My Inquiry
My Account
NXP Semiconductors SPC5602DF1MLH3
- Part No.:
- SPC5602DF1MLH3
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
SPC5602DF1MLH3.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,873
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5602DF1MLH3 from NXP Semiconductors (formerly Freescale) is an automotive-grade 32-bit Power Architecture® microcontroller featuring the e200z0h CPU core, 256 KB Code Flash with ECC, 64 KB Data Flash with ECC, and 16 KB SRAM with ECC. It operates up to 48 MHz, integrates FlexCAN, 3 LINFlex interfaces, 2 DSPI modules, a 33-channel 12-bit ADC, and eMIOS-lite timers - deployed in body control modules and smart junction boxes.
For engineers reviewing the SPC5602DF1MLH3 datasheet, SPC5602DF1MLH3 pinout, SPC5602DF1MLH3 application, or SPC5602DF1MLH3 equivalent, key selection considerations include its 100-pin LQFP package, FMPLL clock generation, Nexus Class 1 debug interface, RTC with 128 kHz/16 MHz sources, and automotive AEC-Q100 qualification for body electronics.
Technical Context
The SPC5602DF1MLH3 implements the e200z0h core with Variable Length Encoding (VLE) for reduced code footprint and executes at up to 48 MHz. Its crossbar switch enables concurrent access to Flash, SRAM, and peripherals by multiple bus masters including eDMA and CPU.
It features a dedicated Boot Assist Module (BAM) supporting Flash programming via CAN or SCI, integrated voltage regulation (VREG), and dual-oscillator support (4–16 MHz external crystal + 16 MHz/128 kHz internal RC). The INTC supports 20 external interrupt sources and 18 wakeup-capable inputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h Power Architecture® core with VLE instruction set; enables compact firmware for resource-constrained automotive ECUs. |
| Max Clock Speed | 48 MHz system frequency; sufficient for real-time body control tasks with deterministic latency. |
| Flash Memory | 256 KB on-chip Code Flash with ECC; supports robust over-the-air (OTA) update storage and error detection/correction. |
| Data Memory | 64 KB Data Flash + 16 KB SRAM, both with ECC; ensures integrity of calibration data and runtime variables in harsh environments. |
| Analog Input | 33-channel 12-bit ADC; provides high-resolution sensing for door position, seat occupancy, ambient light, and battery monitoring. |
| Communication | 1 FlexCAN, 3 LINFlex (2 master-only, 1 master/slave), 2 DSPI; meets vehicle network requirements for body domain communication. |
| Package | 100-pin LQFP, 14 mm × 14 mm; compatible with standard automotive PCB assembly processes and thermal management. |
| Qualification | AEC-Q100 Grade 2 (−40°C to +105°C); certified for under-hood and cabin-mounted automotive applications. |
Pinout & Package
SPC5602DF1MLH3 uses a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch) with dedicated power domains (VDD_HV/VSS_HV for digital logic, VDD_LV/VSS_LV for 1.2 V regulator decoupling, VDD_HV_ADC/VSS_HV_ADC for analog section).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Asynchronous reset input | Active-low Schmitt-trigger input with noise filter; initiates cold boot or recovery sequence upon assertion. |
| EXTAL / XTAL | Crystal oscillator interface | Supports 4–16 MHz external crystal; XTAL is input, EXTAL is output - enables precise timing for CAN/LIN synchronization. |
| VDD_HV / VSS_HV | Digital supply rails | Five pairs distributed across package; reduce IR drop and EMI in high-speed digital switching domains. |
| VDD_LV / VSS_LV | Core regulator decoupling | Three dedicated 1.2 V supply/ground pairs; require local 100 nF ceramic capacitors for stable CPU/SRAM operation. |
| PA[0]–PA[15], PB[0]–PB[15], etc. | Configurable GPIO ports | 79 multiplexed I/O pins with programmable pull-up/down, slew rate, and pad types (S/M/F/I/J); enable flexible peripheral routing without PCB redesign. |
Key Features
| Feature | Design Value |
|---|---|
| VLE-enabled e200z0h core | Reduces firmware memory footprint by up to 30% vs. fixed-length encoding - critical for Flash-constrained body controllers. |
| FMPLL with frequency modulation | Generates stable high-frequency clocks while spreading spectral energy to lower EMI emissions in automotive EMC testing. |
| Boot Assist Module (BAM) | Enables field Flash reprogramming via LIN or CAN without external debugger - simplifies ECU updates in production and service. |
| Real-Time Counter (RTC) | Autonomous 1 ms-resolution timer with 2 s max timeout; wakes CPU from low-power modes using internal 128 kHz RC oscillator. |
| Nexus Class 1 debug interface | IEEE-ISTO 5001-2003 compliant trace and breakpoint capability; supports AUTOSAR-compliant development and diagnostics. |
| Crossbar switch architecture | Allows simultaneous CPU, eDMA, and peripheral access to memory - eliminates bus contention in multi-threaded body control tasks. |
Applications
| Body Control Module (BCM) | Smart Junction Box (SJB) |
|---|---|
Use Scenario: Centralized control of lighting, wipers, locks, and windows in modern vehicles. IC Role / Device Role / Timing Role: Main system-on-chip executing body domain software stack with real-time scheduling via PIT and STM. Use Value: Integrated 33-channel ADC monitors switch states and sensor inputs; FlexCAN handles communication with gateway and other ECUs. | Use Scenario: Power distribution and load switching unit managing fuses, relays, and diagnostics across vehicle zones. IC Role / Device Role / Timing Role: High-integration MCU managing power domain sequencing, short-circuit detection, and LIN-based slave node coordination. Use Value: 79 configurable GPIOs drive solid-state relays and monitor current sense signals; LINFlex 0 operates as slave for master-controlled power arbitration. |
| Front Module Controller | Seat Control Unit |
