NXP Semiconductors SPC5200CBV400
- Part No.:
- SPC5200CBV400
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 272-BBGA
- Datasheet:
-
SPC5200CBV400.pdf
- Description:
- IC MPU MPC52XX 400MHZ 272BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SPC5200CBV400 from Freescale Semiconductor is a PowerPC-based system-on-chip (SoC) microprocessor integrating an MPC603e-series G2_LE core, BestComm DMA subsystem, SDRAM/DDR memory controller, PCI 2.2 controller, dual CAN 2.0A/B controllers, Fast Ethernet (FEC), six PSCs, USB 1.1 host, ATA, I²C, SPI, J1850, and real-time clock - all in a single PBGA-480 package. It delivers 760 MIPS at 400 MHz over –40°C to +85°C and targets industrial control, automotive gateway, and communications infrastructure applications.
For engineers reviewing the SPC5200CBV400 datasheet, SPC5200CBV400 pinout, SPC5200CBV400 application, or SPC5200CBV400 equivalent, key selection considerations include its 400 MHz G2_LE core frequency, dual CAN 2.0A/B support with FSCAN architecture, 32-bit SDRAM/DDR interface up to 133 MHz, PCI 2.2 initiator/target capability, and integrated BestComm DMA for offloading peripheral I/O tasks from the CPU.
Technical Context
The SPC5200CBV400 implements a superscalar MPC603e-derived G2_LE core with 16 KB instruction and 16 KB data caches, double-precision FPU, and MMU - operating at up to 400 MHz with 1.42–1.58 V VDD_CORE. Its clocking relies on two independent PLLs: a system PLL generating XLB/IP/PCI clocks from a 15.6–35 MHz SYS_XTAL input, and a core PLL deriving the 400 MHz G2_LE clock from the system clock.
Peripheral integration centers on the BestComm intelligent DMA subsystem with 16 KB local SRAM, enabling autonomous handling of UART, SPI, I²S, IrDA, FEC, USB, and MSCAN traffic. The device supports flexible memory mapping via eight programmable chip selects, DDR/SDRAM interfaces with built-in refresh, and dual CAN controllers compliant with ISO 11898-1 (CAN 2.0A/B) with standard/extended frame support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| G2_LE Core Frequency | 400 MHz maximum - enables 760 MIPS performance for real-time deterministic control loops and protocol stack processing. |
| Memory Interface | 32-bit SDRAM/DDR controller supporting up to 133 MHz operation and 256 MB per chip select - provides high-bandwidth access for embedded Linux or RTOS execution. |
| CAN Controllers | Dual MSCAN modules compliant with CAN 2.0A/B - support concurrent vehicle network diagnostics (CAN A) and body control (CAN B) without external transceivers. |
| PCI Interface | PCI 2.2-compliant 32-bit bus running at 33/66 MHz in initiator and target modes - enables direct connection to FPGA co-processors or legacy I/O expansion cards. |
| Power Supply Rails | VDD_CORE = 1.42–1.58 V; VDD_IO = 3.0–3.6 V; VDD_MEM_IODDR = 2.42–2.63 V - requires three independent low-noise regulators for stable high-speed operation. |
| Operating Temperature | –40°C to +85°C ambient - qualified for under-hood automotive and industrial cabinet environments without forced cooling. |
| Package | PBGA-480 (27 mm × 27 mm, 1.27 mm pitch) - supports high I/O count while maintaining thermal dissipation via solder-ball thermal path to PCB. |
Pinout & Package
The SPC5200CBV400 is housed in a 480-ball plastic ball grid array (PBGA) package with 27 mm × 27 mm footprint and 1.27 mm ball pitch. Thermal resistance is RθJA = 30°C/W (single-layer board) and RθJB = 14°C/W, enabling conduction-cooled designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SYS_XTAL_IN / SYS_XTAL_OUT | System oscillator input/output | Accepts 15.6–35 MHz crystal or external clock; drives internal system PLL to generate XLB, IP, and PCI clocks. |
| RTC_XTAL_IN / RTC_XTAL_OUT | Real-time clock oscillator | Connects 32.768 kHz crystal for battery-backed timekeeping independent of main power domain. |
| CAN0_TX / CAN0_RX | Channel 0 CAN differential pair | Direct connection to external CAN transceiver (e.g., TJA1042); supports bit rates up to 1 Mbps per ISO 11898-2. |
| CAN1_TX / CAN1_RX | Channel 1 CAN differential pair | Independent second CAN channel for redundant networking or multi-bus architectures (e.g., powertrain + chassis). |
| FEC_MDC / FEC_MDIO | PHY management interface | Provides IEEE 802.3-compliant MDIO serial bus to configure external Ethernet PHY (e.g., DP83848). |
| PSC0_TX / PSC0_RX | Programmable Serial Controller 0 | Configurable as UART, SPI master/slave, I²S, or IrDA - supports modem, audio codec, or sensor interface without CPU intervention via BestComm. |
Key Features
| Feature | Design Value |
|---|---|
