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NXP Semiconductors SPC5602DF1CLH3
- Part No.:
- SPC5602DF1CLH3
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
SPC5602DF1CLH3.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:154
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Product details
Overview
SPC5602DF1CLH3 from NXP Semiconductors (formerly Freescale) is an automotive-grade 32-bit Power Architecture® microcontroller featuring the e200z0h CPU core, 256 KB Code Flash with ECC, 64 KB Data Flash with ECC, and 16 KB SRAM with ECC. It operates up to 48 MHz, integrates FlexCAN, 3 LINFlex interfaces, 2 DSPI modules, a 33-channel 12-bit ADC, and eMIOS-lite timers - deployed in central body controllers and smart junction boxes.
For engineers reviewing the SPC5602DF1CLH3 datasheet, SPC5602DF1CLH3 pinout, SPC5602DF1CLH3 application, or SPC5602DF1CLH3 equivalent, key selection criteria include FMPLL clock generation, Nexus Class 1 debug support, 100-pin LQFP package with 79 GPIOs, automotive AEC-Q100 qualification, and boot assist via CAN/SCI for field reprogramming.
Technical Context
The SPC5602DF1CLH3 implements a single-issue e200z0h core compliant with Power Architecture embedded category and supports Variable Length Encoding (VLE) for reduced code footprint. Its memory subsystem includes ECC-protected on-chip Flash and SRAM, managed by dedicated controllers and accessed concurrently via a 64-bit crossbar switch.
Peripherals are orchestrated through the System Integration Unit Lite (SIUL), enabling flexible pin multiplexing and wakeup control across 18 external sources. The FMPLL provides programmable frequency modulation, while the RTC uses internal 128 kHz or 16 MHz RC oscillators for autonomous wake-up with 1 ms resolution and up to 2-second timeout.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h - single-issue, VLE-enabled Power Architecture core optimized for code density and low-power automotive execution. |
| Max Operating Frequency | 48 MHz - defines real-time deterministic timing budget for safety-critical body control tasks. |
| Code Flash | 256 KB with ECC - enables robust storage of AUTOSAR-compliant application firmware and bootloader with error detection/correction. |
| Data Flash | 64 KB with ECC - supports non-volatile parameter storage (e.g., calibration data, configuration profiles) with guaranteed integrity. |
| SRAM | 16 KB with ECC - provides fault-tolerant runtime memory for stack, heap, and critical variables in ASIL-B–level systems. |
| ADC | 33-channel, 12-bit - delivers high-resolution analog sensing for battery monitoring, temperature, and position feedback in multi-sensor vehicle modules. |
| Communication Interfaces | 1 FlexCAN, 3 LINFlex, 2 DSPI - satisfies mixed-network requirements in body domain ECUs with master/slave LIN flexibility and CAN diagnostics. |
| Package | 100-pin LQFP, 14 mm × 14 mm - provides mechanical compatibility with automotive PCB layouts requiring thermal and EMI resilience. |
Pinout & Package
SPC5602DF1CLH3 is housed in a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch), with dedicated supply domains (VDD_HV/VSS_HV for digital logic, VDD_LV/VSS_LV for 1.2 V regulator decoupling, VDD_HV_ADC/VSS_HV_ADC for analog section) and system pins including RESET, EXTAL, and XTAL.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Bidirectional reset input with Schmitt trigger | Active-low asynchronous reset with noise filtering; weak pull-up only after PHASE2 completion ensures reliable power-on initialization. |
| EXTAL / XTAL | Crystal oscillator interface | Supports external 4–16 MHz crystal; EXTAL is analog output, XTAL is analog input - bypass mode allows direct clock injection. |
| VDD_HV / VSS_HV | Digital supply and ground | Multiple distributed pins (5× VDD_HV, 6× VSS_HV) reduce impedance and improve power integrity for high-speed core/peripheral operation. |
| VDD_LV / VSS_LV | 1.2 V regulator decoupling | Three dedicated pairs require local 100 nF capacitors each to stabilize internal voltage regulator output for core logic. |
