NXP Semiconductors SPC5602DF1MLL3R
- Part No.:
- SPC5602DF1MLL3R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
SPC5602DF1MLL3R.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,445
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5602DF1MLL3R from NXP Semiconductors (formerly Freescale) is an automotive-grade 32-bit Power Architecture® microcontroller featuring the e200z0h CPU core, 256 KB Code Flash with ECC, 64 KB Data Flash with ECC, and 16 KB SRAM with ECC. It operates up to 48 MHz, integrates FlexCAN, 3 LINFlex interfaces, 2 DSPI modules, a 33-channel 12-bit ADC, and eMIOS-lite timers - deployed in central body controllers and smart junction boxes.
For engineers reviewing the SPC5602DF1MLL3R datasheet, SPC5602DF1MLL3R pinout, SPC5602DF1MLL3R application, or SPC5602DF1MLL3R equivalent, key selection criteria include VLE instruction support for code density reduction, FMPLL clock generation, Nexus Class 1 debug interface, 100-pin LQFP package, and automotive AEC-Q100 qualification.
Technical Context
The SPC5602DF1MLL3R implements a single-issue e200z0h core compliant with Power Architecture embedded category and supports Variable Length Encoding (VLE) to reduce code footprint. Its memory subsystem includes ECC-protected 256 KB Code Flash, 64 KB Data Flash, and 16 KB SRAM, all accessible via a 64-bit-wide crossbar switch enabling concurrent access by multiple bus masters.
Peripherals are tightly integrated through dedicated bridges: FlexCAN uses configurable message buffers; LINFlex modules support master/slave operation with DMA linkage; the 33-channel 12-bit ADC features CTU-triggered synchronization; and eMIOS-lite provides flexible 16-bit timer I/O with input capture, output compare, and PWM functions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h 32-bit Power Architecture core with VLE support for reduced code size and optimized low-power execution |
| Max Operating Frequency | 48 MHz - enables real-time control loop execution within automotive timing budgets |
| Code Flash | 256 KB with ECC - ensures robust program storage and error detection/correction in safety-critical applications |
| Data Flash | 64 KB with ECC - provides non-volatile parameter storage with integrity protection |
| SRAM | 16 KB with ECC - delivers reliable runtime data storage for AUTOSAR OS and application variables |
| ADC | 33-channel 12-bit SAR ADC - supports high-resolution sensor acquisition across vehicle body systems |
| Communication Interfaces | 1 FlexCAN, 3 LINFlex (0: master/slave; 1&2: master), 2 DSPI - meets mixed-network requirements in body electronics |
| Package | 100-pin LQFP, 14 mm × 14 mm - compatible with standard automotive PCB assembly processes |
Pinout & Package
SPC5602DF1MLL3R is housed in a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch). Pin functions are multiplexed across GPIO, peripheral signals (FlexCAN, LINFlex, DSPI, ADC), and system resources (RESET, XTAL/EXTAL, voltage supplies).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Active-low bidirectional reset with Schmitt trigger | Enables robust noise-immune system initialization and recovery; weak pull-up active only after PHASE2 reset completion |
| XTAL / EXTAL | Crytal oscillator input/output pair | Supports external 4–16 MHz crystal or bypass mode; critical for FMPLL reference clock stability |
| VDD_HV / VSS_HV | Digital supply and ground (3.3 V nominal) | Five dedicated pins ensure low-impedance power delivery and noise isolation for digital logic domains |
| VDD_LV / VSS_LV | 1.2 V regulator decoupling pair | Three independent VDD_LV/VSS_LV pairs require local 100 nF capacitors to stabilize internal core voltage |
| PA[0]–PA[15], PB[0]–PB[15], etc. | Configurable functional port pins | Up to 79 GPIOs with programmable pad types (S/M/F/I/J/X); support peripheral alternate functions including ADC inputs, LIN/CAN transceivers, and eMIOS channels |
Key Features
| Feature | Design Value |
|---|---|
| VLE-enabled e200z0h core | Reduces firmware memory footprint by up to 30% vs. fixed-length encoding - lowers Flash cost and improves cache efficiency |
