827W are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SNJ54ABT827W is usually 5 days.
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SNJ54ABT827W orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SNJ54ABT827W order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SNJ54ABT827W?
For technical support, including SNJ54ABT827W datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SNJ54ABT827W requirements.
6.How does Aetrix verify that SNJ54ABT827W is sourced from the original manufacturer or authorized distributors?
All SNJ54ABT827W products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SNJ54ABT827W meets industry standards.
7.What is the process for return or replacement of SNJ54ABT827W?
All SNJ54ABT827W units undergo pre-shipment inspection (PSI). If there is an issue with SNJ54ABT827W, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SNJ54ABT827W part is unused and in its original packaging.
Return procedure for SNJ54ABT827W:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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