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NXP Semiconductors SPC5602DF1CLH3R
- Part No.:
- SPC5602DF1CLH3R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
SPC5602DF1CLH3R.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,580
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Product details
Overview
SPC5602DF1CLH3R from NXP Semiconductors (formerly Freescale) is an automotive-qualified 32-bit Power Architecture® microcontroller featuring the e200z0h CPU core, 256 KB Code Flash with ECC, 64 KB Data Flash with ECC, and 16 KB SRAM with ECC. It operates up to 48 MHz, integrates FlexCAN, 3 LINFlex interfaces, 2 DSPI modules, a 33-channel 12-bit ADC, and eMIOS-lite timers - deployed in central body controllers and smart junction boxes.
For engineers reviewing the SPC5602DF1CLH3R datasheet, SPC5602DF1CLH3R pinout, SPC5602DF1CLH3R application, or SPC5602DF1CLH3R equivalent, key selection criteria include VLE instruction support for code density reduction, FMPLL clock generation, Nexus Class 1 debug interface, and automotive-grade reliability per AEC-Q100 qualification.
Technical Context
The SPC5602DF1CLH3R implements a single-issue e200z0h core compliant with Power Architecture embedded category and supports Variable Length Encoding (VLE) exclusively - enabling mixed 16-/32-bit instructions to reduce memory footprint without compromising performance. Its crossbar switch architecture enables concurrent access to Flash, SRAM, and peripherals by multiple bus masters including eDMA and CPU.
It features a frequency-modulated PLL (FMPLL) for low-EMI clock synthesis, boot assist module (BAM) supporting Flash programming via CAN or SCI, and integrated voltage regulator (VREG) for internal supply regulation. The device includes dedicated analog domains (VDD_HV_ADC/VSS_HV_ADC) and supports autonomous wakeup via RTC with 1 ms resolution and 2-second max timeout.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h - single-issue, VLE-only Power Architecture core optimized for code density and low-power automotive control. |
| Max Clock Speed | 48 MHz - static timing guarantee enabling deterministic real-time response in body control applications. |
| Code Flash | 256 KB with ECC - provides robust non-volatile storage for firmware with error detection/correction for ASIL-B compliance. |
| Data Flash | 64 KB with ECC - supports parameter storage and field updates with guaranteed data integrity over automotive temperature range. |
| SRAM | 16 KB with ECC - on-chip RAM for critical variables and stack with hardware-based memory protection. |
| ADC | 33-channel 12-bit - enables high-resolution sensor monitoring across door, seat, and lighting subsystems. |
| FlexCAN | 1 module with configurable buffers - supports ISO 11898-1 CAN 2.0B communication at up to 1 Mbps for vehicle network integration. |
| Debug Interface | Nexus Class 1 (IEEE-ISTO 5001-2003) - enables real-time trace, breakpoint, and register visibility for AUTOSAR-compliant development. |
Pinout & Package
SPC5602DF1CLH3R is packaged in a 100-pin LQFP (14 mm × 14 mm), RoHS-compliant, with exposed pad thermal enhancement. Pin functions are multiplexed across GPIO, peripheral I/O, power, and debug signals - requiring careful PCR configuration during initialization.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_HV (pins 15,37,52,70,84) | Digital supply voltage | Primary 5 V domain input; requires local decoupling to ensure stable operation of digital logic and peripherals. |
| VSS_HV (pins 14,16,35,51,69,83) | Digital ground | Reference return path for all HV-domain signals; must be connected to low-impedance ground plane. |
| VDD_LV / VSS_LV (pin pairs 19/18, 32/33, 85/86) | 1.2 V regulator decoupling | Three dedicated LV supply pairs for internal core voltage regulation; each requires ≥1 µF ceramic capacitor. |
| RESET (pin 17) | Bidirectional reset with Schmitt trigger | Active-low reset input with noise filtering; weak pull-up only after PHASE2 completion ensures controlled boot sequence. |
| EXTAL / XTAL (pins 36/34) | Crystal oscillator interface | Supports external 4–16 MHz crystal; XTAL must be grounded in bypass mode - critical for FMPLL reference stability. |
