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NXP Semiconductors SPC5516GBMLQ66
- Part No.:
- SPC5516GBMLQ66
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
SPC5516GBMLQ66.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,309
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Product details
Overview
SPC5516GBMLQ66 from NXP Semiconductors (formerly Freescale) is a 32-bit Power Architecture automotive microcontroller designed for central body control and gateway applications. It features an e200z1 main CPU core, 1 MB flash, 64 KB SRAM, 5x FlexCAN interfaces, and operates at 66 MHz in the 144-pin LQFP package. It supports real-time control of lighting, door modules, LIN networks, and diagnostic routing in vehicle body electronics.
For engineers reviewing the SPC5516GBMLQ66 datasheet, SPC5516GBMLQ66 pinout, SPC5516GBMLQ66 application, or SPC5516GBMLQ66 equivalent, key selection criteria include its 66 MHz operation in 144-LQFP, 5-channel CAN support with configurable buffers, eMIOS200 timed I/O, dual-core capability (e200z1 + optional e200z0), and automotive-grade temperature range (–40°C to 150°C junction).
Technical Context
The SPC5516GBMLQ66 implements a dual-core architecture with a primary e200z1 CPU and optional e200z0 I/O processor-both compliant with Power Architecture Book E and supporting Variable Length Encoding (VLE) for reduced code footprint. Its crossbar switch enables concurrent access to flash, SRAM, and peripherals by up to five bus masters including CPU, I/O processor, eDMA, FlexRay, and peripheral bridges.
It integrates FMPLL-based clock generation with multiple sources (external crystal, 16 MHz RC, 32 kHz RC), programmable dividers, and loss-of-clock detection. The device uses a memory protection unit (MPU) with 16 region descriptors and 32-byte granularity, ECC-protected flash (64-bit, SEC-DED), and hardware read-while-write for EEPROM emulation in dedicated flash partitions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z1 main core + optional e200z0 I/O processor; enables parallel peripheral management without burdening main CPU. |
| Max Clock Speed | 66 MHz (confirmed for 144-LQFP package); ensures deterministic real-time response in body control timing-critical tasks. |
| Flash Memory | 1 MB on-chip flash with ECC and read-while-write; supports safe over-the-air updates and EEPROM emulation without external nonvolatile storage. |
| SRAM | 64 KB on-chip SRAM with ECC; sufficient for real-time task stacks, CAN message buffers, and LIN protocol state machines. |
| CAN Interfaces | 5x FlexCAN modules; provides redundant or multi-bus routing for body, chassis, and diagnostic CAN domains in gateway designs. |
| Timed I/O | eMIOS200 with 24 channels (8 IC/OC + 16 PWM); delivers precise PWM dimming for LED lighting and input capture for rain sensor pulse decoding. |
| ADC | 40-channel, 12-bit ADC (16 input-only + 24 bidirectional); enables simultaneous monitoring of battery voltage, temperature sensors, and analog potentiometers. |
| Operating Temp | –40°C to 150°C junction temperature; qualified for under-hood and module-integrated placement in automotive body controllers. |
Pinout & Package
SPC5516GBMLQ66 is housed in a 144-pin LQFP package (0.5 mm pitch, 20 mm × 20 mm outline) with exposed thermal pad. Pin functions are highly multiplexed via SIU configuration, supporting up to 111 GPIOs depending on peripheral assignment.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_IO | I/O Power Supply | Separate 3.3 V or 5.0 V domain; allows mixed-voltage interfacing with LIN transceivers, CAN PHYs, and legacy sensors. |
| VDD_CORE | Core Logic Supply | 1.5 V regulated internal supply; decoupled from I/O rails to minimize noise coupling into CPU and PLL circuits. |
| XTAL_IN / XTAL_OUT | External Crystal Oscillator | Supports 32 kHz crystal for RTC and wakeup; critical for low-power sleep mode timing accuracy and diagnostic timestamping. |
| RESET_IN | Asynchronous Reset Input | Level-sensitive active-low input; enables system-level reset coordination with power management ICs and watchdog outputs. |
| CAN0_TX / CAN0_RX | FlexCAN Channel 0 Interface | Differential signaling pair; connects directly to ISO 11898-2 compliant transceiver for HS CAN body network communication. |
| DSPI0_SIN / DSPI0_SOUT / DSPI0_SCK / DSPI0_PCS0–5 | Dual SPI Module 0 Interface | Four primary signals plus six chip selects; supports daisy-chained EEPROMs, flash expansion, or smart power driver configuration. |
