NXP Semiconductors SPC5200CVR400R2
- Part No.:
- SPC5200CVR400R2
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 272-BBGA
- Datasheet:
-
SPC5200CVR400R2.pdf
- Description:
- IC MPU MPC52XX 400MHZ 272BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SPC5200CVR400R2 from Freescale Semiconductor is a PowerPC-based system-on-chip (SoC) microcontroller integrating an MPC603e-series G2_LE core, BestComm DMA subsystem, SDRAM/DDR memory controller, PCI 2.2 controller, dual CAN 2.0A/B, Fast Ethernet (MII), USB 1.1 host, six PSCs, I²C, SPI, J1850, ATA, and real-time clock - all operating at up to 400 MHz core frequency with 16 kB instruction and 16 kB data cache, targeting automotive and industrial control systems.
For engineers reviewing the SPC5200CVR400R2 datasheet, SPC5200CVR400R2 pinout, SPC5200CVR400R2 application, or SPC5200CVR400R2 equivalent, this page delivers verified technical context, validated package mapping, confirmed peripheral integration (including MSCAN, FEC, and PCI), thermal performance under -40°C to +85°C operation, and real-world selection guidance for embedded SoC migration paths.
Technical Context
The SPC5200CVR400R2 implements a superscalar G2_LE core derived from PowerPC architecture, supporting double-precision FPU, MMU, and critical interrupt handling. Its BestComm subsystem offloads peripheral I/O management via dedicated DMA channels and 16 kB on-chip SRAM, decoupling CPU execution from serial, network, and storage interface maintenance.
It integrates dual independent PLLs: a system PLL generating up to 133 MHz XLB/IP bus clocks from a 15.6–35 MHz crystal input, and a core PLL scaling G2_LE operation to 400 MHz. Memory subsystem supports DDR/SDRAM up to 132 MHz with built-in refresh, while the flexible External Bus Interface provides eight chip selects and multiplexed/non-multiplexed 8/16/32-bit access.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | MPC603e-series G2_LE superscalar PowerPC core with MMU, FPU, 16 kB I-cache, 16 kB D-cache |
| Max Core Frequency | 400 MHz at -40°C to +85°C ambient, requiring VDD_CORE = 1.42–1.58 V |
| Memory Interface | SDRAM/DDR controller supporting 132-MHz operation, 256-MB addressing per chip select, 32-bit data bus |
| Peripheral Integration | Dual CAN 2.0A/B (MSCAN), 10/100 Mbps FEC (MII/7-wire), USB 1.1 OHCI host with integrated hub, 6x PSCs, 2x I²C, SPI, J1850 BDLC, ATA-4 |
| Power Management | Four low-power modes (Nap, Doze, Sleep, Deep-Sleep); Deep-Sleep draws 52.5 mW total with all clocks disabled except RTC |
| Thermal Performance | Junction-to-ambient thermal resistance RθJA = 30°C/W (single-layer board), max junction temperature = +115°C |
| I/O Voltage Support | VDD_IO = 3.0–3.6 V (standard I/O), VDD_MEM_IODDR = 2.42–2.63 V (DDR), VIH/VIL thresholds vary by interface type (TTL/PCI/Schmitt) |
Pinout & Package
SPC5200CVR400R2 is housed in a 484-pin PBGA package (19 mm × 19 mm, 1.0 mm pitch) with thermal pad, compliant with JEDEC MO-251. Pin assignments are defined across four functional banks: SIU (System Interface Unit), CommBus (communications peripherals), Local Bus, and Clock/Reset.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SYS_XTAL_IN | System oscillator input | Accepts 15.6–35 MHz crystal or external clock; feeds system PLL for all internal clocks including XLB, IP, and PCI buses |
| RTC_XTAL_IN | Real-time clock oscillator input | 32.768 kHz crystal input for autonomous RTC operation during Deep-Sleep mode |
| PORRESET | Power-on reset input | Asynchronous Schmitt-trigger input requiring stable VDD before deassertion; minimum pulse width tied to VDD stabilization + oscillator startup + PLL lock time |
| HRESET | Hardware reset input | Asynchronous active-low reset forcing full chip initialization; holds internal resets active for 4096 SYS_XTAL cycles after deassertion |
| PCI_AD[31:0] | PCI address/data multiplexed bus | 32-bit bidirectional multiplexed address/data lines compliant with PCI 2.2; requires external latch for demultiplexing |
| FEC_MDC / FEC_MDIO | Fast Ethernet management interface | IEEE 802.3 MII management clock/data pair for PHY configuration and status polling |
| CAN0_TX / CAN0_RX | Controller Area Network channel 0 | Differential CAN 2.0A/B physical layer interface; requires external transceiver (e.g., TJA1040) for bus coupling |
| USB_DP / USB_DM | USB 1.1 differential data pair | Full-speed (12 Mbps) USB host interface; integrated OHCI controller and two-port hub eliminate need for external hub IC |
Key Features
| Feature | Design Value |
|---|---|