| PA[0]–PA[15], PB[0]–PB[15], etc. | Configurable GPIO / peripheral multiplexing | 79 total functional pins with SIUL-controlled direction, pull-up/down, and pad type (S/M/F/I/J/X); default tristate at reset prevents bus contention. |
Key Features
| Feature | Design Value |
|---|---|
| VLE instruction encoding | Reduces compiled code size by up to 30% vs. standard 32-bit encoding - lowers Flash cost and improves cache efficiency in memory-constrained ECUs. |
| ECC-protected memories | Single-bit error correction and double-bit error detection across Code Flash, Data Flash, and SRAM - meets ISO 26262 ASIL-B requirements. |
| Boot Assist Module (BAM) | Enables in-system Flash programming over CAN or SCI without external debugger - simplifies OTA updates and production line flashing. |
| Crossbar switch architecture | Allows concurrent access to Flash, SRAM, and peripherals by CPU, eDMA, and other masters - eliminates bus arbitration bottlenecks in real-time control loops. |
| Nexus Class 1 debug interface | IEEE-ISTO 5001-2003 compliant trace and breakpoint support - enables certified toolchain integration for functional safety validation. |
| FMPLL with frequency modulation | Reduces electromagnetic interference (EMI) by spreading spectral energy - aids compliance with CISPR 25 Class 3 automotive EMC standards. |
Applications
| Central Body Controller | Smart Junction Box |
|---|---|
Use Scenario: Centralized management of lighting, door locks, window lifts, and seat position in mid-tier vehicles. IC Role / Device Role / Timing Role: Primary system-on-chip executing AUTOSAR OS, managing LIN/CAN gateway functions, and performing real-time PWM dimming control. Use Value: 256 KB ECC Flash stores full BSW + application stack; 33-channel ADC monitors battery voltage, cabin temperature, and switch states with hardware-triggered CTU synchronization. | Use Scenario: Power distribution and signal aggregation unit routing power and data between front/rear modules and gateway ECU. IC Role / Device Role / Timing Role: High-integrity power domain supervisor with watchdog (SWT), RTC-based sleep/wake scheduling, and FlexCAN diagnostics reporting. Use Value: 16 KB ECC SRAM retains critical state during stop/start cycles; FMPLL modulation reduces conducted emissions on shared power rails. |
| Front Module Control | Seat Control Unit |
Use Scenario: Integrated control of HVAC actuators, mirror positioning, and ambient lighting in premium vehicle front consoles. IC Role / Device Role / Timing Role: Real-time motion controller using eMIOS-lite for synchronized 16-bit PWM outputs and input capture on motor feedback signals. Use Value: 28-channel eMIOS-lite supports simultaneous 4-motor control with dead-time insertion; LINFlex 0 operates as slave for master-slave cluster communication. | Use Scenario: Occupant-position-aware seat adjustment with memory presets, heating, and lumbar support. IC Role / Device Role / Timing Role: Sensor fusion hub combining ADC inputs (potentiometers, thermistors), LINFlex comms to door module, and CAN status broadcast. Use Value: 79 GPIOs enable direct drive of H-bridge drivers and monitoring of 12+ analog sensors; BAM allows dealer-level recalibration via CAN. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC5603DF1MLL3 | Higher-performance e200z3 core, 384 KB Code Flash, 48 KB SRAM, same 100 LQFP package. | Targets more complex ASIL-B applications requiring larger AUTOSAR stacks or additional peripheral channels. | Select when higher CPU throughput or expanded memory is required; software migration path exists but requires revalidation. |
| MPC5604BVLQ100 | Legacy Freescale part with e200z0 core (no VLE), 512 KB Flash, no Data Flash, identical pinout and peripheral set. | Suitable for legacy designs where VLE is unused and larger Flash is needed for dual-bank OTA. | Consider for cost-sensitive brownfield programs; lacks VLE and some ECC coverage features of SPC5602DF1CLH3. |
Compared with SPC5602DF1CLH3, the SPC5603DF1MLL3 offers greater compute headroom and memory for scalable AUTOSAR deployments, while the MPC5604BVLQ100 provides pin-compatible Flash expansion at the expense of modern code-density and ECC enhancements.