Key Features
| Feature | Design Value |
|---|---|
| FMPLL with Loss-of-Clock Detection | Enables fail-safe clock monitoring and automatic fallback to 16 MHz RC oscillator-critical for ASIL-B compliant diagnostics and watchdog independence. |
| eMIOS200 Timed I/O Module | Delivers synchronized PWM generation and input capture across 24 channels with sub-microsecond resolution-essential for adaptive lighting and wiper motor control. |
| Boot Assist Module (BAM) | Allows flash programming via CAN or SCI without external debugger; simplifies field firmware updates and eliminates need for JTAG during production calibration. |
| Nexus Class Two+ Debug Interface | Provides real-time trace, hardware breakpoints, and memory access during runtime-enabling robust validation of safety-critical body control logic. |
| Configurable GPIO Hysteresis & Slew Rate | Reduces EMI susceptibility and improves noise immunity on long harness traces-validated for automotive EMC standards (ISO 11452, CISPR 25). |
| Hardware Read-While-Write Flash | Permits background erasure/programming of flash blocks while executing code from other blocks-enabling seamless data logging and parameter tuning in live systems. |
Applications
| Body Controller Module | Vehicle Gateway |
|---|---|
|
Use Scenario: Centralized control of interior lighting, power windows, seat position memory, and passive entry systems in mid-tier vehicles. IC Role / Device Role / Timing Role: Primary application MCU managing LIN slave coordination, PWM dimming, and CAN message arbitration between door modules and central ECU. Use Value: 66 MHz deterministic execution and 5x FlexCAN enable concurrent handling of comfort, security, and diagnostic traffic without software scheduling bottlenecks. |
Use Scenario: Message routing between HS CAN powertrain, LS CAN body, LIN subsystems, and telematics modules in distributed vehicle architectures. IC Role / Device Role / Timing Role: Gateway controller performing protocol translation, priority-based message forwarding, and centralized wake-up management across multiple buses. Use Value: Dual-core architecture offloads CAN filtering and LIN polling to e200z0, freeing e200z1 for high-priority diagnostic and reprogramming tasks. |
| Smart Lighting Control | Battery & Sensor Hub |
|
Use Scenario: Adaptive front-lighting system (AFS) with dynamic beam shaping, ambient light compensation, and thermal derating based on LED junction temperature. IC Role / Device Role / Timing Role: Real-time PWM generator and ADC supervisor coordinating multiple LED drivers, photodiodes, and thermistors with microsecond-level timing precision. Use Value: eMIOS200's synchronized PWM channels and 12-bit ADC with 40-channel scan ensure consistent color mixing and thermal feedback loop stability. |
Use Scenario: Centralized monitoring of 12 V battery health, cabin temperature, humidity, and door open/close status using analog and digital sensors. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating data from ADC inputs, GPIO interrupts, and LIN-connected remote sensors for predictive diagnostics. Use Value: 64 KB SRAM accommodates rolling buffer for battery voltage history, while 111 GPIOs support direct connection of discrete switches and analog sensors without external expanders. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5604B | Same e200z1 core, 64 MHz max, 512 KB flash, 48 KB RAM, 4x FlexCAN; lacks e200z0 I/O processor and MLB support. | Targeted at cost-optimized body nodes with lower peripheral density; insufficient for full gateway routing with 5 CAN domains. | Select MPC5604B only when flash/RAM requirements are ≤512 KB/48 KB and dual-core operation is unnecessary. |
| SPC560B50L5 | Enhanced e200z0 core only (no e200z1), 64 MHz, 512 KB flash, 48 KB RAM, 3x FlexCAN; includes integrated voltage regulator and enhanced safety features (ASIL-B ready). | Designed for single-function modules like door actuators or mirror controls-not suitable for multi-bus gateway or complex body controller roles. | Choose SPC560B50L5 for ASIL-B compliance needs in isolated subsystems where main CPU performance and CAN count are secondary. |
Compared with MPC5604B and SPC560B50L5, the SPC5516GBMLQ66 uniquely balances 66 MHz deterministic performance, 1 MB flash for future-proof OTA updates, 5x FlexCAN for multi-domain routing, and dual-core flexibility-making it the only option among the three qualified for full-featured central body/gateway integration without architectural compromise.
