NXP Semiconductors SPC5602BF2MLL6
- Part No.:
- SPC5602BF2MLL6
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
SPC5602BF2MLL6.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SPC5602BF2MLL6 from NXP Semiconductors is a 32-bit automotive microcontroller based on the Power Architecture® e200z0h core, operating up to 64 MHz with 256 KB code flash, 64 KB data flash, and 24 KB SRAM - all featuring ECC protection. It integrates FlexCAN, LINFlex, DSPI, 10-bit ADC (12-channel), eMIOS-lite timers, and FMPLL for body electronics control in vehicle door modules, lighting systems, and seat controllers.
For engineers reviewing the SPC5602BF2MLL6 datasheet, SPC5602BF2MLL6 pinout, SPC5602BF2MLL6 application, or SPC5602BF2MLL6 equivalent, key selection criteria include its 64-pin LQFP package, VLE instruction encoding for reduced code footprint, integrated memory protection unit (MPU), Nexus 2+ debug interface, and automotive-grade AEC-Q100 qualification.
Technical Context
The SPC5602BF2MLL6 implements the e200z0h CPU core with Variable Length Encoding (VLE) for optimized code density and operates at up to 64 MHz via its Frequency-Modulated PLL (FMPLL). Its crossbar switch enables concurrent access to flash, SRAM, and peripherals by multiple bus masters.
It features an interrupt controller (INTC) supporting 148 vectors, a boot assist module (BAM) enabling flash programming over CAN or SCI, and a real-time counter (RTC) with autonomous wakeup from low-power modes using internal 128 kHz RC oscillator - all tailored for deterministic automotive timing and safety-critical operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h, Power Architecture® embedded category with VLE support for 30–40% smaller code size vs. pure 32-bit encoding |
| Max Operating Frequency | 64 MHz - enables real-time execution of AUTOSAR-compliant tasks and fast PWM generation in motor control loops |
| Code Flash | 256 KB with ECC - supports robust firmware storage and field updates with error detection/correction |
| Data Flash | 64 KB (4 × 16 KB) with ECC - provides non-volatile parameter storage for calibration data and configuration settings |
| SRAM | 24 KB with ECC - ensures reliable runtime variable storage for safety-critical applications |
| ADC Resolution & Channels | 10-bit, 12-channel - sufficient for analog sensor monitoring (e.g., temperature, voltage, potentiometer inputs) |
| FlexCAN Modules | 2 × CAN 2.0B - enables dual-bus communication for distributed body control networks |
| Package | 64-pin LQFP (10 × 10 × 1.4 mm) - compatible with standard automotive PCB assembly processes and thermal management |
Pinout & Package
SPC5602BF2MLL6 uses a 64-pin LQFP package (10 × 10 × 1.4 mm) with exposed pad for thermal dissipation. Pin functions are multiplexed across GPIO, peripheral interfaces (CAN, LIN, SPI), analog inputs (ADC), and system control (RESET, XTAL/EXTAL, voltage supplies).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Asynchronous reset input | Pulled high internally after PHASE2; initiates full device reset sequence including MPU, flash controller, and peripheral initialization |
| XTAL / EXTAL | Crystal oscillator terminals | Supports 4–16 MHz external crystal; enables precise clock source for FMPLL and RTC with ±50 ppm stability |
| VDD_HV / VSS_HV | Digital supply and ground | 3.3 V nominal digital domain; three pairs ensure low-noise power delivery to CPU and peripherals |
| VDD_LV / VSS_LV | Core regulator decoupling | 1.2 V core supply; requires local 100 nF ceramic capacitors per pair for stable e200z0h operation |
| PA[0]–PA[15], PB[0]–PB[15], etc. | Configurable GPIO ports | Up to 45 I/O pins (package-dependent); programmable as input, output, or peripheral alternate function via SIUL PCR registers |
Key Features
| Feature | Design Value |
|---|---|
| VLE instruction encoding | Reduces compiled firmware size by ~35%, lowering flash cost and improving cache efficiency in resource-constrained body ECUs |
| Memory Protection Unit (MPU) | 8-region descriptor support with 32-byte granularity - enforces memory access isolation between AUTOSAR OS tasks and drivers |
| Boot Assist Module (BAM) | Enables in-system flash reprogramming via CAN or SCI without external debugger - critical for OTA updates and production line programming |
| Nexus 2+ debug interface | IEEE-ISTO 5001-2003 Class Two Plus compliant - supports real-time trace, hardware breakpoints, and non-intrusive profiling for ISO 26262 ASIL-B development |
| FMPLL with frequency modulation | Reduces electromagnetic interference (EMI) by spreading spectrum energy - simplifies compliance with CISPR 25 Class 5 automotive EMC requirements |
Applications
| Door Control Module | LED Lighting Controller |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in modern vehicle door modules. IC Role / Device Role / Timing Role: Main application processor executing LIN communication, PWM dimming, and fault diagnostics with <100 µs response latency. Use Value: Integrated 2× FlexCAN and 4× LINFlex enable direct bus connectivity to body domain controller and local sensors without external transceivers. | Use Scenario: Adaptive front/rear lighting with dynamic brightness control, thermal monitoring, and CAN-based diagnostics. IC Role / Device Role / Timing Role: Real-time LED current regulation via eMIOS-lite PWM channels synchronized to ADC temperature readings. Use Value: 12-channel 10-bit ADC and 28 eMIOS channels allow simultaneous monitoring of 6 thermal zones and driving 12 independent LED strings. |
| Seat Position Controller | Smart Junction Box |
Use Scenario: Motorized seat adjustment with position feedback, obstruction detection, and memory recall functions. IC Role / Device Role / Timing Role: Safety-aware motor control unit managing H-bridge drivers, Hall-effect sensors, and EEPROM-stored user profiles. Use Value: ECC-protected 24 KB SRAM and 64 KB data flash ensure integrity of calibration data and seat position maps across 100k+ cycles. | Use Scenario: Power distribution and load switching for 12V accessories (heated seats, infotainment, HVAC) with short-circuit and overtemperature protection. IC Role / Device Role / Timing Role: System manager coordinating CAN messaging, GPIO-controlled power FETs, and watchdog supervision of downstream modules. Use Value: 45 configurable GPIOs and 2× FlexCAN provide scalable I/O for up to 16 switched loads and seamless integration into vehicle-wide CAN backbone. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC5603BF2MLL6 | Same package and pinout; upgraded to 32 KB SRAM, 384 KB code flash, and 28-channel ADC | Supports more complex algorithms (e.g., sensor fusion) and larger AUTOSAR stacks requiring >24 KB RAM | Select when higher memory bandwidth or additional ADC channels are required without changing PCB layout |
| MPC5602BVLH6 | 100-pin LQFP; adds 3rd FlexCAN, 4× LINFlex, and 28-channel ADC but lacks VLE encoding | Suitable for gateway or central body controller roles needing expanded peripheral count and routing flexibility | Choose for designs requiring >2 CAN buses or >4 LIN nodes - requires PCB redesign due to different package |
Compared with SPC5602BF2MLL6, the SPC5603BF2MLL6 offers memory scalability within identical mechanical constraints, while the MPC5602BVLH6 trades pin-count efficiency for expanded I/O and communication resources - making the former ideal for cost-sensitive body nodes and the latter better suited for domain controllers.
