My Inquiry
My Account
NXP Semiconductors SPC5517GAMMG66
- Part No.:
- SPC5517GAMMG66
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 208-BGA
- Datasheet:
-
SPC5517GAMMG66.pdf
- Description:
- IC MCU 32B 1.5MB FLASH 208MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,963
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5517GAMMG66 from NXP Semiconductors (formerly Freescale) is a 32-bit Power Architecture™ automotive microcontroller designed for central body control and gateway applications. It features an e200z1 main CPU core operating at up to 66 MHz, 1.5 MB on-chip flash memory, 80 KB SRAM, six FlexCAN modules, and a 208-ball MAPBGA package. It supports real-time vehicle networking in body electronics modules requiring high peripheral integration and ASIL-B–capable functional safety support.
For engineers reviewing the SPC5517GAMMG66 datasheet, SPC5517GAMMG66 pinout, SPC5517GAMMG66 application, or SPC5517GAMMG66 equivalent, key selection criteria include its 66 MHz execution speed in 208-BGA packaging, dual-core architecture (e200z1 + optional e200z0 I/O processor), 6× FlexCAN with configurable buffers, 4× DSPI, and hardware ECC-protected flash/SRAM - all validated for automotive body/gateway use cases under −40°C to 150°C junction temperature.
Technical Context
The SPC5517GAMMG66 implements a dual-core architecture: a primary e200z1 CPU compliant with Power Architecture Book E and an optional e200z0 I/O processor for offloading peripheral management. Its crossbar switch enables concurrent access to flash, SRAM, and peripherals by up to five bus masters including CPU, I/O processor, FlexRay, and eDMA.
It integrates FMPLL-based clock generation with selectable sources (external crystal, 16 MHz RC, or 32 kHz oscillator), dynamic power modes (RUN/STOP/SLEEP), and hardware-assisted memory protection via a 16-entry MPU. Peripheral multiplexing across 144 GPIO pins allows flexible feature allocation per application without silicon change.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z1 32-bit Power Architecture core with VLE instruction set; enables compact code footprint and deterministic real-time execution. |
| Max Clock Speed | 66 MHz at Ta = 105°C; defines maximum deterministic instruction throughput for time-critical body/gateway tasks. |
| Flash Memory | 1.5 MB on-chip flash with ECC (single-bit correction/double-bit detection); supports read-while-write for EEPROM emulation and safe firmware updates. |
| SRAM | 80 KB on-chip SRAM with ECC; provides fast, fault-tolerant data storage for real-time control variables and communication buffers. |
| FlexCAN Modules | 6 × FlexCAN controllers with configurable message buffers; enables simultaneous routing across HS CAN powertrain, diagnostic, telematics, and LS CAN body networks. |
| Package | 208-ball MAPBGA, 1 mm pitch, 17 mm × 17 mm; supports high I/O count and thermal performance required for automotive under-hood modules. |
| Operating Temp | −40°C to +150°C junction temperature; qualified for engine bay and central gateway placement without derating. |
Pinout & Package
SPC5517GAMMG66 is housed in a 208-ball MAPBGA package (17 mm × 17 mm, 1 mm ball pitch) with perimeter I/O arrangement optimized for automotive PCB layout and thermal dissipation. Pin functions are highly multiplexed, supporting up to 144 configurable GPIOs alongside dedicated peripheral signals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_MAIN | Main supply input (5 V ±5%, −10%) | Feeds internal voltage regulator (VREG) to generate 1.5 V core logic; single-supply simplifies board design. |
| VDD_IOA / VDD_IOB / VDD_IOC | I/O domain supplies (3.3 V or 5 V) | Three independent I/O power domains allow mixed-voltage interfacing (e.g., 5 V LIN, 3.3 V SPI) without level shifters. |
| XTAL_IN / XTAL_OUT | External 32 kHz crystal oscillator interface | Provides precise timing source for RTC and low-power wakeup; supports fail-safe transition to internal RC oscillators. |
| CAN_A_TX / CAN_A_RX | Differential CAN transceiver interface (Channel A) | Direct connection to external CAN PHY; supports ISO 11898-2 compliant HS CAN up to 1 Mbps. |
| DSPI0_SCK / DSPI0_MOSI / DSPI0_MISO / DSPI0_PCS0 | Digital Signal Processor Interface (DSPI) Channel 0 signals | Full-duplex synchronous serial interface for flash programming, sensor communication, or actuator control with programmable timing. |
