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NXP Semiconductors SPC5602DF1CLL3

Part No.:
SPC5602DF1CLL3
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixSPC5602DF1CLL3.pdf
Description:
IC MCU 32BIT 256KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,278

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Product details

Overview

SPC5602DF1CLL3 from NXP Semiconductors (formerly Freescale) is an automotive-grade 32-bit Power Architecture® microcontroller featuring the e200z0h CPU core, 256 KB Code Flash with ECC, 64 KB Data Flash with ECC, and 16 KB SRAM with ECC. It operates up to 48 MHz, integrates FlexCAN, 3 LINFlex interfaces, 2 DSPI modules, a 33-channel 12-bit ADC, and eMIOS-lite timers - deployed in central body controllers and smart junction boxes.

For engineers reviewing the SPC5602DF1CLL3 datasheet, SPC5602DF1CLL3 pinout, SPC5602DF1CLL3 application, or SPC5602DF1CLL3 equivalent, key selection criteria include VLE instruction encoding for code density, FMPLL clock generation, Nexus Class 1 debug support, 100-pin LQFP package, and automotive AEC-Q100 qualification.

Technical Context

The SPC5602DF1CLL3 implements the e200z0h core with Variable Length Encoding (VLE), enabling mixed 16-/32-bit instructions to reduce memory footprint without sacrificing performance. Its crossbar switch architecture allows concurrent access to Flash, SRAM, and peripherals by multiple bus masters including eDMA and CPU.

It features a frequency-modulated PLL (FMPLL) for EMI reduction, boot assist via CAN/SCI, and integrated power management with on-chip voltage regulator (VREG). The device supports AUTOSAR-compliant timing via STM and PIT modules, and includes dedicated hardware blocks for LIN, CAN, and ADC synchronization via CTU.

Key Specifications

ParameterValue and Actual Design Meaning
CPU Coree200z0h Power Architecture® core with VLE support for compact code size and deterministic real-time execution
Max Clock Speed48 MHz - enables real-time control loop execution within automotive body domain timing budgets
Code Flash256 KB with ECC - provides robust non-volatile storage for firmware and calibration data in harsh environments
Data Flash64 KB with ECC - supports field-updatable parameters and wear-leveling for long-term reliability
SRAM16 KB with ECC - ensures data integrity for critical runtime variables and stack operations
ADC33-channel 12-bit - delivers high-resolution sensor acquisition for multi-sensor body control systems
Communication1 FlexCAN, 3 LINFlex (2 master-capable, 1 dual-mode), 2 DSPI - meets automotive network hierarchy requirements
Package100-pin LQFP, 14 mm × 14 mm - compatible with standard automotive PCB assembly processes and thermal management

Pinout & Package

SPC5602DF1CLL3 is housed in a 100-pin LQFP package (14 mm × 14 mm) with exposed pad for thermal dissipation. Pin functions are multiplexed across GPIO, peripheral I/O, power, and debug domains, supporting flexible board-level integration.

Pin/TerminalCircuit RoleDesign Meaning
VDD_HV (pins 15,37,52,70,84)Digital supply voltageProvides main 3.3 V digital rail; five pins ensure low-impedance power delivery and noise immunity
VSS_HV (pins 14,16,35,51,69,83)Digital groundSix dedicated ground pins minimize ground bounce and support signal integrity across high-speed peripherals
VDD_LV / VSS_LV (pins 19,32,85 / 18,33,86)1.2 V core regulator decouplingThree independent VDD_LV/VSS_LV pairs require local 100 nF capacitors for stable internal voltage regulation
RESET (pin 17)Bidirectional reset with Schmitt triggerActive-low input with weak pull-up after PHASE2; supports external reset assertion and watchdog recovery
XTAL / EXTAL (pins 34,36)Crystal oscillator interfaceSupports 4–16 MHz external crystal; XTAL must be grounded in bypass mode per oscillator configuration
PA[8] / PA[9] (pins 72,73)Boot configuration pinsPA[8] (ABS[0]) pull-up and PA[9] (FAB) pull-down define flash-boot mode at power-on reset

Key Features

FeatureDesign Value
VLE instruction encodingReduces code size by up to 30% vs. pure 32-bit encoding - lowers Flash cost and improves cache efficiency
FMPLL clock generationEnables spread-spectrum modulation to suppress electromagnetic interference in vehicle ECU designs
On-chip voltage regulator (VREG)Eliminates need for external 1.2 V regulator - simplifies BOM and reduces PCB area in space-constrained modules
Nexus Class 1 debug interfaceProvides real-time trace, breakpoint, and memory access via JTAG - accelerates AUTOSAR software validation
Cross-triggering unit (CTU)Synchronizes ADC sampling with eMIOS timer events - enables precise sensor-to-actuator timing in closed-loop control
Boot Assist Module (BAM)Allows in-system programming via CAN or SCI without external debugger - supports field firmware updates

Applications

Central Body ControllerSmart Junction Box

Use Scenario: Manages lighting, door locks, window lifts, and seat position memory across vehicle zones.

IC Role / Device Role / Timing Role: Primary system-on-chip executing body domain AUTOSAR BSW and application software with deterministic interrupt latency.

Use Value: Integrated 33-channel ADC and LINFlex interfaces eliminate external signal conditioning and transceivers, reducing component count by ≥40%.

Use Scenario: Distributes power and routes signals between battery, sensors, actuators, and gateway ECUs in modern vehicle architectures.

IC Role / Device Role / Timing Role: Real-time power switching controller with configurable wakeup sources and autonomous RTC-based scheduling.

Use Value: 18 external wakeup sources and 1 ms RTC resolution enable ultra-low-power sleep modes while maintaining sub-2-second max timeout for safety-critical wake events.