Availability
SPC5516GBMLQ66 is available at Aetrix Electronics and suitable for automotive body control modules, vehicle gateways, smart lighting systems, and battery/sensor hubs requiring stable component supply across extended product lifecycles.
Supply support for SPC5516GBMLQ66 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in Power Architecture and functional safety.
The SPC5516GBMLQ66 belongs to NXP's SPC55xx automotive MCU family, engineered specifically for central body electronics and gateway applications demanding high integration, real-time determinism, and ASIL-ready reliability.
FAQ
What is the maximum operating frequency of the SPC5516GBMLQ66?
The SPC5516GBMLQ66 operates at a maximum frequency of 66 MHz when packaged in the 144-pin LQFP configuration. This speed is validated across the full automotive temperature range (–40°C to 150°C junction). The device achieves this performance using its e200z1 core with FMPLL clock synthesis and supports dynamic clock gating for power optimization without compromising real-time responsiveness in body control applications.
Does the SPC5516GBMLQ66 support dual-core operation?
Yes, the SPC5516GBMLQ66 integrates an e200z1 main CPU core and supports an optional e200z0 I/O processor. While the e200z0 is not physically present in all variants, the SPC5516GBMLQ66 datasheet confirms its inclusion in this specific part number. This dual-core configuration enables concurrent execution-such as running LIN protocol stacks on the I/O processor while the main core handles CAN routing and application logic-improving system throughput and determinism.
How many CAN interfaces does the SPC5516GBMLQ66 provide?
The SPC5516GBMLQ66 provides five independent FlexCAN modules. Each module supports configurable message buffers, programmable bit timing, and error counters-enabling simultaneous participation in multiple CAN networks such as HS CAN powertrain, LS CAN body, diagnostic CAN, telematics CAN, and chassis CAN. This capability is explicitly confirmed in Table 1 of the MPC5510 Family Product Brief for the MPC5516G variant.
Is the SPC5516GBMLQ66 qualified for automotive temperature ranges?
Yes, the SPC5516GBMLQ66 is qualified for a junction temperature range of –40°C to 150°C. This rating is documented in Section 2.3 of the MPC5510 Family Product Brief and aligns with AEC-Q100 Grade 1 requirements. The device incorporates thermal monitoring circuitry, internal voltage regulation, and robust I/O characteristics (e.g., ±2 mA injection current tolerance) to maintain reliable operation in under-dash and under-hood environments.
What development tools are supported for the SPC5516GBMLQ66?
The SPC5516GBMLQ66 is supported by NXP's S32 Design Studio, CodeWarrior Development Studio for Power Architecture, and the RAppID initialization tool for graphical pin configuration. It also integrates with third-party RTOS platforms including FreeRTOS, SafeRTOS, and AUTOSAR-compliant stacks. Debugging is enabled via its Nexus Class Two+ interface, which supports real-time trace, hardware breakpoints, and memory access through standard JTAG probes compatible with IEEE-ISTO 5001-2003.
SPC5516GBMLQ66 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- MPC55xx Qorivva
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- e200z0, e200z1
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 66MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 111
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 5.25V
- Data Converters:
- A/D 40x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5516GBMLQ66 FAQ
1.How can I place an order for SPC5516GBMLQ66 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5516GBMLQ66 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5516GBMLQ66 reliable?
The price and inventory of SPC5516GBMLQ66 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5516GBMLQ66 is usually 5 days.
3.What payment methods are accepted for SPC5516GBMLQ66?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5516GBMLQ66 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5516GBMLQ66?
SPC5516GBMLQ66 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5516GBMLQ66 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5516GBMLQ66?
For technical support, including SPC5516GBMLQ66 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5516GBMLQ66 requirements.
6.How does Aetrix verify that SPC5516GBMLQ66 is sourced from the original manufacturer or authorized distributors?
All SPC5516GBMLQ66 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5516GBMLQ66 meets industry standards.
7.What is the process for return or replacement of SPC5516GBMLQ66?
All SPC5516GBMLQ66 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5516GBMLQ66, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5516GBMLQ66 part is unused and in its original packaging.
Return procedure for SPC5516GBMLQ66:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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