| ADC0_IN0–ADC0_IN39 | Analog input channels (12-bit ADC) | 40-channel 12-bit SAR ADC with configurable sampling; supports battery monitoring, temperature sensing, and potentiometer feedback. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core architecture (e200z1 + e200z0) | Enables main application execution on e200z1 while delegating time-sensitive I/O handling (e.g., CAN message scheduling, PWM generation) to dedicated e200z0 I/O processor - reducing CPU load and jitter. |
| 6 × FlexCAN with configurable message buffers | Supports concurrent multi-bus gateway operation (e.g., HS CAN powertrain ↔ LS CAN body ↔ LIN subsystems) with hardware mailbox arbitration and error confinement. |
| Hardware ECC on flash and SRAM | Ensures data integrity in safety-critical automotive applications; meets requirements for ASIL-B compliance per ISO 26262 without software overhead. |
| FMPLL with frequency modulation | Reduces electromagnetic interference (EMI) during high-speed operation; eliminates need for external loop filter components. |
| Configurable GPIO with slew rate/hysteresis control | Allows noise-immune digital input sampling in electrically noisy vehicle environments; supports both 3.3 V and 5 V logic levels across three independent I/O domains. |
| Read-while-write flash capability | Permits background firmware update or calibration data storage without interrupting real-time application execution - critical for zero-downtime reprogramming. |
Applications
| Body Control Module | Vehicle Gateway |
|---|---|
|
Use Scenario: Centralized control of doors, seats, lighting, and security systems (e.g., passive entry, TPMS, interior ambient lighting). IC Role / Device Role / Timing Role: Primary application controller executing body domain software stack, managing LIN slaves, and coordinating CAN-based diagnostics. Use Value: 1.5 MB flash accommodates complex feature sets (e.g., adaptive lighting algorithms); 66 MHz deterministic timing ensures synchronized PWM dimming and secure key handshake latency ≤ 10 ms. |
Use Scenario: Message routing between HS CAN powertrain, LS CAN body, LIN subsystems, and FlexRay backbone in distributed E/E architectures. IC Role / Device Role / Timing Role: Central protocol translator and network manager with real-time message filtering, prioritization, and gateway firewall logic. Use Value: Six independent FlexCAN modules enable full isolation between bus domains; hardware timestamping and FIFO buffering guarantee <50 μs inter-bus latency for critical diagnostic messages. |
| Smart Lighting Controller | Power Distribution Unit (PDU) |
|
Use Scenario: Adaptive front-lighting system (AFS) and rear lighting control with PWM-driven LED arrays and thermal monitoring. IC Role / Device Role / Timing Role: Real-time PWM generator and analog sensor hub, sampling ambient light/temperature and adjusting beam pattern via CAN commands. Use Value: 40-channel 12-bit ADC enables simultaneous monitoring of 8+ thermal sensors; eMIOS200 timers deliver jitter-free 100 Hz–20 kHz PWM with 0.1% duty cycle resolution. |
Use Scenario: Centralized power switching and load monitoring for chassis electronics (e.g., pumps, latches, HVAC actuators) with short-circuit and overcurrent protection. IC Role / Device Role / Timing Role: High-reliability load scheduler and fault logger, using GPIO-controlled smart power drivers and CAN-based status reporting. Use Value: 144 GPIOs support direct drive of 32+ high-side switches; SLEEP mode with 8 KB RAM retention enables <100 μA standby current while preserving fault history across ignition cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5604B | Single e200z0 core, 512 KB flash, 48 KB RAM, 4× FlexCAN, 144-LQFP package | Limited to mid-tier body modules without gateway routing or high peripheral density | Select when cost sensitivity outweighs need for dual-core processing or >1 MB flash; suitable for door module or seat controller designs. |
| S32K144 | ARM Cortex-M4F core, 512 KB flash, 64 KB RAM, 3× CAN FD, 100-pin LQFP | Targets next-gen ASIL-B applications with CAN FD upgrade path and enhanced debug trace | Choose for new designs requiring CAN FD support, higher toolchain compatibility, or long-term roadmap alignment beyond Power Architecture. |
Compared with MPC5604B, SPC5517GAMMG66 delivers 3× more flash and dual-core determinism for gateway-class workloads; versus S32K144, it offers superior legacy CAN bandwidth and proven qualification for high-temperature body/gateway deployment - though lacks CAN FD and ARM ecosystem advantages.
