NXP Semiconductors SPC5200CVR400BR2
- Part No.:
- SPC5200CVR400BR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 272-BBGA
- Datasheet:
-
SPC5200CVR400BR2.pdf
- Description:
- IC MPU MPC52XX 400MHZ 272BGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,573
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5200CVR400BR2 from Freescale Semiconductor is a high-integration PowerPC-based system-on-chip (SoC) microcontroller featuring the MPC603e-series e300 core, 400 MHz operation, dual CAN 2.0A/B controllers, Fast Ethernet (10/100 Mbps), PCI 2.2 interface, and integrated SDRAM/DDR memory controller - deployed in automotive infotainment gateways and industrial control units requiring deterministic real-time I/O and multi-protocol connectivity.
For engineers reviewing the SPC5200CVR400BR2 datasheet, SPC5200CVR400BR2 pinout, SPC5200CVR400BR2 application, or SPC5200CVR400BR2 equivalent, key selection criteria include its TEPBGA–272 package, –40 °C to +85 °C industrial temperature grade, 1.42–1.58 V core supply, 400 MHz e300 core performance, and native J1850 BDLC support for legacy automotive diagnostics.
Technical Context
The SPC5200CVR400BR2 implements a superscalar e300 core with double-precision FPU, instruction/data MMU, and 16 KB each of L1 instruction and data cache. Its clock architecture uses two independent PLLs: a system PLL generating up to 533 MHz VCO output and an e300 core PLL supporting up to 550 MHz core frequency - both configurable via on-chip registers and synchronized to a 15.6–35 MHz external SYS_XTAL input.
Peripheral integration includes a BestComm DMA subsystem with 16 KB local SRAM, six programmable serial controllers (PSCs) supporting UART, SPI, I²S, AC97, and IrDA modes, and dual MSCAN controllers compliant with ISO 11898-1 (CAN 2.0A/B). The device supports SDRAM and DDR SDRAM at up to 133 MHz with built-in initialization and refresh logic, and features a flexible External Bus Interface with eight chip selects and multiplexed/non-multiplexed 8-/16-/32-bit data access.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| e300 Core Frequency | 400 MHz maximum at –40 °C to +85 °C - enables 760 MIPS sustained throughput for real-time control and protocol stack execution. |
| Core Supply Voltage | 1.42–1.58 V - requires tight regulation; impacts thermal budget and core power dissipation (typ. 727.5 mW operational). |
| Memory Interface | SDRAM/DDR support up to 133 MHz with 32-bit bus and 256 MB per chip select - enables direct connection to commodity low-cost DRAM without external glue logic. |
| PCI Interface | PCI 2.2-compliant, 32-bit/33 or 66 MHz initiator/target - allows host-bridge or peripheral expansion in industrial backplane designs. |
| CAN Controllers | Dual MSCAN modules compliant with ISO 11898-1, supporting standard/extended frames - provides redundant or multi-bus automotive network connectivity. |
| J1850 BDLC | J1850 Byte Data Link Controller supporting Class B networks at ≤125 kbps and 41.6 kbps 4X mode - meets legacy OBD-II diagnostic requirements in North American vehicles. |
| Package | TEPBGA–272, 27 mm × 27 mm - surface-mount land grid array with 272 solder balls, optimized for thermal dissipation in convection-cooled enclosures. |
Pinout & Package
SPC5200CVR400BR2 is housed in a 272-ball Thin Enhanced Plastic Ball Grid Array (TEPBGA) package measuring 27 mm × 27 mm with 1.0 mm ball pitch. Thermal resistance is RθJA = 30 °C/W (single-layer board) and RθJB = 14 °C/W, enabling operation up to +85 °C ambient with appropriate PCB copper pour and airflow.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SYS_XTAL_IN | System oscillator input | Accepts 15.6–35 MHz crystal or clock source; drives system PLL with ≤150 ps jitter tolerance. |
| RTC_XTAL_IN | Real-time clock oscillator input | 32.768 kHz crystal input for autonomous RTC operation during deep-sleep modes. |
| VDD_CORE | e300 core and peripheral logic supply | 1.42–1.58 V regulated supply; decoupling required per Freescale layout guidelines to maintain signal integrity. |
| VDD_IO | Standard I/O buffer supply | 3.0–3.6 V supply for GPIO, PSC, I²C, SPI, and USB PHY I/O; supports TTL/Schmitt input thresholds. |
| VDD_MEM_IO | Memory I/O buffer supply | 3.0–3.6 V for SDRAM; 2.42–2.63 V for DDR - mandates separate rail design to meet JEDEC timing margins. |
| HRESET | Hardware reset input | Asynchronous active-low Schmitt-trigger input; minimum 4-cycle pulse width referenced to SYS_XTAL_IN. |
