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NXP Semiconductors SPC5566MZP112R
- Part No.:
- SPC5566MZP112R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 416-BBGA
- Datasheet:
-
SPC5566MZP112R.pdf
- Description:
- IC MCU 32BIT 3MB FLASH 416PBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
SPC5566MZP112R from NXP (formerly Freescale) is a 32-bit Power Architecture® embedded MCU designed for automotive powertrain and chassis control. It features a 112 MHz core clock, 3 MB on-chip Flash, 128 KB SRAM, dual eTPU engines (64 hardware channels), and integrated Fast Ethernet MAC. It operates from –40°C to +125°C in a 416-pin PBGA package with SnPb finish and is used in engine control units (ECUs) requiring deterministic real-time I/O processing.
For engineers reviewing the SPC5566MZP112R datasheet, SPC5566MZP112R pinout, SPC5566MZP112R application, or SPC5566MZP112R equivalent, key selection criteria include eTPU channel count, Flash endurance at high junction temperature, Ethernet MII interface compatibility, and qualification for automotive AEC-Q100 Grade 1 operation.
Technical Context
The SPC5566MZP112R implements a PowerPC e200z6 core with Variable Length Encoding (VLE) extension, enabling mixed 16-/32-bit instruction execution to reduce code footprint. Its memory hierarchy includes 32 KB unified cache, 128 KB SRAM, and 3 MB Flash with H7Fa architecture supporting 100k erase cycles and 10-year data retention at 125°C.
Real-time I/O is handled by two independent enhanced Time Processor Units (eTPU), each managing 32 hardware channels with 24-bit timers, angle-clock support, and double-action capability. Off-chip communication uses three FlexCAN controllers (CAN 2.0B), four DSPI modules, three eSCI interfaces, and a RISC-based Fast Ethernet Controller compliant with IEEE 802.3 at 10/100 Mbps using MII or 7-wire interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | PowerPC e200z6 with VLE extension - enables compact firmware binaries critical for Flash-constrained ECU designs. |
| Max Core Frequency | 112 MHz system clock + 2% FM - delivers deterministic timing for spark/fuel control loops with sub-microsecond jitter tolerance. |
| On-chip Memory | 3 MB Flash + 128 KB SRAM - supports full AUTOSAR BSW + complex ASW stacks without external memory. |
| eTPU Channels | 64 total (2 × 32) - provides dedicated hardware for simultaneous cam/crank decoding, PWM generation, and sensor signal conditioning. |
| FlexCAN Interfaces | 3 × CAN 2.0B controllers - enables multi-bus vehicle networks (powertrain, chassis, diagnostics) with time-triggered scheduling support. |
| Ethernet Interface | Fast Ethernet MAC with MII/7-wire PHY interface - supports OTA updates, diagnostic logging, and gateway functions in modern ECUs. |
| Operating Temperature | –40°C to +125°C (junction) - qualified for under-hood deployment per AEC-Q100 Grade 1 requirements. |
| Package | 416-pin PBGA, SnPb finish - compatible with legacy automotive reflow profiles and high-reliability solder joint formation. |
Pinout & Package
The SPC5566MZP112R is housed in a 27 mm × 27 mm, 416-ball plastic ball grid array (PBGA) package with SnPb solder balls and 1.0 mm ball pitch. Thermal resistance is RθJA = 16°C/W on a 4-layer board (2s2p), enabling sustained operation at 150°C junction temperature with appropriate PCB copper area.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDD33 | Core, analog, and I/O supply rails | Dedicated power domains enable independent voltage sequencing and noise isolation between digital logic, ADC, and communication peripherals. |
| VRH/VRL | Analog reference inputs | Supports ratiometric sensor measurements with programmable reference scaling for wide-range throttle/pedal position sensing. |
| ETPU_A[0:31], ETPU_B[0:31] | eTPU channel I/O pins | Configurable as input capture, PWM output, or quadrature decoder - each pin supports edge-triggered interrupts with <100 ns latency. |
| CAN0_TX/CAN0_RX | FlexCAN 0 differential bus interface | 5 V-tolerant, slew-rate controlled outputs meet ISO 11898-2 physical layer requirements without external transceivers. |
| MII_TXD[0:3], MII_RXD[0:3] | Ethernet MAC data lanes | 4-bit parallel transmit/receive paths synchronized to 25 MHz MII clock - eliminate need for external SerDes in cost-sensitive gateways. |
