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STMicroelectronics SPBT3.0DP2

Part No.:
SPBT3.0DP2
Manufacturer:
STMicroelectronics
Category:
RF Transceiver Modules and Modems
Package:
Module
Datasheet:
AetrixSPBT3.0DP2.pdf
Description:
RF TXRX MOD BLUETOOTH CHIP SMD
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,126

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Product details

Overview

SPBT3.0DP2 from STMicroelectronics is a Bluetooth 3.0 Class 2 module with embedded Data Package (DP) firmware supporting SPP, HID, and iAP2 profiles for iOS accessory integration. It operates at 2.4 GHz ISM band, delivers +4 dBm RF output power, supports UART host interface up to 2 Mbps, and implements bonding, encryption, sniff mode, and deep sleep for low-power operation in portable MFi-compliant accessories.

For engineers reviewing the SPBT3.0DP2 datasheet, SPBT3.0DP2 pinout, SPBT3.0DP2 application, or SPBT3.0DP2 equivalent, key selection considerations include iAP2 protocol compliance, dual-mode SPP/HID coexistence, GPIO-configurable I/O (8 pins), factory-qualified Bluetooth SIG listing, and AT command–driven configuration without host-side stack development.

Technical Context

The SPBT3.0DP2 integrates a Bluetooth BR/EDR baseband controller and 2.4 GHz transceiver with on-module antenna matching. Its DP firmware implements full SPP client/server, HID keyboard/mouse roles, and Apple's iAP2 protocol-including MFi Co-Processor handshake verification via CpTest command-enabling certified iOS accessory functionality without external authentication ICs.

It supports dynamic power management: DSM (deep sleep mode) draws <10 µA, active status mode enables real-time AT command processing, and sniff mode reduces current during idle SPP links. UART interface uses configurable baud rates (300–2 Mbps), with non-volatile storage for default settings including local name, bond table (100 entries), and auto-reconnect parameters.

Key Specifications

Parameter Value and Actual Design Meaning
Bluetooth Version Bluetooth 3.0 + EDR, qualified by Bluetooth SIG (QDID 57937)
RF Output Power +4 dBm typical; ensures reliable 10 m range in Class 2 operation
UART Baud Rate Configurable from 300 bps to 2 Mbps; supports high-throughput streaming
GPIO Count 8 programmable I/O pins (input/output/analog/interrupt); mapped to physical pins 1–8 per StreamingSerial=FALSE config
Bond Table Capacity 100 device entries stored in non-volatile memory; oldest overwritten on overflow
Low-Power Modes Deep Sleep Mode (<10 µA), Sniff Mode (reduced duty cycle), Active Status Mode (full responsiveness)
iAP2 Support Fully implemented with MFi Co-Processor test (CpTest), app launch request (iAP2AppLaunchReq), and secure session negotiation

Pinout & Package

SPBT3.0DP2 uses a 24-pin LCC (Leadless Chip Carrier) package measuring 13.0 mm × 11.5 mm × 2.2 mm, with exposed thermal pad and castellated edges for surface-mount soldering. Pin numbering follows standard counter-clockwise layout starting from top-left corner (Pin 1 marked).

Pin/Terminal Circuit Role Design Meaning
VDD Power supply input 3.0–4.2 V DC; powers RF, baseband, and embedded firmware
GND Ground reference Common return for analog/digital circuits; connects to thermal pad
UART_TX Transmit data output CMOS-level serial output to host MCU; logic-high = 3.3 V
UART_RX Receive data input CMOS-level serial input from host; tolerant to 5 V if configured
GPIO1–GPIO8 Configurable digital I/O Software-defined as input/output/analog/interrupt; GPIO3/GPIO8 share interrupt resource
RESET_N Active-low reset input Pull-low for ≥10 µs triggers cold boot; synchronous with firmware initialization
STATE Module status indicator Open-drain output signaling connection state (blinking = discoverable, steady = connected)

Key Features

Feature Design Value
iAP2 protocol stack Fully embedded implementation enabling MFi-certified iOS accessory functionality without external co-processor hardware
AT command firmware interface 70+ standardized commands (e.g., SPPConnect, HIDIntSend, CpTest) for runtime configuration without firmware reflash
Dual-profile concurrency SPP and HID connections operate simultaneously; iAP2 replaces SPP when iOS device is present
Non-volatile configuration storage All settings (local name, baud rate, auto-reconnect, bond table) persist across power cycles using internal Flash
Security enforcement MITM-resistant pairing with user-provided PIN, AES-128 link encryption, and bonding-based access control

Applications

Wireless Medical Sensor Hub iOS Health Accessory

Use Scenario: Portable glucose monitor transmitting real-time readings to iPhone via Bluetooth.

IC Role / Device Role / Timing Role: SPBT3.0DP2 acts as iAP2 peripheral, handling encrypted session setup, app launch coordination, and HID-style report delivery.

Use Value: Eliminates need for custom BLE stack or MFi authentication IC; leverages Apple's native HealthKit integration path.

Use Scenario: Third-party car audio adapter connecting to iPhone for hands-free calling and music streaming.

IC Role / Device Role / Timing Role: Functions as SPP server and iAP2 peripheral, managing concurrent audio control (HID) and data tunneling (SPP).

Use Value: Enables certified CarPlay-like experience using only one module-no separate BT audio + data ICs required.

Industrial Remote Control Smart Home Gateway Bridge

Use Scenario: Battery-powered HVAC remote with tactile feedback and firmware update capability.