| PORRESET | Power-on reset input | Monitored by internal power-on circuitry; asserts reset until VDD stabilization, oscillator startup, and PLL lock complete. |
| JTAG_TCK | JTAG test clock | IEEE 1149.1 boundary-scan clock input; supports debug, programming, and production test at up to 10 MHz. |
Key Features
| Feature | Design Value |
|---|---|
| BestComm DMA Subsystem | Offloads CPU from peripheral data movement using dedicated channels and 16 KB local SRAM - reduces interrupt latency and improves determinism in Ethernet/CAN streaming applications. |
| Flexible External Bus Interface | Eight programmable chip selects with burst/non-burst, multiplexed/non-multiplexed modes - enables seamless interfacing to NOR flash, NAND controllers, FPGA co-processors, or legacy parallel peripherals. |
| Power Management Modes | Nap, Doze, Sleep, and Deep-Sleep states with wake-up from GPIO, RTC, or CAN - achieves 52.5 mW deep-sleep power for battery-backed automotive modules. |
| Integrated USB Host | OHCI-compliant USB 1.1 host controller with integrated 2-port hub - supports plug-and-play diagnostics tools and firmware update dongles without external hub ICs. |
| Real-Time Clock | One-second resolution RTC with battery-backup capability and alarm interrupt - maintains time-of-day across power cycles in telematics and event-logging systems. |
Applications
| Automotive Diagnostic Gateway | Industrial PLC Communication Module |
|---|---|
Use Scenario: Aggregates data from multiple vehicle ECUs via CAN and J1850, translates protocols, and forwards to USB-connected service tools. IC Role / Device Role / Timing Role: Central protocol translation and bridging SoC with deterministic interrupt response and dual-CAN arbitration. Use Value: Eliminates need for discrete CAN transceivers, USB PHY, and protocol translation FPGA - reduces BOM count and board area by >35%. | Use Scenario: Connects legacy RS-232/RS-485 fieldbus devices to modern EtherNet/IP or Modbus TCP networks in factory automation. IC Role / Device Role / Timing Role: Real-time protocol gateway with hardware-accelerated serial framing and Ethernet packet assembly. Use Value: Achieves sub-10 ms end-to-end latency for motion control feedback loops using BestComm DMA and PSC hardware framing. |
| Telematics Control Unit (TCU) | Medical Imaging Subsystem Controller |
Use Scenario: Manages GPS, cellular modem, and vehicle sensor interfaces while running Linux-based middleware for over-the-air updates and remote diagnostics. IC Role / Device Role / Timing Role: Application processor with integrated Ethernet, USB, and PCI - hosts OS kernel and handles secure boot, crypto acceleration, and watchdog supervision. Use Value: Enables single-chip TCU design with 400 MHz compute headroom for TLS 1.2 handshake offload and firmware signature verification. | Use Scenario: Controls X-ray detector readout, image buffering, and DICOM export in portable ultrasound and digital radiography equipment. IC Role / Device Role / Timing Role: High-reliability imaging controller with SDRAM/DDR bandwidth for frame buffering and PCI interface to FPGA-based acquisition logic. Use Value: Supports 1280×1024@30 fps raw image streaming via DDR interface while maintaining <1 µs jitter on trigger outputs for precise exposure timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar embedded SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5200BVR400B | Same die, identical electrical specs and pinout; differs only in marking and tape-and-reel packaging - RoHS-compliant variant with lead-free finish. | No functional difference; suitable for same automotive and industrial applications requiring –40 °C to +85 °C operation. | Select MPC5200BVR400B when lead-free compliance and JEDEC-standard packaging are required for automated SMT assembly. |
| MPC5121E | Successor SoC with e300 core at 400 MHz, but adds DDR2, PCIe, and enhanced security engine; larger 456-ball PBGA package and different pin assignment. | Supports next-gen infotainment with HDMI audio/video processing and secure boot - not drop-in compatible due to pinout and power sequencing changes. | Choose MPC5121E for new designs needing higher memory bandwidth and cryptographic acceleration; avoid for direct replacement of SPC5200CVR400BR2. |
Compared with MPC5200BVR400B, SPC5200CVR400BR2 offers identical functionality in a legacy-marked package, while MPC5121E delivers architectural upgrades at the cost of PCB redesign - making SPC5200CVR400BR2 optimal for sustaining production of field-deployed automotive gateways.
