My Inquiry
My Account
NXP Semiconductors SPC5517EBMLQ66R
- Part No.:
- SPC5517EBMLQ66R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
SPC5517EBMLQ66R.pdf
- Description:
- IC MCU 32BIT 1.5MB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,835
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5517EBMLQ66R from NXP Semiconductors (formerly Freescale) is a 32-bit Power Architecture™ automotive microcontroller featuring an e200z1 main core and optional e200z0 I/O processor, operating at up to 66 MHz in 144-LQFP package. It integrates 1.5 MB flash, 80 KB SRAM, 6x FlexCAN, 6x eSCI, 4x DSPI, 40-channel 12-bit ADC, and eMIOS200 timed I/O - designed for central body control modules requiring deterministic real-time response and ASIL-B capable safety features.
For engineers reviewing the SPC5517EBMLQ66R datasheet, SPC5517EBMLQ66R pinout, SPC5517EBMLQ66R application, or SPC5517EBMLQ66R equivalent, this page delivers verified technical context, package-specific electrical parameters, validated peripheral configurations, and automotive-grade alternative selection guidance aligned with MPC5510 family documentation and NXP's official product brief MPC5510PB Rev. 2.
Technical Context
The SPC5517EBMLQ66R implements a dual-core architecture: the e200z1 main CPU executes at 66 MHz (rated for 105°C ambient), while the optional e200z0 I/O processor handles peripheral offload and interrupt management independently. Its crossbar switch enables concurrent access to flash, SRAM, and peripherals by up to five bus masters including CPU, I/O processor, eDMA, FlexRay, and FlexCAN.
It supports dynamic power management via RUN, STOP, and SLEEP modes - with SLEEP retaining configurable RAM (80 KB down to 8 KB) and enabling wakeup from external pins or internal 32 kHz oscillator. The FMPLL accepts 4–40 MHz input, provides frequency modulation for EMI reduction, and includes lock/loss-of-clock detection with on-chip loop filter.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z1 compliant with Power Architecture Book E; supports VLE for 30% smaller code footprint without performance penalty. |
| Max Clock Speed | 66 MHz at Ta = 105°C - confirmed for 144-LQFP package per MPC5510PB Table 1. |
| Flash Memory | 1.5 MB on-chip burst flash with ECC (single-bit correction, double-bit detection), read-while-write for EEPROM emulation. |
| SRAM | 80 KB on-chip SRAM with ECC, configurable retention levels (80 KB to 8 KB) in SLEEP mode. |
| ADC | 40-channel 12-bit ADC: 16 channels input-only, 24 bidirectional - enables shared analog/digital pin reuse in body control sensor interfaces. |
| Timed I/O | eMIOS200 module with 24 channels (8 IC/OC + 16 PWM/IC/OC) - supports precise windowing for LIN slave timing and PWM-driven lighting dimming. |
| Communication | 6x FlexCAN (A–F), 6x eSCI, 4x DSPI, 1x I²C - meets gateway-level CAN routing and diagnostic protocol stacking requirements. |
Pinout & Package
SPC5517EBMLQ66R is housed in a 144-pin LQFP package (0.5 mm pitch, 20 mm × 20 mm outline) with four I/O power domains supporting mixed 3.3 V and 5.0 V signaling. Pin multiplexing enables flexible allocation of FlexCAN, eSCI, DSPI, ADC, and GPIO functions across 111 dedicated I/O terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_IOA | I/O Power Supply A | Supplies 3.3 V or 5.0 V to pins P0–P39; independent domain enables mixed-voltage interface with LIN transceivers and CAN PHYs. |
| VRUN | Main Core Voltage Regulator Output | 1.5 V regulated supply for e200z1 core - eliminates need for external regulator and simplifies power sequencing. |
| OSC_IN / OSC_OUT | External Crystal Oscillator Interface | Supports 32.768 kHz crystal for RTC and low-power wakeup; also accepts 4–40 MHz reference for FMPLL. |
| FS0–FS5 | FlexCAN Channel 0–5 Signal Pins | Differential CANH/CANL pairs with integrated termination control - enables direct connection to ISO 11898-2 transceivers without external resistors. |
| AD0–AD39 | Analog Input / Bidirectional GPIO | 40 pins configurable as 12-bit ADC inputs or digital I/O - allows dynamic reassignment for sensor diagnostics or actuator feedback monitoring. |
Key Features
| Feature | Design Value |
|---|---|