| ECC-protected memory hierarchy | End-to-end error detection and correction on Code Flash, Data Flash, and SRAM - satisfies ASIL-B functional safety requirements |
| FMPLL with frequency modulation | Generates precise system clocks while reducing EMI through spread-spectrum modulation - simplifies EMC compliance |
| Boot Assist Module (BAM) | Enables in-system flash programming over CAN or SCI without external debugger - accelerates field updates and production programming |
| Nexus Class 1 debug interface | IEEE-ISTO 5001-2003 compliant trace and breakpoint support - enables real-time debugging of AUTOSAR stacks and time-critical tasks |
| Crossbar switch architecture | 3×3 interconnect supporting simultaneous access to Flash, SRAM, and peripherals by CPU, eDMA, and debug host - eliminates bus contention bottlenecks |
Applications
| Central Body Controller | Smart Junction Box |
|---|---|
Use Scenario: Manages lighting, door locks, window lifts, and seat position memory across vehicle zones. IC Role / Device Role / Timing Role: Primary system-on-chip executing AUTOSAR-compliant BSW and application software with deterministic interrupt latency. Use Value: Integrated 33-channel ADC and LINFlex interfaces eliminate external signal conditioning ICs and reduce BOM count by ≥4 components per node. |
Use Scenario: Consolidates power distribution, fuse monitoring, and load switching for front/rear vehicle domains. IC Role / Device Role / Timing Role: Real-time power management controller with periodic interrupt timers (PIT) and RTC wakeup for sleep-mode energy optimization. Use Value: On-chip 16 KB SRAM with ECC enables safe storage of fault logs and configuration parameters during battery disconnect events. |
| Front Module Control | Seat Control Unit |
Use Scenario: Coordinates HVAC actuators, mirror positioning, and headlight leveling using analog sensors and motor drivers. IC Role / Device Role / Timing Role: Sensor fusion hub with CTU-synchronized ADC sampling and eMIOS-generated PWM for motor control. Use Value: Cross-triggering unit (CTU) aligns ADC conversions with eMIOS timer events - achieves sub-microsecond phase coherence for closed-loop control. |
Use Scenario: Controls multi-axis seat motors, heating elements, and occupancy detection via capacitive sensing. IC Role / Device Role / Timing Role: Safety-aware motion controller with watchdog (SWT), NMI for emergency stop, and FlexCAN for diagnostic communication. Use Value: Software Watchdog Timer (SWT) and Non-Maskable Interrupt (NMI) provide layered fault response - meets ISO 26262 ASIL-B hardware metrics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC5604PF1MLL3 | Higher integration: 512 KB Code Flash, 64 KB SRAM, dual FlexCAN, additional LINFlex and DSPI modules | Targeted at more complex body domain controllers requiring extended connectivity and larger firmware | Select when >256 KB Flash or dual CAN is required; not pin-compatible due to different peripheral mapping and package (144-pin LQFP) |
| MPC5602BK0MLL3R | Same core and memory sizes but lacks FMPLL frequency modulation and has reduced ADC channel count (16 ch) | Suitable for cost-sensitive entry-level body nodes where EMI reduction and high-resolution sensing are not critical | Consider for legacy designs or lower-tier vehicles; shares same 100-pin LQFP footprint but requires validation of peripheral register compatibility |
Compared with SPC5602DF1MLL3R, the SPC5604PF1MLL3 offers greater memory and interface scalability at the cost of higher BOM and layout complexity, while the MPC5602BK0MLL3R trades FMPLL and ADC capability for cost reduction - making SPC5602DF1MLL3R the optimal balance for mid-tier automotive body control.
Availability
SPC5602DF1MLL3R is available at Aetrix Electronics and suitable for central body controllers, smart junction boxes, and front module control systems requiring stable component supply, long-term automotive lifecycle support, and AEC-Q100 qualified silicon.