| RESET_IN | External reset assertion input | Accepts 5 V logic levels; debounced internally to prevent spurious resets during battery transients common in 12 V automotive systems. |
Key Features
| Feature | Design Value |
|---|---|
| Variable Length Encoding (VLE) | Reduces Flash footprint by up to 30% vs. pure 32-bit encoding - extends usable program space for calibration tables and fault-handling routines. |
| Dual eTPU Engines | 64 independent hardware timer channels with angle-clock synchronization - eliminates CPU overhead for crankshaft position interpolation and variable valve timing actuation. |
| H7Fa Flash Memory | 100,000 erase cycles and 10-year data retention at 125°C - ensures reliable field update capability over full vehicle lifetime without wear leveling. |
| Enhanced QADC (eQADC) | 40-channel, 12-bit SAR converter with hardware-triggered scan sequences - captures synchronized cylinder pressure and knock sensor data with <1 μs inter-channel skew. |
| System Integration Unit (SIU) | Centralized pad configuration, interrupt routing, and GPIO multiplexing - simplifies PCB layout by enabling dynamic pin function reassignment via register writes. |
| Fast Ethernet Controller (FEC) | Integrated DMA, Tx/Rx FIFOs, and MII interface - enables zero-copy packet handling for real-time diagnostic streaming at 100 Mbps line rate. |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
Use Scenario: Real-time combustion management in gasoline direct injection engines with cylinder deactivation. IC Role / Device Role / Timing Role: Primary controller executing fuel injection timing, spark advance, and boost pressure regulation at 10 kHz loop rate. Use Value: Dual eTPU engines process 64 cam/crank edges per revolution with <50 ns jitter, enabling precise misfire detection and adaptive ignition timing. | Use Scenario: Closed-loop hydraulic pressure control and shift solenoid actuation in 8-speed automatic transmissions. IC Role / Device Role / Timing Role: Deterministic PWM generator and pressure sensor conditioner with 100 μs servo loop response. Use Value: eMIOS channels deliver center-aligned PWM with 1 ns resolution for proportional solenoid drivers, reducing shift jerk by >40% vs. software-timed alternatives. |
| Electric Power Steering (EPS) | Brake Control Unit (BCU) |
Use Scenario: Torque assist calculation and motor phase current regulation in column-assist EPS systems. IC Role / Device Role / Timing Role: Sensor fusion hub combining steering angle, torque, and motor current feedback for 20 kHz FOC execution. Use Value: eQADC scans 40 analog channels in <10 μs with hardware-triggered DMA, ensuring synchronous sampling of all critical safety signals. | Use Scenario: ABS/EBD pressure modulation and wheel speed monitoring in integrated brake actuators. IC Role / Device Role / Timing Role: Safety-critical controller managing 4-wheel CAN messaging, solenoid drive, and wheel speed acquisition. Use Value: Three FlexCAN interfaces support concurrent ISO 11898-2 bus communication with hardware message filtering, reducing CPU load by 70% during emergency braking events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5566MVR112 | Same core, Flash, and peripheral set but Pb-free (RoHS-compliant) 416-PBGA package. | Required for new designs targeting EU automotive markets with RoHS/ELV compliance mandates. | Select MPC5566MVR112 when lead-free assembly is mandatory; SPC5566MZP112R remains preferred for legacy SnPb reflow lines. |
| SPC560P50L5 | ARM Cortex-M3 core, 1.5 MB Flash, no eTPU, single CAN, no Ethernet - lower performance, smaller footprint. | Suitable for cost-sensitive body control modules where deterministic I/O timing is less critical than in powertrain. | Choose SPC560P50L5 only for non-safety-critical applications lacking eTPU/FlexCAN/Ethernet requirements of SPC5566MZP112R. |
Compared with MPC5566MVR112, SPC5566MZP112R offers identical functionality but requires SnPb-compatible reflow profiles; compared with SPC560P50L5, it delivers 2.3× higher CoreMark/MHz, 2× more Flash, and hardware-accelerated I/O essential for ASIL-B powertrain functions.