Availability
SPC5517GAMMG66 is available at Aetrix Electronics and suitable for automotive body control modules, vehicle gateways, smart lighting systems, and power distribution units requiring stable component supply across extended product lifecycles.
Supply support for SPC5517GAMMG66 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, delivering secure, energy-efficient, and scalable silicon solutions.
The SPC5517GAMMG66 belongs to NXP's legacy MPC55xx automotive MCU family, engineered specifically for central body electronics and gateway control - emphasizing high peripheral integration, functional safety readiness, and robust operation in harsh automotive environments.
FAQ
What is the maximum operating frequency of the SPC5517GAMMG66?
The SPC5517GAMMG66 operates at a maximum frequency of 66 MHz when packaged in the 208-ball MAPBGA configuration and rated for ambient temperatures up to 105°C. This speed is confirmed in the MPC5510 Family Product Brief (Rev. 2, Table 1) and applies specifically to the MPC5517G variant. The SPC5517GAMMG66 maintains deterministic real-time performance at this frequency under full peripheral load and −40°C to +150°C junction temperature conditions.
Does the SPC5517GAMMG66 support functional safety standards like ISO 26262?
Yes, the SPC5517GAMMG66 includes hardware features aligned with ASIL-B requirements per ISO 26262, including ECC-protected flash and SRAM, lock-step capable peripherals, memory protection unit (MPU), and fault collection registers. While no formal ASIL-B certification is claimed for the device itself, its architecture and documented failure modes support integration into ASIL-B–compliant systems - as validated in Freescale's MPC5510 Functional Safety Manual (document MPC5510FSM).
How many CAN interfaces does the SPC5517GAMMG66 support, and what type are they?
The SPC5517GAMMG66 supports six FlexCAN modules, each compliant with ISO 11898-1 and supporting CAN 2.0A/B protocols at data rates up to 1 Mbps. These are fully configurable, independent controllers with message buffers, acceptance filtering, and error confinement - enabling simultaneous operation across multiple vehicle networks (e.g., HS CAN powertrain, diagnostic, telematics, and LS CAN body). This capability is explicitly listed for the MPC5517G in Table 1 of the MPC5510 Family Product Brief.
What development tools are officially supported for the SPC5517GAMMG66?
NXP officially supports the SPC5517GAMMG66 with CodeWarrior Development Studio for Power Architecture (v10.7+), the RAppID initialization tool for graphical pin configuration, and the MPC5510 Evaluation Board (MPC5510EVB). Debugging uses the Nexus Class Two Plus interface (IEEE-ISTO 5001), compatible with Lauterbach TRACE32 and PLS UDE. All tools are documented in Freescale Application Note AN3772 and the MPC5510 Developer Environment section (Section 3) of the product brief.
Is external memory supported by the SPC5517GAMMG66?
Yes, the SPC5517GAMMG66 includes an External Bus Interface (EBI) module supporting up to 24-bit address and 32-bit data bus width in the 208-ball MAPBGA package. It enables connection to external NOR flash, SRAM, or peripherals with four chip selects. This capability is confirmed in Table 1 (EBI column) and Section 2.4 of the MPC5510 Family Product Brief, and applies specifically to the MPC5517G variant in 208-BGA packaging.
SPC5517GAMMG66 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 208-BGA
- Series:
- MPC55xx Qorivva
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- e200z0, e200z1
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 66MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 144
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 80K x 8
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 5.25V
- Data Converters:
- A/D 40x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5517GAMMG66 FAQ
1.How can I place an order for SPC5517GAMMG66 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5517GAMMG66 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5517GAMMG66 reliable?
The price and inventory of SPC5517GAMMG66 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5517GAMMG66 is usually 5 days.
3.What payment methods are accepted for SPC5517GAMMG66?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5517GAMMG66 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5517GAMMG66?
SPC5517GAMMG66 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5517GAMMG66 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5517GAMMG66?
For technical support, including SPC5517GAMMG66 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5517GAMMG66 requirements.
6.How does Aetrix verify that SPC5517GAMMG66 is sourced from the original manufacturer or authorized distributors?
All SPC5517GAMMG66 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5517GAMMG66 meets industry standards.
7.What is the process for return or replacement of SPC5517GAMMG66?
All SPC5517GAMMG66 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5517GAMMG66, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5517GAMMG66 part is unused and in its original packaging.
Return procedure for SPC5517GAMMG66:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5517GAMMG66 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