| PA[8] / PA[9] (pins 72/73) | Boot configuration pins | PA[8] (ABS[0]) pulled up, PA[9] (FAB) pulled down - forces boot from internal Flash without external intervention. |
Key Features
| Feature | Design Value |
|---|---|
| VLE instruction set | Reduces compiled code size by up to 30% vs. standard 32-bit encoding - directly lowers Flash cost and improves cache efficiency. |
| FMPLL clock synthesis | Enables spread-spectrum modulation to reduce electromagnetic interference (EMI) emissions - simplifies EMC compliance in dense vehicle harnesses. |
| Integrated voltage regulator (VREG) | Eliminates need for external 1.2 V LDO - reduces BOM count and PCB area while maintaining core voltage stability across load transients. |
| RTC with autonomous wakeup | Provides 1 ms resolution timer with 2 s max timeout using 128 kHz RC oscillator - enables ultra-low-power sleep modes without external RTC IC. |
| SIUL peripheral control | Unifies pad configuration, interrupt routing, and wakeup source management - streamlines GPIO initialization and reduces driver complexity. |
| Boot Assist Module (BAM) | Enables Flash reprogramming over CAN or SCI without external debugger - supports secure field updates and diagnostics in production vehicles. |
Applications
| Central Body Controller | Smart Junction Box |
|---|---|
Use Scenario: Manages power distribution, lighting, wipers, and door locks across vehicle domains using centralized logic and CAN/LIN communication. IC Role / Device Role / Timing Role: Primary system-on-chip controller executing body domain software, coordinating LIN slaves, and interfacing with gateway via FlexCAN. Use Value: Integrates 33-channel ADC for analog sensor monitoring, eMIOS-lite for PWM-driven lighting control, and ECC-protected Flash for ASIL-B firmware storage. | Use Scenario: Consolidates fuse box intelligence, battery monitoring, and load switching in modern E/E architectures with distributed power management. IC Role / Device Role / Timing Role: Real-time power supervisor and communication hub - processes current/voltage measurements and relays commands via LINFlex to actuator nodes. Use Value: Leverages 64 KB Data Flash for logging fault events, RTC for timestamped diagnostics, and SIUL for precise GPIO-controlled MOSFET gate driving. |
| Front Module Control | Seat Control Unit |
Use Scenario: Controls HVAC actuators, ambient lighting, and proximity sensors in dashboard and center console assemblies. IC Role / Device Role / Timing Role: Sensor fusion processor and LIN master - acquires thermistor, potentiometer, and Hall-effect inputs via ADC and drives stepper motors via eMIOS outputs. Use Value: Uses 256 KB Code Flash for multi-zone HVAC algorithms, FMPLL for jitter-free PWM fan control, and Nexus debug for calibration traceability. | Use Scenario: Executes position memory, heating, and massage functions in premium automotive seats with safety-critical motor control. IC Role / Device Role / Timing Role: Safety-aware motion controller - runs ASIL-B motor drivers, monitors seat position sensors, and communicates status over CAN. Use Value: Employs ECC-protected 16 KB SRAM for runtime variable storage, PIT timers for precise motor commutation intervals, and FlexCAN for fail-safe command arbitration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC5603DF1MLH3R | Higher memory: 512 KB Code Flash, 96 KB SRAM; adds eDMA controller and enhanced CTU. | Targeted at more complex body domain ECUs requiring larger firmware and advanced peripheral synchronization. | Select when scaling beyond 256 KB Flash or needing hardware-accelerated data movement between ADC and CAN buffers. |
| SPC5604PF1MLH3R | Includes dual e200z0h cores, 1 MB Flash, Ethernet MAC, and additional FlexCAN channel. | Suitable for gateway or domain controller roles requiring inter-network bridging and higher compute throughput. | Choose for applications requiring redundant processing, Ethernet backhaul, or multi-bus CAN routing - not for cost-sensitive body node replacement. |
Compared with SPC5602DF1CLH3R, the SPC5603DF1MLH3R offers expanded memory and eDMA for data-intensive tasks, while the SPC5604PF1MLH3R introduces dual-core execution and Ethernet - making both unsuitable as drop-in replacements but viable for upward migration paths in next-generation platforms.