Front Module ControlDoor Control Unit

Use Scenario: Coordinates headlamp leveling, washer fluid heating, rain/light sensors, and adaptive front lighting subsystems.

IC Role / Device Role / Timing Role: Sensor fusion hub with synchronized ADC sampling and CTU-triggered PWM outputs for actuator control.

Use Value: Hardware CTU linkage between ADC and eMIOS eliminates software overhead, achieving <5 µs jitter in lamp positioning feedback loops.

Use Scenario: Controls mirror folding, window anti-pinch, handle proximity detection, and interior ambient lighting.

IC Role / Device Role / Timing Role: Mixed-signal controller managing analog sensor inputs, motor drivers, and LIN communication to gateway.

Use Value: On-chip 64 KB Data Flash with ECC stores calibrated motor profiles and usage history, enabling predictive maintenance without cloud dependency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SPC5604BF1MLL3Higher memory (512 KB Code Flash, 64 KB SRAM), adds Ethernet MAC and enhanced eDMA; same 100 LQFP packageTargets gateway ECUs requiring protocol bridging and larger middleware stacksSelect when AUTOSAR Classic + Adaptive coexistence or OTA update capability is required
SPC5603CF1MLL3Reduced memory (128 KB Code Flash, 12 KB SRAM), no CTU block, identical peripheral set otherwiseSuitable for cost-sensitive entry-level body modules with simpler feature setsChoose for non-safety-critical applications where ADC synchronization and advanced diagnostics are not needed

Compared with SPC5604BF1MLL3, the SPC5602DF1CLL3 offers optimized cost and power for body domain control without Ethernet or extended memory; versus SPC5603CF1MLL3, it delivers higher Flash/SRAM capacity and CTU support essential for time-critical sensor-actuator coordination.

Availability

SPC5602DF1CLL3 is available at Aetrix Electronics and suitable for central body controllers, smart junction boxes, and front module control systems requiring stable component supply, long lifecycle assurance, and AEC-Q100 Grade 2 qualification.

Supply support for SPC5602DF1CLL3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Power Architecture® and AUTOSAR-compliant MCUs.

The SPC5602DF1CLL3 belongs to the SPC560x D-series automotive MCU family, designed specifically for cost-optimized, ASIL-B capable body electronics applications requiring functional safety, low power, and high peripheral integration.

FAQ

What is the maximum operating frequency of the SPC5602DF1CLL3?

The SPC5602DF1CLL3 operates at a maximum CPU frequency of 48 MHz, enabled by its frequency-modulated PLL (FMPLL). This speed is validated across the full temperature range (−40°C to 125°C) and supply voltage (3.0 V to 3.6 V), supporting real-time deterministic execution in automotive body control applications. The e200z0h core maintains consistent timing behavior under all specified conditions.

Does the SPC5602DF1CLL3 support AUTOSAR-compliant timing modules?

Yes, the SPC5602DF1CLL3 includes both a System Timer Module (STM) and four Periodic Interrupt Timers (PIT) with 32-bit resolution, fully compliant with AUTOSAR OS timing requirements. These modules provide precise tick generation, deadline monitoring, and schedule management for BSW and RTE layers, with hardware support for time protection and error detection as defined in AUTOSAR 4.x specifications.

What debug interface does the SPC5602DF1CLL3 provide?

The SPC5602DF1CLL3 features a Nexus Class 1 debug interface compliant with IEEE-ISTO 5001-2003, accessible via standard JTAG (TCK/TMS/TDI/TDO). It supports real-time tracing, hardware breakpoints, memory inspection, and register access during active execution - enabling full visibility into AUTOSAR task scheduling, interrupt latency, and memory corruption issues without halting the CPU.

Is the SPC5602DF1CLL3 qualified for automotive use?

Yes, the SPC5602DF1CLL3 is AEC-Q100 qualified for Grade 2 (−40°C to +105°C ambient) operation and designed for automotive body electronics. It incorporates ECC on all on-chip memories, built-in self-test (BIST) logic, FMPLL for EMI reduction, and robust power management - meeting ISO 26262 ASIL-B requirements when used with appropriate safety mechanisms in the system design.

How many LIN channels does the SPC5602DF1CLL3 support, and what are their capabilities?

The SPC5602DF1CLL3 integrates three LINFlex modules: LINFlex_0 supports both master and slave modes with eDMA linkage; LINFlex_1 and LINFlex_2 operate in master-only mode. All three support LIN 2.1/2.2A protocols, automatic header detection, checksum verification, and configurable baud rates up to 20 kbps - enabling simultaneous control of multiple LIN slaves in body domain networks.

SPC5602DF1CLL3 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
100-LQFP
Series:
MPC56xx Qorivva
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
79
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 33x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SPC5602DF1CLL3 FAQ

1.How can I place an order for SPC5602DF1CLL3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC5602DF1CLL3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC5602DF1CLL3 reliable?

The price and inventory of SPC5602DF1CLL3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5602DF1CLL3 is usually 5 days.

3.What payment methods are accepted for SPC5602DF1CLL3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5602DF1CLL3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC5602DF1CLL3?

SPC5602DF1CLL3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC5602DF1CLL3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC5602DF1CLL3?

For technical support, including SPC5602DF1CLL3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5602DF1CLL3 requirements.

6.How does Aetrix verify that SPC5602DF1CLL3 is sourced from the original manufacturer or authorized distributors?

All SPC5602DF1CLL3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5602DF1CLL3 meets industry standards.

7.What is the process for return or replacement of SPC5602DF1CLL3?

All SPC5602DF1CLL3 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5602DF1CLL3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC5602DF1CLL3 part is unused and in its original packaging.

Return procedure for SPC5602DF1CLL3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SPC5602DF1CLL3 Tags

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