NXP Semiconductors SPC5602BK0MLL6
- Part No.:
- SPC5602BK0MLL6
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
SPC5602BK0MLL6.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SPC5602BK0MLL6 from NXP Semiconductors is a 32-bit automotive microcontroller based on the Power Architecture® e200z0h core, operating up to 64 MHz with 256 KB code flash, 64 KB data flash, and 24 KB SRAM - all featuring ECC protection. It integrates FlexCAN, LINFlex, DSPI, 10-bit ADC (12-channel), eMIOS-lite timers, FMPLL, and Nexus 2+ debug interface for body electronics control applications.
For engineers reviewing the SPC5602BK0MLL6 datasheet, SPC5602BK0MLL6 pinout, SPC5602BK0MLL6 application, or SPC5602BK0MLL6 equivalent, key selection criteria include its 64-pin LQFP package, VLE instruction set for reduced code footprint, integrated memory protection unit (MPU), and automotive-grade qualification per AEC-Q100 Grade 2 (–40°C to +105°C).
Technical Context
The SPC5602BK0MLL6 implements the e200z0h CPU core with Variable Length Encoding (VLE) support, enabling efficient 16/32-bit mixed instruction execution. Its crossbar switch architecture allows concurrent access to flash, SRAM, and peripherals by multiple bus masters, while the FMPLL provides programmable frequency modulation for EMI reduction.
It features a dedicated Boot Assist Module (BAM) for serial flash programming via CAN or SCI, and includes a Memory Protection Unit (MPU) with eight region descriptors and 32-byte granularity for robust memory isolation in safety-critical automotive software stacks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h - single-issue 32-bit Power Architecture core with VLE support for compact firmware binaries |
| Max Operating Frequency | 64 MHz - enables real-time deterministic response in body control modules and gateway nodes |
| Code Flash | 256 KB with ECC - supports secure boot and field firmware updates with error detection/correction |
| Data Flash | 64 KB (4 × 16 KB) with ECC - retains calibration data and configuration parameters across power cycles |
| SRAM | 24 KB with ECC - provides fault-tolerant runtime memory for AUTOSAR OS tasks and stack operations |
| ADC Resolution & Channels | 10-bit, 12-channel - sufficient for sensor monitoring (e.g., HVAC, lighting, door position) |
| FlexCAN Modules | 2 × CAN 2.0B - supports dual-bus communication for distributed body networks with message filtering and buffering |
| Package | 64-pin LQFP (10 × 10 × 1.4 mm) - compatible with standard automotive PCB assembly processes and thermal management |
Pinout & Package
SPC5602BK0MLL6 is housed in a 64-pin LQFP package (10 mm × 10 mm × 1.4 mm), optimized for automotive body electronics with balanced I/O density and thermal performance. Pin assignments follow the MPC560xB series 64-pin configuration, supporting GPIO, peripheral multiplexing, and dedicated voltage domains (VDD_HV, VDD_LV, VDD_BV, VDD_HV_ADC).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Asynchronous reset input | Pulled high after PHASE2; initiates cold/warm reset sequence with internal voltage monitor coordination |
| XTAL / EXTAL | Crystal oscillator interface | Supports external 4–16 MHz crystal or bypass mode; feeds FMPLL for system clock generation |
| VDD_HV / VSS_HV | Digital supply / ground | Primary 3.3 V domain powering core logic, peripherals, and I/O buffers; requires local decoupling |
| VDD_LV / VSS_LV | 1.2 V regulator supply / ground | Feeds internal voltage regulator; three dedicated pairs ensure stable core voltage under dynamic load |
| VDD_HV_ADC / VSS_HV_ADC | Analog reference supply / ground | Isolated 3.3 V and ground for ADC; minimizes digital noise coupling into analog measurements |
| PA[0]–PA[15], PB[0]–PB[15], etc. | Configurable GPIO / peripheral pins | Multi-function pads supporting LINFlex, DSPI, FlexCAN, eMIOS, and WKPU wakeup with programmable drive strength |
Key Features
| Feature | Design Value |
|---|---|