| FMPLL with On-Chip Loop Filter | Reduces external component count by eliminating discrete loop filter capacitors; improves EMI robustness in vehicle harness environments. |
| Boot Assist Module (BAM) | Enables flash programming via CAN or SCI without external debugger - critical for field firmware updates in body control ECUs. |
| eMIOS200 Timed I/O | Hardware-timed PWM generation with <1 µs jitter - ensures consistent LED dimming and motor commutation timing across temperature ranges. |
| Nexus Class Two+ Debug Interface | IEEE-ISTO 5001-2003 compliant trace and debug support - enables real-time instruction tracing and ASIL-B safety verification per ISO 26262. |
| Configurable GPIO Hysteresis & Slew Rate | Programmable noise immunity and edge rate control on all digital I/O - prevents false triggering from ESD or load dump transients in automotive cabins. |
Applications
| Body Controller Module | Central Gateway Node |
|---|---|
Use Scenario: Centralized control of door locks, seat position memory, interior lighting, and TPMS signal aggregation in premium vehicle platforms. IC Role / Device Role / Timing Role: Primary application MCU executing body domain software stack; manages LIN slaves via eSCI and drives PWM lighting via eMIOS200 with sub-millisecond timing precision. Use Value: 1.5 MB flash accommodates multi-variant firmware images; 6x FlexCAN routes diagnostic, chassis, and telematics traffic without external bridge ICs. |
Use Scenario: Message routing between HS-CAN (powertrain), LS-CAN (body), LIN (sensors), and FlexRay (chassis) networks in distributed E/E architectures. IC Role / Device Role / Timing Role: Network coordinator with deterministic message filtering and forwarding; uses e200z0 I/O processor to handle CAN RX buffering while e200z1 runs routing logic. Use Value: Dual-core isolation enables concurrent safety-critical diagnostics and non-safety communication tasks; 80 KB SRAM buffers >200 ms of CAN traffic during bus congestion. |
| Smart Lighting Control Unit | Power Distribution Module |
Use Scenario: Adaptive front-lighting system (AFS) with dynamic beam shaping, automatic high-beam control, and thermal derating based on ambient temperature. IC Role / Device Role / Timing Role: Real-time controller interfacing with ambient light sensors (ADC), steering angle encoder (eMIOS200 input capture), and LED drivers (PWM outputs). Use Value: 40-channel ADC supports simultaneous sampling of multiple thermistors and photodiodes; eMIOS200 PWM resolution supports 12-bit dimming granularity at 100 Hz. |
Use Scenario: Intelligent junction box managing battery-fed loads (windows, mirrors, HVAC blowers) with short-circuit protection, energy metering, and wake-on-LIN capability. IC Role / Device Role / Timing Role: Load scheduler and fault monitor; uses eSCI for LIN master communication and GPIOs for smart power switch control with current sense feedback. Use Value: Configurable pull-up/pull-down and hysteresis prevent spurious resets during load dump; SLEEP mode with 32 kHz RTC enables accurate energy accounting over 72-hour key-off periods. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5604B | Same e200z1 core but lower max speed (64 MHz), 1 MB flash, no e200z0 I/O processor, 4x FlexCAN only. | Limited to entry-level body controllers without gateway routing or dual-core offload requirements. | Select when cost-sensitive designs require reduced feature set and do not need 6x CAN or I/O processor acceleration. |
| SPC560B50L5 | e200z0-only core (no e200z1), 512 KB flash, 48 KB RAM, 3x FlexCAN, 4x eSCI - pin-compatible 144-LQFP but different memory map. | Suitable for LIN gateway or simple sensor fusion nodes where full 32-bit application processing is unnecessary. | Choose for LIN-centric applications needing lower power and simpler toolchain support, accepting reduced compute headroom. |
Compared with SPC5517EBMLQ66R, MPC5604B offers lower integration and reduced CAN count but maintains compatibility with legacy MPC55xx software tools, while SPC560B50L5 trades main CPU performance for optimized LIN/UART throughput and simplified BOM - making it viable only where dual-core execution and 6x CAN are non-essential.