Availability
SPC5602DF1CLH3R is available at Aetrix Electronics and suitable for central body controllers, smart junction boxes, and front module control systems requiring stable component supply, long-term automotive lifecycle support, and AEC-Q100 qualified silicon.
Supply support for SPC5602DF1CLH3R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Power Architecture and automotive microcontrollers.
The SPC5602DF1CLH3R belongs to the SPC560x family - designed specifically for cost-optimized, ASIL-B capable body electronics applications including junction boxes, door modules, and lighting control units.
FAQ
What is the maximum operating frequency of the SPC5602DF1CLH3R?
The SPC5602DF1CLH3R operates at a maximum static clock frequency of 48 MHz, guaranteed across its full automotive temperature range (−40°C to 125°C). This speed is achieved using the integrated FMPLL with external crystal or internal RC oscillator as reference, and is supported by the e200z0h core's VLE-optimized pipeline. All timing parameters in the datasheet - including Flash access, ADC conversion, and peripheral response - are validated at this frequency.
Does the SPC5602DF1CLH3R support AEC-Q100 qualification?
Yes, the SPC5602DF1CLH3R is qualified to AEC-Q100 Grade 1 (−40°C to +125°C), meeting automotive reliability requirements for body electronics. This includes stress testing for HTOL, TCT, ESD, and latch-up. The device also incorporates ECC on all memory blocks (Code Flash, Data Flash, SRAM) and diagnostic features such as clock monitor unit (CMU) and error correction status module (ECSM) to support ASIL-B system-level compliance.
How many CAN and LIN interfaces does the SPC5602DF1CLH3R integrate?
The SPC5602DF1CLH3R integrates one FlexCAN module supporting ISO 11898-1 CAN 2.0B at up to 1 Mbps, and three LINFlex modules - LINFlex_0 (master/slave), LINFlex_1 (master), and LINFlex_2 (master). LINFlex_0 is connected to eDMA for zero-CPU-overhead message handling, while LINFlex_1 and LINFlex_2 support master-only operation for controlling LIN slave nodes like sensors and actuators in body networks.
What debug interface does the SPC5602DF1CLH3R provide?
The SPC5602DF1CLH3R features a Nexus Class 1 debug interface compliant with IEEE-ISTO 5001-2003, supporting real-time trace, hardware breakpoints, and register access via JTAG. It enables full visibility into program flow and peripheral state during AUTOSAR OS integration and functional safety validation. The interface supports both on-chip and external trace buffers and is accessible through standard tools including Lauterbach TRACE32 and PLS UDE.
Is the SPC5602DF1CLH3R pin-compatible with other SPC560x devices?
No, the SPC5602DF1CLH3R is not pin-compatible with other SPC560x variants such as SPC5603D or SPC5604P - despite sharing the same 100 LQFP package. Differences in peripheral mapping (e.g., ADC channel assignment, DSPI pin locations, and LINFlex signal routing) and power pin distribution require unique PCB layout. Migration between families necessitates schematic and layout revision, though software abstraction layers can ease firmware porting.
SPC5602DF1CLH3R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- MPC56xx Qorivva
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 32MHz
- Connectivity:
- CANbus, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5602DF1CLH3R FAQ
1.How can I place an order for SPC5602DF1CLH3R through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5602DF1CLH3R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5602DF1CLH3R reliable?
The price and inventory of SPC5602DF1CLH3R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5602DF1CLH3R is usually 5 days.
3.What payment methods are accepted for SPC5602DF1CLH3R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5602DF1CLH3R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5602DF1CLH3R?
SPC5602DF1CLH3R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5602DF1CLH3R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5602DF1CLH3R?
For technical support, including SPC5602DF1CLH3R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5602DF1CLH3R requirements.
6.How does Aetrix verify that SPC5602DF1CLH3R is sourced from the original manufacturer or authorized distributors?
All SPC5602DF1CLH3R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5602DF1CLH3R meets industry standards.
7.What is the process for return or replacement of SPC5602DF1CLH3R?
All SPC5602DF1CLH3R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5602DF1CLH3R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5602DF1CLH3R part is unused and in its original packaging.
Return procedure for SPC5602DF1CLH3R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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