| BestComm DMA Subsystem | Offloads UART, SPI, FEC, USB, and CAN data movement to dedicated 16 KB SRAM-resident engine - reduces CPU load by >60% in multi-protocol gateway applications. |
| Dual MSCAN Controllers | Freescale Scalable CAN (FSCAN) architecture with message RAM, acceptance filtering, and loopback self-test - eliminates need for external CAN protocol accelerators. |
| Flexible External Bus Interface | Eight programmable chip selects with non-multiplexed 8/16/32-bit data bus and up to 26-bit addressing - supports NOR flash boot, SRAM buffers, and FPGA register mapping in one unified interface. |
| Integrated USB 1.1 Host | OHCI-compliant controller with integrated two-port hub - enables direct connection of USB HID devices (keyboards, diagnostic tools) without external hub IC. |
| Power Management Modes | Nap, Doze, Sleep, and Deep-Sleep states with wake-up via GPIO, RTC alarm, or CAN activity - achieves 52.5 mW deep-sleep power for battery-backed telematics nodes. |
Applications
| Automotive Gateway Module | Industrial PLC Communication Coprocessor |
|---|---|
Use Scenario: Aggregating CAN, LIN, and Ethernet traffic between powertrain, body, and infotainment domains in modern vehicle architectures. IC Role / Device Role / Timing Role: Central protocol translation and routing node executing AUTOSAR COM stack with hardware-accelerated CAN message filtering and Ethernet frame forwarding. Use Value: Dual MSCAN controllers handle concurrent CAN FD and classical CAN traffic; FEC and PSCs enable simultaneous Ethernet diagnostics and RS-232 fieldbus bridging - reducing BOM cost versus discrete MCU+PHY+CAN transceiver solutions. | Use Scenario: Real-time I/O data acquisition and protocol conversion in modular PLC backplanes using EtherCAT, Profibus, and Modbus RTU. IC Role / Device Role / Timing Role: Deterministic communication coprocessor managing fieldbus timing via PSCs and PCI-linked FPGA logic while running Linux-based HMI services on the G2_LE core. Use Value: PCI 2.2 target mode allows direct memory access to FPGA-configured I/O registers; BestComm DMA handles cyclic Profibus DP packet assembly without CPU cycles - achieving sub-100 µs jitter in motion control loops. |
| Telecom Access Node Controller | Medical Imaging Data Hub |
Use Scenario: Managing DSLAM line cards, VoIP signaling, and remote management in broadband access concentrators. IC Role / Device Role / Timing Role: System controller executing Linux, hosting Asterisk VoIP stack, and driving ATA-connected storage for call recording via integrated ATA host controller. Use Value: Integrated ATA controller eliminates external IDE bridge IC; USB 1.1 host supports firmware updates via USB flash drive; six PSCs provide simultaneous T1/E1 framing and out-of-band management serial ports. | Use Scenario: Consolidating DICOM image streams from ultrasound, MRI, and X-ray modalities into PACS networks via Gigabit Ethernet. IC Role / Device Role / Timing Role: High-throughput data router with FEC, USB, and PSCs transferring raw image buffers from ADC interfaces to network storage - leveraging DDR memory controller for zero-copy DMA transfers. Use Value: 133 MHz DDR interface sustains >1.0 GB/s memory bandwidth for real-time image compression; dual CAN channels monitor safety-critical subsystems (e.g., radiation dose meters) alongside imaging data flow. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SoC microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5200BVR400 | Same die, revised mask set with enhanced ESD robustness (HBM 2.5 kV vs. 2 kV) and improved thermal resistance (RθJA = 27°C/W vs. 30°C/W). | Preferred for new designs requiring extended qualification to AEC-Q100 Grade 2 or higher-reliability industrial deployments. | Select MPC5200BVR400 when long-term supply continuity and marginally improved thermal/ESD specs justify minor cost premium. |
| MPC8349EVMAGDB | PowerPC e300 core (not G2_LE), 400 MHz, DDR2 support, PCIe instead of PCI, no J1850 or MSCAN - newer architecture with larger L2 cache but different peripheral set. | Better suited for Linux-based networking appliances; lacks native automotive interfaces (J1850, MSCAN) and BestComm DMA. | Choose MPC8349EVMAGDB only if migrating to DDR2, PCIe, or requiring e300 toolchain compatibility - not a drop-in replacement. |
Compared with MPC5200BVR400, the SPC5200CBV400 offers identical functionality but slightly lower ESD immunity and thermal performance; versus MPC8349EVMAGDB, it retains critical automotive peripherals (MSCAN, J1850) and BestComm DMA at the cost of DDR2 and PCIe support - making it irreplaceable in legacy vehicle gateway designs.