| VLE instruction encoding | Reduces firmware size by up to 30% vs. pure 32-bit encoding - critical for constrained flash budgets in cost-sensitive modules |
| Memory Protection Unit (MPU) | 8-region hardware-enforced memory isolation - enables ASIL-B compliant partitioning of AUTOSAR BSW and application SW |
| Boot Assist Module (BAM) | Enables in-system flash reprogramming over CAN or SCI without external debugger - simplifies OTA update architecture |
| Nexus 2+ debug interface | IEEE-ISTO 5001-2003 Class Two Plus compliance - supports real-time trace, complex breakpoints, and production diagnostics |
| FMPLL with frequency modulation | Spreads spectrum clocking reduces peak EMI emissions - aids compliance with CISPR 25 Class 5 automotive EMC requirements |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
Use Scenario: Centralized management of lighting, wipers, windows, and locks in modern vehicle architectures. IC Role / Device Role / Timing Role: Main application controller executing AUTOSAR-compliant BSW and application software with deterministic timing via PIT and STM. Use Value: 256 KB flash and 24 KB SRAM accommodate multi-feature BCM firmware; dual FlexCAN interfaces enable seamless integration into vehicle backbone and sub-networks. | Use Scenario: Local intelligence for power window lift, mirror fold/unfold, and anti-pinch detection in front/rear doors. IC Role / Device Role / Timing Role: Real-time motor control node using eMIOS-lite PWM outputs and ADC inputs for current sensing and position feedback. Use Value: 12-channel 10-bit ADC supports simultaneous sampling of motor current, temperature, and Hall sensors; LINFlex interface enables low-cost communication with BCM. |
| Roof Module Controller | Seat Position Memory Module |
Use Scenario: Control of sunroof, panoramic roof, and ambient lighting with gesture or button input handling. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating inputs from touch sliders, proximity sensors, and tilt switches via GPIO and ADC. Use Value: 64 KB data flash stores user preferences and calibration offsets; WKPU supports autonomous wake-on-event for low-power standby operation. | Use Scenario: Storing and recalling driver seat position, mirror angles, and steering column settings using non-volatile memory. IC Role / Device Role / Timing Role: Dedicated memory manager interfacing with LIN or CAN bus to receive/store/restore configuration profiles. Use Value: ECC-protected 64 KB data flash ensures reliable retention of safety-critical seat position data over 10+ years and 100k+ cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5604BVLH6 | Higher flash (512 KB), more RAM (48 KB), 144-pin LQFP - larger footprint and higher cost | Targeted at complex gateways or domain controllers requiring expanded peripheral count and memory | Select when >256 KB flash or >24 KB SRAM is required; not drop-in due to package and pinout differences |
| SPC5603CK0MLL6 | Same 64-pin LQFP, but 384 KB flash, 32 KB SRAM, and 28-channel ADC - enhanced analog capability | Better suited for applications needing higher-resolution sensor aggregation (e.g., climate control) | Direct pin-compatible upgrade path if additional flash or ADC channels are needed; identical thermal and layout footprint |
Compared with MPC5604BVLH6, SPC5602BK0MLL6 offers optimal cost/performance balance for entry-level body nodes; versus SPC5603CK0MLL6, it trades flash and ADC channels for lower BOM cost while retaining full peripheral compatibility and software scalability.
Availability
SPC5602BK0MLL6 is available at Aetrix Electronics and suitable for body control modules, door module controllers, roof modules, and seat memory systems requiring stable component supply, long-term automotive lifecycle support, and AEC-Q100 qualification.
Supply support for SPC5602BK0MLL6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Power Architecture® and AUTOSAR-compliant microcontrollers.