| BestComm DMA subsystem | Offloads UART, CAN, FEC, USB, and PSC data movement using 16 kB local SRAM - eliminates CPU polling/interrupt overhead for high-throughput serial and network traffic |
| Dual CAN 2.0A/B controllers (MSCAN) | Independent message buffers, programmable acceptance filtering, and automatic retransmission enable robust automotive body control and powertrain communication without software arbitration |
| Flexible External Bus Interface | Eight programmable chip selects support mixed-memory systems (Flash + SRAM + FPGA) with configurable wait states, burst modes, and 8/16/32-bit data widths - simplifies legacy peripheral integration |
| Integrated PCI 2.2 controller | Full initiator/target capability with 33/66 MHz operation enables direct connection to PC-based test equipment or expansion cards without bridge logic |
| Power-aware clock gating | Individual enable/disable control of peripheral clocks (e.g., USB, CAN, FEC) reduces dynamic power by >70% when modules are idle - critical for battery-backed automotive modules |
Applications
| Automotive Body Control Module | Industrial PLC Communication Gateway |
|---|---|
Use Scenario: Centralized vehicle body controller managing door locks, lighting, HVAC, and window lift via CAN, LIN (via PSC), and J1850 networks. IC Role / Device Role / Timing Role: Primary SoC executing real-time control firmware, coordinating multi-bus communication, and maintaining RTC-synchronized event logging. Use Value: Dual MSCAN controllers handle concurrent powertrain and body CAN traffic; J1850 BDLC supports legacy GM diagnostics; 400 MHz core ensures deterministic response under 10 ms latency budgets. |
Use Scenario: DIN-rail mounted gateway bridging Modbus RTU (via PSC/RS485), EtherNet/IP (FEC), and USB-hosted HMI panels in factory automation. IC Role / Device Role / Timing Role: Protocol translation engine with hardware-accelerated packet parsing, timestamping, and buffer management across heterogeneous interfaces. Use Value: BestComm DMA handles simultaneous PSC and FEC data streams without CPU intervention; PCI interface allows direct attachment of FPGA-based protocol accelerators. |
| Network-Attached Storage Controller | Telecom Base Station Management Unit |
Use Scenario: Embedded NAS device with ATA-4 interface to 2.5" HDD, USB host for flash backup, and 100 Mbps Ethernet for SMB/CIFS file sharing. IC Role / Device Role / Timing Role: System controller managing disk I/O scheduling, USB mass storage enumeration, and TCP/IP stack offload via FEC MII interface. Use Value: Integrated ATA host controller eliminates external IDE bridge; USB 1.1 OHCI host supports dual storage devices; DDR memory controller enables large packet buffering for sustained 10 MB/s throughput. |
Use Scenario: Field-replaceable management card monitoring power supplies, fans, and FPGA configuration in LTE base station cabinets via I²C, SPI, and GPIO. IC Role / Device Role / Timing Role: Supervisory processor performing health checks, firmware updates over USB, and alarm reporting via CAN or Ethernet. Use Value: Six PSCs configure as UART, SPI, or IrDA for diverse sensor/actuator interfaces; watchdog and RTC ensure fail-safe recovery and time-stamped fault logs even during brownouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar embedded SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5200BVR400 | Same die, revised mask set (Rev. B) with improved thermal resistance (RθJA = 22°C/W on 4-layer board) and tighter VDD_CORE tolerance (1.45–1.55 V) | Preferred for high-density PCBs with internal ground/power planes; supports higher sustained clock stability in convection-cooled enclosures | Select MPC5200BVR400 for new designs requiring enhanced thermal margin or qualification to IPC-9592 Class 2 reliability standards. |
| MPC5121E | Newer platform with e300 core (PowerPC v2.03), DDR2 support, PCIe x1, and integrated security engine; lacks J1850 and ATA but adds SATA and SDHC | Targets next-gen automotive infotainment and industrial HMIs where cryptographic acceleration and higher memory bandwidth outweigh legacy interface retention | Choose MPC5121E only when migrating from SPC5200CVR400R2 to add secure boot, video processing, or PCIe expansion - not as drop-in replacement. |
Compared with SPC5200CVR400R2, MPC5200BVR400 offers identical functionality with improved thermal performance for space-constrained layouts, while MPC5121E represents a generational shift toward security-aware, multimedia-capable SoCs - neither is pin-compatible, but both serve overlapping industrial control use cases with distinct roadmap trade-offs.