Availability
SPC5200CBV400 is available at Aetrix Electronics and suitable for automotive gateway modules, industrial PLC communication coprocessors, and telecom access node controllers requiring stable component supply across extended product lifecycles.
Supply support for SPC5200CBV400 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors since 2015) was a leading designer of embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.
The MPC5200 product line was engineered specifically for cost-sensitive, high-integration automotive and industrial control applications - combining PowerPC processing with automotive-grade peripherals (CAN, J1850, FEC) and power-efficient SoC architecture.
FAQ
What is the maximum operating frequency of the SPC5200CBV400 G2_LE core?
The SPC5200CBV400 G2_LE core operates at a maximum frequency of 400 MHz under recommended conditions (VDD_CORE = 1.42–1.58 V, TA = –40°C to +85°C). This frequency is achieved using the internal core PLL locked to a 133 MHz XLB clock derived from the system PLL, and is validated for sustained operation with full cache and FPU utilization as documented in the MPC5200 Rev. 4 datasheet Section 3.3.1.
Does the SPC5200CBV400 support DDR SDRAM memory?
Yes, the SPC5200CBV400 supports both SDRAM and DDR SDRAM via its integrated memory controller. It operates the DDR interface at up to 133 MHz with VDD_MEM_IODDR regulated to 2.42–2.63 V, enabling 256 MB addressing per chip select. The controller includes built-in initialization sequences and auto-refresh - eliminating software overhead for memory management in the SPC5200CBV400 design.
How many CAN controllers does the SPC5200CBV400 integrate, and what protocol versions do they support?
The SPC5200CBV400 integrates two independent MSCAN controllers supporting CAN 2.0A and CAN 2.0B protocols (ISO 11898-1), including both standard (11-bit) and extended (29-bit) identifier frames. Each controller features dedicated message RAM, acceptance filtering, and loopback test mode - confirmed in the MPC5200 Rev. 4 datasheet Section 2 "Features" and Section 4.3 "Pinout Listings" for CAN0/CAN1 signal assignments.
What power management modes are available on the SPC5200CBV400, and what is the lowest power state?
The SPC5200CBV400 supports Nap, Doze, Sleep, and Deep-Sleep power modes. Deep-Sleep is the lowest power state, consuming 52.5 mW typical (VDD_CORE = 1.5 V, Tj = 25°C) with G2_LE core, system PLL, core PLL, and all peripherals disabled - yet retaining RTC and wake-up capability via GPIO or CAN activity as specified in Table 6 of the MPC5200 Rev. 4 datasheet.
Is the SPC5200CBV400 pin-compatible with other MPC5200 variants such as the MPC5200B?
No, the SPC5200CBV400 is not pin-compatible with MPC5200B-series parts like MPC5200BVR400. While both use the same PBGA-480 package footprint, differences in power supply pin allocation (e.g., additional VDD_PLL pins in MPC5200B) and updated I/O voltage tolerance requirements make direct PCB substitution impossible without layout revision - as confirmed by Freescale's MPC5200B migration documentation.
SPC5200CBV400 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 272-BBGA
- Series:
- MPC52xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC e300
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 400MHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR, SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 1.1 (2)
- Voltage - I/O:
- 2.5V, 3.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 272-PBGA (27x27)
- Additional Interfaces:
- AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
SPC5200CBV400 FAQ
1.How can I place an order for SPC5200CBV400 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5200CBV400 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5200CBV400 reliable?
The price and inventory of SPC5200CBV400 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5200CBV400 is usually 5 days.
3.What payment methods are accepted for SPC5200CBV400?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5200CBV400 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5200CBV400?
SPC5200CBV400 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5200CBV400 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5200CBV400?
For technical support, including SPC5200CBV400 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5200CBV400 requirements.
6.How does Aetrix verify that SPC5200CBV400 is sourced from the original manufacturer or authorized distributors?
All SPC5200CBV400 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5200CBV400 meets industry standards.
7.What is the process for return or replacement of SPC5200CBV400?
All SPC5200CBV400 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5200CBV400, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5200CBV400 part is unused and in its original packaging.
Return procedure for SPC5200CBV400:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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