The SPC5602BK0MLL6 belongs to the SPC560x automotive MCU family, designed specifically for cost-optimized body electronics applications requiring functional safety, flash-based programmability, and robust EMC performance in harsh vehicle environments.
FAQ
What is the maximum operating temperature range for the SPC5602BK0MLL6?
The SPC5602BK0MLL6 is qualified to AEC-Q100 Grade 2, supporting continuous operation from –40°C to +105°C ambient temperature. This rating is validated across all electrical specifications including flash endurance, SRAM retention, and peripheral timing - making it suitable for under-hood and cabin-mounted automotive modules where thermal stress is significant. The device's on-chip voltage regulator and thermal monitoring circuitry maintain stability within this range.
Does the SPC5602BK0MLL6 support AUTOSAR-compliant software stacks?
Yes, the SPC5602BK0MLL6 fully supports AUTOSAR 4.x-compliant software stacks. Its System Timer Module (STM), Periodic Interrupt Timers (PIT), Memory Protection Unit (MPU), and Nexus 2+ debug interface meet key AUTOSAR OS and ECU abstraction layer requirements. NXP provides certified MCAL drivers and configuration tools (SPC5 Studio) that integrate directly with leading AUTOSAR toolchains, enabling deterministic task scheduling and memory partitioning for ASIL-B applications.
How many CAN interfaces does the SPC5602BK0MLL6 include, and what protocol versions are supported?
The SPC5602BK0MLL6 integrates two FlexCAN modules compliant with ISO 11898-1:2015 (CAN 2.0B). Each supports full CAN protocol features including message buffering, ID filtering, loopback self-test, and error confinement. Both modules operate independently with configurable bit rates up to 1 Mbps and support time-triggered communication modes required for synchronized body network operation. No CAN FD capability is included in this variant.
What debug interface does the SPC5602BK0MLL6 provide, and is JTAG available?
The SPC5602BK0MLL6 provides a Nexus 2+ development interface compliant with IEEE-ISTO 5001-2003 Class Two Plus, offering real-time trace, complex breakpoint triggering, and memory access during run-time. JTAG is also present as a separate boundary-scan interface per IEEE 1149.1, used for manufacturing test and basic debug. Both interfaces share physical pins (TCK, TMS, TDI, TDO), with mode selection controlled by boot configuration - ensuring full visibility without requiring external debug probes beyond standard Nexus-capable tools.
Is the SPC5602BK0MLL6 pin-compatible with other members of the SPC560x family?
The SPC5602BK0MLL6 shares the same 64-pin LQFP package and pinout with other SPC560xB/C variants in the same package option (e.g., SPC5602BK0MLL3, SPC5603CK0MLL6). Signal mapping, power pin locations, and reset behavior are identical across these parts. However, peripheral enablement (e.g., number of FlexCAN modules or ADC channels) and memory sizes differ - meaning firmware must be configured for the specific variant, though PCB layout remains unchanged.
SPC5602BK0MLL6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LQFP
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 64MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 79
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 24K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 28x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5602BK0MLL6 FAQ
1.How can I place an order for SPC5602BK0MLL6 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5602BK0MLL6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5602BK0MLL6 reliable?
The price and inventory of SPC5602BK0MLL6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5602BK0MLL6 is usually 5 days.
3.What payment methods are accepted for SPC5602BK0MLL6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5602BK0MLL6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5602BK0MLL6?
SPC5602BK0MLL6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5602BK0MLL6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5602BK0MLL6?
For technical support, including SPC5602BK0MLL6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5602BK0MLL6 requirements.
6.How does Aetrix verify that SPC5602BK0MLL6 is sourced from the original manufacturer or authorized distributors?
All SPC5602BK0MLL6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5602BK0MLL6 meets industry standards.
7.What is the process for return or replacement of SPC5602BK0MLL6?
All SPC5602BK0MLL6 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5602BK0MLL6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5602BK0MLL6 part is unused and in its original packaging.
Return procedure for SPC5602BK0MLL6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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