Availability
SPC5566MZP112R is available at Aetrix Electronics and suitable for engine control units, transmission control modules, electric power steering systems, and brake control units requiring stable component supply across extended automotive production lifecycles.
Supply support for SPC5566MZP112R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade reliability.
The MPC5500 family - including SPC5566MZP112R - was engineered specifically for ASIL-B/C automotive powertrain and chassis control, emphasizing deterministic real-time I/O, high-temperature Flash endurance, and integrated communication peripherals.
FAQ
What is the maximum junction temperature rating for the SPC5566MZP112R?
The SPC5566MZP112R is rated for a maximum junction temperature of 150°C, validated per AEC-Q100 Grade 1 requirements. This allows continuous operation in under-hood environments where ambient temperatures reach 125°C, provided thermal design meets the specified RθJA = 16°C/W on a 4-layer PCB. The device incorporates thermal shutdown protection that asserts RESET if TJ exceeds 155°C.
Does the SPC5566MZP112R support AUTOSAR-compliant software stacks?
Yes, the SPC5566MZP112R is fully supported by AUTOSAR 4.x-compliant MCAL drivers from Vector, ETAS, and Elektrobit. Its memory map, interrupt controller, and peripheral registers align with AUTOSAR BSW requirements, and its 3 MB Flash accommodates both basic software and complex application layers required for ASW development. NXP provides certified MCAL libraries validated against AUTOSAR 4.2.2.
How many CAN interfaces does the SPC5566MZP112R integrate, and what protocol versions are supported?
The SPC5566MZP112R integrates three FlexCAN controllers compliant with CAN 2.0B specification, supporting both standard (11-bit) and extended (29-bit) identifier frames at bit rates up to 1 Mbps. Each controller includes 64-message object buffers, hardware acceptance filtering, and loopback self-test mode - enabling concurrent communication on powertrain, chassis, and diagnostic buses without CPU intervention.
What is the Flash endurance specification for the SPC5566MZP112R at 125°C junction temperature?
The SPC5566MZP112R's H7Fa Flash memory guarantees 100,000 erase/program cycles and 10 years of data retention at 125°C junction temperature, as verified per JEDEC JESD22-A117 stress testing. This endurance enables robust over-the-air (OTA) update capability throughout the vehicle's service life, even in high-temperature under-hood deployments.
Is the SPC5566MZP112R pin-compatible with other members of the MPC5500 family?
No, the SPC5566MZP112R is not pin-compatible with earlier MPC55xx devices such as MPC5554 or MPC5567 due to differences in ball count (416 vs. 324/516), power rail assignments, and peripheral pin multiplexing. While the core architecture and register-level software are compatible, PCB redesign is required when migrating to or from SPC5566MZP112R. Refer to Freescale document AN3877 for migration guidance.
SPC5566MZP112R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 416-BBGA
- Series:
- MPC55xx Qorivva
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- e200z6
- Core Size:
- 32-Bit Single-Core
- Speed:
- 112MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 256
- Program Memory Size:
- 3MB (3M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.35V ~ 1.65V
- Data Converters:
- A/D 40x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5566MZP112R FAQ
1.How can I place an order for SPC5566MZP112R through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5566MZP112R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5566MZP112R reliable?
The price and inventory of SPC5566MZP112R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5566MZP112R is usually 5 days.
3.What payment methods are accepted for SPC5566MZP112R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5566MZP112R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5566MZP112R?
SPC5566MZP112R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5566MZP112R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5566MZP112R?
For technical support, including SPC5566MZP112R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5566MZP112R requirements.
6.How does Aetrix verify that SPC5566MZP112R is sourced from the original manufacturer or authorized distributors?
All SPC5566MZP112R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5566MZP112R meets industry standards.
7.What is the process for return or replacement of SPC5566MZP112R?
All SPC5566MZP112R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5566MZP112R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5566MZP112R part is unused and in its original packaging.
Return procedure for SPC5566MZP112R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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