Use Scenario: Integration of HVAC, headlight leveling, rain/light sensors, and mirror controls into a single front-end module. IC Role / Device Role / Timing Role: Sensor fusion hub with synchronized ADC sampling triggered by CTU and eMIOS timers. Use Value: Cross Triggering Unit (CTU) aligns ADC conversions with PWM outputs for closed-loop ambient light compensation. | Use Scenario: Motorized seat positioning with memory, heating, and occupancy detection. IC Role / Device Role / Timing Role: Motion controller executing position feedback loops using eMIOS PWM and ADC inputs. Use Value: eMIOS-lite provides 16-bit resolution PWM for smooth motor control; 12-bit ADC reads potentiometers and thermistors with ±1 LSB accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5604B | Higher performance e200z4 core, 512 KB Flash, 64 KB SRAM, adds Ethernet MAC and enhanced security features. | Targeted at gateway and domain controller roles requiring higher throughput and secure boot. | Select MPC5604B when migrating to AUTOSAR Classic with Ethernet backhaul or needing extended memory for complex diagnostics. |
| SPC5603CK0MLL3 | Same e200z0h core, but 64-pin LQFP, 128 KB Code Flash, 33-channel ADC, and no LINFlex slave capability on LIN0. | Suitable for cost-optimized body nodes where pin count and Flash size are constrained. | Choose SPC5603CK0MLL3 for space-limited modules like door modules where 64-pin footprint and reduced Flash suffice. |
Compared with MPC5604B, SPC5602DF1MLH3 offers optimized cost and power for entry-level body control, while SPC5603CK0MLL3 trades package size and peripheral flexibility for lower BOM cost - making SPC5602DF1MLH3 the balanced choice for full-featured junction boxes and BCMs.
Availability
SPC5602DF1MLH3 is available at Aetrix Electronics and suitable for automotive body control modules, smart junction boxes, front-end modules, and seat control units requiring stable component supply, long-term lifecycle support, and AEC-Q100 compliance.
Supply support for SPC5602DF1MLH3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure solutions, with deep expertise in secure microcontrollers and edge processing.
The SPC5602DF1MLH3 belongs to NXP's SPC560x automotive MCU family, designed specifically for central body electronics applications requiring functional safety, low-power operation, and robust communication interfaces.
FAQ
What is the operating temperature range for the SPC5602DF1MLH3?
The SPC5602DF1MLH3 is qualified to AEC-Q100 Grade 2, supporting continuous operation from −40°C to +105°C ambient temperature. This rating covers typical under-dash and engine-compartment-proximate locations in automotive body electronics, and is validated per JEDEC JESD22-A108 thermal cycling and high-temperature operating life tests.
Does the SPC5602DF1MLH3 support in-system programming via CAN?
Yes, the SPC5602DF1MLH3 supports in-system Flash programming via CAN using its Boot Assist Module (BAM). The BAM executes VLE code from ROM to configure the CAN peripheral and receive firmware images - enabling secure, production-line and dealership-level reprogramming without JTAG hardware.
What debug interface does the SPC5602DF1MLH3 provide?
The SPC5602DF1MLH3 includes a Nexus Class 1 debug interface compliant with IEEE-ISTO 5001-2003. It supports real-time trace, hardware breakpoints, and watchpoints via the JTAG port, and is fully supported by Lauterbach TRACE32 and PLS UDE debug tools for AUTOSAR development.
How many CAN and LIN interfaces does the SPC5602DF1MLH3 integrate?
The SPC5602DF1MLH3 integrates one FlexCAN 2.0B module and three LINFlex modules. LINFlex 0 supports both master and slave modes (with eDMA linkage), while LINFlex 1 and 2 operate in master-only mode - enabling hierarchical LIN networks in body domain architectures.
Is the SPC5602DF1MLH3 pin-compatible with other MPC5602D variants?
Yes, the SPC5602DF1MLH3 shares the same 100-pin LQFP mechanical footprint and signal mapping with other MPC5602D devices in the LH package variant (e.g., SPC5602DK0MLH3). Pin functions, power domains, and reset behavior are identical - allowing direct substitution where Flash size and feature enablement match design requirements.
SPC5602DF1MLH3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 32MHz
- Connectivity:
- CANbus, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5602DF1MLH3 FAQ
1.How can I place an order for SPC5602DF1MLH3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5602DF1MLH3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5602DF1MLH3 reliable?
The price and inventory of SPC5602DF1MLH3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5602DF1MLH3 is usually 5 days.
3.What payment methods are accepted for SPC5602DF1MLH3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5602DF1MLH3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5602DF1MLH3?
SPC5602DF1MLH3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5602DF1MLH3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5602DF1MLH3?
For technical support, including SPC5602DF1MLH3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5602DF1MLH3 requirements.
6.How does Aetrix verify that SPC5602DF1MLH3 is sourced from the original manufacturer or authorized distributors?
All SPC5602DF1MLH3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5602DF1MLH3 meets industry standards.
7.What is the process for return or replacement of SPC5602DF1MLH3?
All SPC5602DF1MLH3 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5602DF1MLH3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5602DF1MLH3 part is unused and in its original packaging.
Return procedure for SPC5602DF1MLH3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5602DF1MLH3 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