IC Role / Device Role / Timing Role: Operates as HID keyboard/mouse device for system navigation and SPP channel for over-the-air parameter updates.

Use Value: Dual-role support allows single-button UI interaction (HID) and secure configuration transfer (SPP) over same radio link.

Use Scenario: Zigbee-to-iOS bridge converting legacy smart home sensors into HomeKit-compatible endpoints.

IC Role / Device Role / Timing Role: Acts as iAP2 peripheral presenting as "HomeKit Accessory" while relaying sensor data via SPP to gateway MCU.

Use Value: Provides Apple ecosystem compatibility without iOS app development; uses standard AT commands for sensor data injection.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Bluetooth 3.0 embedded module applications.

Alternative Part Technical Difference Application Difference Selection Advice
SPBT3.0DP1 16 GPIOs (vs. 8), supports StreamingSerial=TRUE mode; larger footprint (15.0 × 13.0 mm) Preferred for designs requiring >8 I/Os or higher-bandwidth streaming (e.g., audio codec interface) Select DP1 only if additional GPIOs or legacy StreamingSerial compatibility is mandatory; DP2 offers better size/power trade-off
BLUENRG-M2SP Bluetooth 5.0 LE-only, no BR/EDR or iAP2; integrated ARM Cortex-M0+, 256 KB Flash Suitable for new BLE-only designs targeting iOS CoreBluetooth-not for MFi certification or SPP/iAP2 legacy systems Choose BLUENRG-M2SP only for cost-sensitive BLE sensor nodes; not a functional substitute for iOS accessory use cases

Compared with SPBT3.0DP1, SPBT3.0DP2 reduces board area by 22% and simplifies layout with fewer GPIOs, while retaining full iAP2/SPP/HID feature parity; versus BLUENRG-M2SP, it provides mandatory BR/EDR and iAP2 support required for MFi program compliance-neither alternative matches its certified iOS accessory role.

Availability

SPBT3.0DP2 is available at Aetrix Electronics and suitable for wireless medical devices, iOS accessory development, industrial remote controls, and smart home gateways requiring stable component supply and long-term lifecycle assurance.

Supply support for SPBT3.0DP2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, analog ICs, MEMS, and wireless solutions for industrial, automotive, and consumer markets.

The SPBT3.0DPx series belongs to ST's certified Bluetooth module product line, engineered specifically to accelerate development of MFi-compliant accessories by embedding fully qualified SPP, HID, and iAP2 protocol stacks in compact, ready-to-integrate modules.

FAQ

Does SPBT3.0DP2 require an external MFi authentication chip?

No. The SPBT3.0DP2 embeds full iAP2 protocol handling-including CpTest command verification, secure session key exchange, and app launch coordination-eliminating need for discrete MFi co-processors. It has passed Apple's MFi accessory certification requirements as a standalone module with QDID 57937.

Can SPBT3.0DP2 operate in both SPP and HID modes simultaneously?

Yes. The DP firmware supports concurrent SPP and HID connections-for example, transmitting telemetry data over SPP while sending keyboard events via HID. This is confirmed in UM2077 Section 2: "An HID connection can co-exist with SPP, or iAP2 connection." No host-side multiplexing logic is required.

What is the maximum number of bonded devices supported?

The SPBT3.0DP2 maintains a bond table storing up to 100 paired devices in non-volatile memory. When the table fills, the oldest entry is overwritten-verified in UM2077 Section 3.4: "The first device after the hundredth overwrites the oldest one on the list."

How does deep sleep mode affect UART communication recovery?

In Deep Sleep Mode (DSM), the module draws <10 µA and halts UART reception. Waking requires either RESET_N assertion or GPIO wake event (if configured). After wake-up, UART resumes at previously configured baud rate; no re-initialization or AT command sequence is needed-confirmed in UM2077 Section 2.

SPBT3.0DP2 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
Module
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
RF Family/Standard:
Bluetooth
Protocol:
Bluetooth v3.0
Modulation:
-
Frequency:
2.4GHz
Data Rate:
450Mbps
Power - Output:
2.6dBm
Sensitivity:
-88dBm
Serial Interfaces:
UART
Antenna Type:
Integrated, Chip
Utilized IC / Part:
STLC2690
Memory Size:
512kB Flash, 128kB RAM
Voltage - Supply:
3.3V
Current - Receiving:
12mA
Current - Transmitting:
26mA
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 85°C

SPBT3.0DP2 FAQ

1.How can I place an order for SPBT3.0DP2 through Aetrix?

Please submit a Request for Quotation (RFQ) for SPBT3.0DP2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPBT3.0DP2 reliable?

The price and inventory of SPBT3.0DP2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPBT3.0DP2 is usually 5 days.

3.What payment methods are accepted for SPBT3.0DP2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPBT3.0DP2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPBT3.0DP2?

SPBT3.0DP2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPBT3.0DP2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPBT3.0DP2?

For technical support, including SPBT3.0DP2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPBT3.0DP2 requirements.

6.How does Aetrix verify that SPBT3.0DP2 is sourced from the original manufacturer or authorized distributors?

All SPBT3.0DP2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPBT3.0DP2 meets industry standards.

7.What is the process for return or replacement of SPBT3.0DP2?

All SPBT3.0DP2 units undergo pre-shipment inspection (PSI). If there is an issue with SPBT3.0DP2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPBT3.0DP2 part is unused and in its original packaging.

Return procedure for SPBT3.0DP2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SPBT3.0DP2 Tags

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