Supply support for SPC5602DF1MLL3R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in Power Architecture and automotive MCU platforms.
The SPC5602DF1MLL3R belongs to the SPC560x D-series automotive microcontrollers, designed specifically for cost-optimized, ASIL-B-capable body electronics control units requiring high integration, functional safety, and production-ready toolchain support.
FAQ
What is the maximum operating frequency of the SPC5602DF1MLL3R?
The SPC5602DF1MLL3R operates at a maximum frequency of 48 MHz. This speed is achieved using the integrated Frequency-Modulated Phase-Locked Loop (FMPLL), which derives the system clock from an external crystal (4–16 MHz) or internal RC oscillator. The 48 MHz clock enables deterministic execution of AUTOSAR-compliant real-time tasks in automotive body control applications.
Does the SPC5602DF1MLL3R support functional safety standards like ISO 26262?
Yes, the SPC5602DF1MLL3R supports ISO 26262 ASIL-B development. Its ECC-protected memories (256 KB Code Flash, 64 KB Data Flash, 16 KB SRAM), lockstep-capable peripherals, Nexus Class 1 debug interface, and built-in self-test features (via ECSM and CMU) provide the hardware foundation required for ASIL-B compliance. System-level certification remains the responsibility of the end application developer.
How many LIN and CAN interfaces does the SPC5602DF1MLL3R include?
The SPC5602DF1MLL3R integrates three LINFlex modules (LINFlex_0, LINFlex_1, LINFlex_2) and one FlexCAN module. LINFlex_0 supports both master and slave modes with eDMA linkage; LINFlex_1 and LINFlex_2 operate in master mode only. The single FlexCAN module provides configurable message buffers and supports standard CAN 2.0A/B protocols - sufficient for body network diagnostics and actuator control.
What package type and pin count does the SPC5602DF1MLL3R use?
The SPC5602DF1MLL3R is packaged in a 100-pin LQFP (Low-Profile Quad Flat Package) with 14 mm × 14 mm dimensions and 0.5 mm lead pitch. This package is explicitly documented in the MPC5602D datasheet Rev. 6 and supports full pin functionality including all 79 configurable GPIOs, peripheral signals, and dedicated power/ground pins required for automotive board-level design.
Can the SPC5602DF1MLL3R be programmed in-system without a JTAG debugger?
Yes, the SPC5602DF1MLL3R supports in-system programming via its Boot Assist Module (BAM), which allows flash memory programming over CAN or SCI serial interfaces. This capability enables field firmware updates and high-volume production programming without requiring a JTAG probe - though JTAG remains available for full-featured debug and trace via the Nexus Class 1 interface.
SPC5602DF1MLL3R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LQFP
- Series:
- MPC56xx Qorivva
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 32MHz
- Connectivity:
- CANbus, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 79
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 33x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5602DF1MLL3R FAQ
1.How can I place an order for SPC5602DF1MLL3R through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5602DF1MLL3R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5602DF1MLL3R reliable?
The price and inventory of SPC5602DF1MLL3R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5602DF1MLL3R is usually 5 days.
3.What payment methods are accepted for SPC5602DF1MLL3R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5602DF1MLL3R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5602DF1MLL3R?
SPC5602DF1MLL3R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5602DF1MLL3R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5602DF1MLL3R?
For technical support, including SPC5602DF1MLL3R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5602DF1MLL3R requirements.
6.How does Aetrix verify that SPC5602DF1MLL3R is sourced from the original manufacturer or authorized distributors?
All SPC5602DF1MLL3R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5602DF1MLL3R meets industry standards.
7.What is the process for return or replacement of SPC5602DF1MLL3R?
All SPC5602DF1MLL3R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5602DF1MLL3R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5602DF1MLL3R part is unused and in its original packaging.
Return procedure for SPC5602DF1MLL3R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5602DF1MLL3R Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