Availability
SPC5602BF2MLL6 is available at Aetrix Electronics and suitable for automotive body electronics, lighting control, and seat actuation systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified reliability.
Supply support for SPC5602BF2MLL6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive MCUs and radar technology.
The SPC5602BF2MLL6 belongs to NXP's SPC560x family - designed specifically for cost-optimized, ASIL-B capable body electronics control units where functional safety, flash endurance, and CAN/LIN interoperability are essential.
FAQ
What is the maximum operating temperature range for the SPC5602BF2MLL6?
The SPC5602BF2MLL6 is qualified for operation from −40 °C to 125 °C ambient temperature, meeting AEC-Q100 Grade 1 requirements. This rating is validated across all electrical parameters including flash write/erase endurance, ADC accuracy, and FMPLL lock time - ensuring reliable performance in under-hood and door module environments where thermal cycling exceeds 1000 cycles.
Does the SPC5602BF2MLL6 support ISO 26262 functional safety certification?
Yes, the SPC5602BF2MLL6 is designed to support ASIL-B compliance per ISO 26262. It includes hardware safety mechanisms such as ECC on flash/SRAM, lockstep-capable peripherals (e.g., eMIOS), memory protection unit (MPU), and failure reporting via ECSM. While the device itself is not pre-certified, NXP provides safety manuals, FMEDA reports, and diagnostic software libraries to accelerate ASIL-B system-level certification for SPC5602BF2MLL6-based designs.
How many CAN interfaces does the SPC5602BF2MLL6 support, and what protocol versions are implemented?
The SPC5602BF2MLL6 integrates two FlexCAN modules compliant with CAN 2.0A/B protocol standards, supporting both standard (11-bit) and extended (29-bit) identifier frames. Each module includes 64-message buffers with programmable acceptance filtering, loopback self-test mode, and bus-off recovery - enabling robust communication in distributed body networks without external CAN transceivers beyond physical layer interfacing.
Can the SPC5602BF2MLL6 execute code directly from RAM, and what is the impact on performance?
Yes, the SPC5602BF2MLL6 supports XIP (execute-in-place) from SRAM via its crossbar switch architecture. Running time-critical routines (e.g., motor control ISR, ADC post-processing) from 24 KB ECC-protected SRAM reduces flash access latency by up to 4× versus flash execution, achieving sub-100 ns instruction fetch times. However, SRAM code space is limited and must be loaded at startup - typically used for safety-critical hot loops rather than full application images.
What debug interface does the SPC5602BF2MLL6 provide, and is JTAG sufficient for production programming?
The SPC5602BF2MLL6 provides both JTAG and Nexus 2+ debug interfaces. While JTAG supports boundary-scan testing and basic flash programming, Nexus 2+ is required for real-time trace, non-intrusive profiling, and advanced breakpoint capabilities needed during ISO 26262 development. For production programming, the Boot Assist Module (BAM) enables CAN/SCI-based flashing - eliminating dependency on debug headers and allowing field updates without physical access to JTAG pins.
SPC5602BF2MLL6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LQFP
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 64MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 79
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 24K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 28x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5602BF2MLL6 FAQ
1.How can I place an order for SPC5602BF2MLL6 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5602BF2MLL6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5602BF2MLL6 reliable?
The price and inventory of SPC5602BF2MLL6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5602BF2MLL6 is usually 5 days.
3.What payment methods are accepted for SPC5602BF2MLL6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5602BF2MLL6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5602BF2MLL6?
SPC5602BF2MLL6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5602BF2MLL6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5602BF2MLL6?
For technical support, including SPC5602BF2MLL6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5602BF2MLL6 requirements.
6.How does Aetrix verify that SPC5602BF2MLL6 is sourced from the original manufacturer or authorized distributors?
All SPC5602BF2MLL6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5602BF2MLL6 meets industry standards.
7.What is the process for return or replacement of SPC5602BF2MLL6?
All SPC5602BF2MLL6 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5602BF2MLL6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5602BF2MLL6 part is unused and in its original packaging.
Return procedure for SPC5602BF2MLL6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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