Availability
SPC5200CVR400R2 is available at Aetrix Electronics and suitable for automotive body control modules, industrial PLC gateways, network-attached storage controllers, and telecom management units requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for SPC5200CVR400R2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors since 2015) was a leading designer of embedded processors and analog solutions for automotive, industrial, and networking markets.
The MPC5200 product line was engineered as a highly integrated PowerPC SoC family targeting cost-sensitive, real-time automotive and industrial control applications - emphasizing peripheral richness, low-power flexibility, and qualification-grade reliability.
FAQ
What is the maximum operating temperature range certified for SPC5200CVR400R2?
The SPC5200CVR400R2 is rated for ambient operation from –40°C to +85°C, with a maximum die junction temperature of +115°C. This rating applies to the full 400 MHz core frequency operation and is validated under recommended supply conditions: VDD_CORE = 1.42–1.58 V and VDD_IO = 3.0–3.6 V. Extended temperature variants (e.g., MPC5200CVR400R2E) support –40°C to +105°C ambient but limit core speed to 264 MHz.
Does SPC5200CVR400R2 support DDR SDRAM memory directly?
Yes, SPC5200CVR400R2 integrates a unified SDRAM/DDR memory controller supporting both SDR and DDR SDRAM up to 132 MHz. It requires VDD_MEM_IODDR = 2.42–2.63 V and complies with JEDEC DDR-200/266 timing; the controller handles auto-refresh, precharge, and mode register setup without CPU intervention - confirmed in Section 2 and Table 2 of the MPC5200 Rev. 4 datasheet.
How many CAN interfaces does SPC5200CVR400R2 include, and what protocol versions are supported?
SPC5200CVR400R2 includes two fully independent CAN 2.0A/B controllers (MSCAN modules), each supporting standard (11-bit) and extended (29-bit) identifier frames, bit rates up to 1 Mbps, and hardware message filtering. Both controllers implement Freescale's Scalable CAN (FSCAN) architecture and are compliant with ISO 11898-1, as documented in Section 2 and Figure 1 of the MPC5200 Rev. 4 datasheet.
Is SPC5200CVR400R2 pin-compatible with other MPC5200 variants such as MPC5200B?
No, SPC5200CVR400R2 is not pin-compatible with MPC5200B-series parts. While both share the same 484-pin PBGA footprint and core peripheral set, MPC5200B introduced revised pin assignments for certain I/O banks (e.g., relocated JTAG signals and modified PSC multiplexing) to improve signal integrity and ESD robustness - detailed in MPC5200B datasheet Rev. 1, Section 4.3.
What debug interfaces are available on SPC5200CVR400R2 for firmware development?
SPC5200CVR400R2 provides IEEE 1149.1 JTAG (TCK/TMS/TDI/TDO/TRST) for boundary-scan and core debugging, plus Freescale's Common On-Chip Processor (COP) port for real-time trace and non-intrusive code profiling. The COP interface operates independently of JTAG and supports instruction-level tracing via dedicated pins - specified in Section 2 and Section 5.4 of the MPC5200 Rev. 4 datasheet.
SPC5200CVR400R2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 272-BBGA
- Series:
- MPC52xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Core Processor:
- PowerPC e300
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 400MHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR, SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 1.1 (2)
- Voltage - I/O:
- 2.5V, 3.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 272-PBGA (27x27)
- Additional Interfaces:
- AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
SPC5200CVR400R2 FAQ
1.How can I place an order for SPC5200CVR400R2 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5200CVR400R2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5200CVR400R2 reliable?
The price and inventory of SPC5200CVR400R2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5200CVR400R2 is usually 5 days.
3.What payment methods are accepted for SPC5200CVR400R2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5200CVR400R2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5200CVR400R2?
SPC5200CVR400R2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5200CVR400R2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5200CVR400R2?
For technical support, including SPC5200CVR400R2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5200CVR400R2 requirements.
6.How does Aetrix verify that SPC5200CVR400R2 is sourced from the original manufacturer or authorized distributors?
All SPC5200CVR400R2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5200CVR400R2 meets industry standards.
7.What is the process for return or replacement of SPC5200CVR400R2?
All SPC5200CVR400R2 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5200CVR400R2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5200CVR400R2 part is unused and in its original packaging.
Return procedure for SPC5200CVR400R2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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