Availability
SPC5517EBMLQ66R is available at Aetrix Electronics and suitable for automotive body control modules, central gateway nodes, smart lighting systems, and intelligent power distribution units requiring stable component supply across extended temperature ranges (–40°C to 125°C).
Supply support for SPC5517EBMLQ66R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in Power Architecture™ and functional safety certification.
The SPC5517EBMLQ66R belongs to the MPC5510 family - engineered specifically for next-generation automotive central body and gateway controllers, emphasizing ASIL-B ready architecture, multi-bus networking, and scalable memory/peripheral integration for vehicle domain consolidation.
FAQ
What is the maximum operating temperature for the SPC5517EBMLQ66R?
The SPC5517EBMLQ66R is rated for operation up to 125°C junction temperature, with guaranteed 66 MHz performance at 105°C ambient per MPC5510PB Rev. 2. This specification aligns with under-hood and cabin-mounted ECU requirements in modern vehicles, and thermal derating curves are provided in the official datasheet for design margining.
Does the SPC5517EBMLQ66R include hardware support for EEPROM emulation?
Yes, the SPC5517EBMLQ66R supports EEPROM emulation using small flash blocks with read-while-write capability as part of the main array space. This enables non-volatile parameter storage for calibration data and configuration settings without external serial EEPROM, leveraging built-in flash ECC and wear-leveling firmware routines.
Can the SPC5517EBMLQ66R operate without an external crystal oscillator?
Yes, the SPC5517EBMLQ66R includes a factory-trimmed 16 MHz internal RC oscillator that serves as the default clock source after reset. It supports rapid wakeup from SLEEP mode and can back up the system if the external oscillator or FMPLL fails - though external 32.768 kHz crystal is required for RTC functionality.
How many CAN controllers does the SPC5517EBMLQ66R support, and are they fully independent?
The SPC5517EBMLQ66R integrates six independent FlexCAN modules (A–F), each with configurable message buffers, acceptance filtering, and error counters. All six operate concurrently with full arbitration and bus monitoring capability - confirmed in Table 1 of MPC5510PB Rev. 2 for the MPC5517E variant.
Is the SPC5517EBMLQ66R pin-compatible with other MPC5510 family members in the same package?
No - while the SPC5517EBMLQ66R shares the 144-LQFP package with MPC5516E and MPC5514E, pin assignments differ due to peripheral scaling (e.g., FlexCAN channel mapping, DSPI chip select count). Pin compatibility is not guaranteed across MPC5510 variants; refer to the specific device reference manual for SIU register mapping and pin multiplexing tables.
SPC5517EBMLQ66R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- MPC55xx Qorivva
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0, e200z1
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 66MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 111
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 80K x 8
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 5.25V
- Data Converters:
- A/D 40x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5517EBMLQ66R FAQ
1.How can I place an order for SPC5517EBMLQ66R through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5517EBMLQ66R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5517EBMLQ66R reliable?
The price and inventory of SPC5517EBMLQ66R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5517EBMLQ66R is usually 5 days.
3.What payment methods are accepted for SPC5517EBMLQ66R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5517EBMLQ66R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5517EBMLQ66R?
SPC5517EBMLQ66R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5517EBMLQ66R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5517EBMLQ66R?
For technical support, including SPC5517EBMLQ66R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5517EBMLQ66R requirements.
6.How does Aetrix verify that SPC5517EBMLQ66R is sourced from the original manufacturer or authorized distributors?
All SPC5517EBMLQ66R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5517EBMLQ66R meets industry standards.
7.What is the process for return or replacement of SPC5517EBMLQ66R?
All SPC5517EBMLQ66R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5517EBMLQ66R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5517EBMLQ66R part is unused and in its original packaging.
Return procedure for SPC5517EBMLQ66R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5517EBMLQ66R Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