Availability
SPC5602DF1CLH3 is available at Aetrix Electronics and suitable for central body controllers, smart junction boxes, and front module control systems requiring stable component supply, long-term automotive lifecycle support, and AEC-Q100 qualified silicon.
Supply support for SPC5602DF1CLH3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.
The SPC5602DF1CLH3 belongs to the SPC560x family of automotive MCUs designed specifically for body electronics and chassis control, emphasizing functional safety, low-power operation, and seamless integration into AUTOSAR-based ECU architectures.
FAQ
What is the maximum operating frequency of the SPC5602DF1CLH3?
The SPC5602DF1CLH3 operates at a maximum frequency of 48 MHz. This speed is achieved using the integrated FMPLL, which generates the system clock from internal or external sources. The e200z0h core sustains deterministic real-time performance at this rate, making the SPC5602DF1CLH3 suitable for time-critical automotive body control tasks such as LIN message scheduling and PWM motor control.
Does the SPC5602DF1CLH3 support AEC-Q100 qualification?
Yes, the SPC5602DF1CLH3 is qualified to AEC-Q100 Grade 2 (−40 °C to +105 °C ambient), meeting automotive reliability and stress-test requirements for body electronics applications. This qualification covers device-level testing including HTOL, TC, and ESD, and is documented in NXP's official product change notifications and qualification reports for the SPC560x series.
How many CAN and LIN interfaces does the SPC5602DF1CLH3 integrate?
The SPC5602DF1CLH3 integrates one FlexCAN module supporting CAN 2.0A/B protocol and three LINFlex modules. LINFlex 0 supports both master and slave modes with eDMA linkage, while LINFlex 1 and 2 operate in master-only mode. This configuration enables the SPC5602DF1CLH3 to serve as a LIN master for multiple slave nodes and a CAN node for gateway or diagnostic communication within the same ECU.
What debug interface does the SPC5602DF1CLH3 provide?
The SPC5602DF1CLH3 includes a Nexus Class 1 debug interface compliant with IEEE-ISTO 5001-2003. It supports real-time tracing, hardware breakpoints, and watchpoint triggering via JTAG. This interface is essential for AUTOSAR development, functional safety verification, and ISO 26262 tool qualification - and is fully supported by Lauterbach TRACE32 and iSYSTEM winIDEA debug tools.
Is the SPC5602DF1CLH3 pin-compatible with other members of the SPC560x family?
The SPC5602DF1CLH3 shares the same 100-pin LQFP package and core pinout (including power, reset, oscillator, and JTAG) with other SPC560x devices like SPC5603D and SPC5604B in the same package variant. However, peripheral pin assignments (e.g., ADC channel mapping, DSPI chip selects) differ across variants, so PCB layout reuse requires verification against specific device reference manuals and signal descriptions.
SPC5602DF1CLH3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- MPC56xx Qorivva
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit
- Speed:
- 32MHz
- Connectivity:
- CANbus, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 16x12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5602DF1CLH3 FAQ
1.How can I place an order for SPC5602DF1CLH3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5602DF1CLH3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5602DF1CLH3 reliable?
The price and inventory of SPC5602DF1CLH3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5602DF1CLH3 is usually 5 days.
3.What payment methods are accepted for SPC5602DF1CLH3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5602DF1CLH3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5602DF1CLH3?
SPC5602DF1CLH3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5602DF1CLH3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5602DF1CLH3?
For technical support, including SPC5602DF1CLH3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5602DF1CLH3 requirements.
6.How does Aetrix verify that SPC5602DF1CLH3 is sourced from the original manufacturer or authorized distributors?
All SPC5602DF1CLH3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5602DF1CLH3 meets industry standards.
7.What is the process for return or replacement of SPC5602DF1CLH3?
All SPC5602DF1CLH3 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5602DF1CLH3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5602DF1CLH3 part is unused and in its original packaging.
Return procedure for SPC5602DF1CLH3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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