Availability
SPC5200CVR400BR2 is available at Aetrix Electronics and suitable for automotive diagnostic gateways, industrial PLC communication modules, and telematics control units requiring stable component supply across extended product lifecycles.
Supply support for SPC5200CVR400BR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.
The MPC5200 family was designed as a highly integrated PowerPC-based SoC platform targeting cost-sensitive, real-time automotive and industrial control applications - emphasizing multi-protocol I/O, deterministic interrupt handling, and long-term supply stability.
FAQ
What is the maximum operating temperature range for the SPC5200CVR400BR2?
The SPC5200CVR400BR2 is rated for industrial operation from –40 °C to +85 °C ambient temperature. This range is validated under recommended operating conditions including VDD_CORE = 1.42–1.58 V and proper thermal management per Freescale's TEPBGA thermal resistance data (RθJA = 30 °C/W on single-layer board). Junction temperature must not exceed +115 °C.
Does the SPC5200CVR400BR2 support DDR SDRAM memory?
Yes, the SPC5200CVR400BR2 supports both SDRAM and DDR SDRAM memory interfaces up to 133 MHz with a 32-bit data bus and 256 MB addressing per chip select. DDR operation requires VDD_MEM_IO = 2.42–2.63 V and adherence to DDR timing parameters specified in Section 1.3.6 of the MPC5200B datasheet.
What debug interfaces does the SPC5200CVR400BR2 provide?
The SPC5200CVR400BR2 provides IEEE 1149.1 JTAG test access port and Common On-chip Processor (COP) debug port for boundary-scan testing, flash programming, and real-time debugging. Both interfaces operate independently of CPU state and support full visibility into register contents, memory, and peripheral configuration during development and field service.
Can the SPC5200CVR400BR2 operate without an external crystal?
No - the SPC5200CVR400BR2 requires an external 15.6–35 MHz clock source on SYS_XTAL_IN to drive its system PLL. While it includes internal oscillator circuitry for crystal-based configurations, it lacks an integrated RC oscillator and cannot generate its primary clock autonomously. RTC operation additionally requires a 32.768 kHz crystal on RTC_XTAL_IN.
What power management modes are supported by the SPC5200CVR400BR2?
The SPC5200CVR400BR2 supports Nap, Doze, Sleep, and Deep-Sleep modes. Deep-Sleep draws only 52.5 mW (typical) with e300 core, PLLs, and all peripherals disabled - wake-up is possible via GPIO, RTC alarm, or CAN message reception. Mode entry and exit are controlled via SIU registers and require no external hardware sequencing.
SPC5200CVR400BR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 272-BBGA
- Series:
- MPC52xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Last Time Buy
- Core Processor:
- PowerPC G2_LE
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 400MHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR, SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 1.1 (2)
- Voltage - I/O:
- 2.5V, 3.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 272-PBGA (27x27)
- Additional Interfaces:
- AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
SPC5200CVR400BR2 FAQ
1.How can I place an order for SPC5200CVR400BR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5200CVR400BR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5200CVR400BR2 reliable?
The price and inventory of SPC5200CVR400BR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5200CVR400BR2 is usually 5 days.
3.What payment methods are accepted for SPC5200CVR400BR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5200CVR400BR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5200CVR400BR2?
SPC5200CVR400BR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5200CVR400BR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5200CVR400BR2?
For technical support, including SPC5200CVR400BR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5200CVR400BR2 requirements.
6.How does Aetrix verify that SPC5200CVR400BR2 is sourced from the original manufacturer or authorized distributors?
All SPC5200CVR400BR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5200CVR400BR2 meets industry standards.
7.What is the process for return or replacement of SPC5200CVR400BR2?
All SPC5200CVR400BR2 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5200CVR400BR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5200CVR400BR2 part is unused and in its original packaging.
Return procedure for SPC5200CVR400BR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5200CVR400BR2 Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

