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NXP Semiconductors SPC5602DF1VLH3R

Part No.:
SPC5602DF1VLH3R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixSPC5602DF1VLH3R.pdf
Description:
IC MCU 32BIT 256KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,971

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Product details

Overview

SPC5602DF1VLH3R from NXP Semiconductors (formerly Freescale) is an automotive-grade 32-bit Power Architecture® microcontroller featuring the e200z0h CPU core, 256 KB Code Flash with ECC, 64 KB Data Flash with ECC, and 16 KB SRAM with ECC. It operates up to 48 MHz and integrates FlexCAN, 3 LINFlex interfaces, 2 DSPI modules, a 33-channel 12-bit ADC, and eMIOS-lite for timing control - deployed in central body controllers and smart junction boxes.

For engineers reviewing the SPC5602DF1VLH3R datasheet, SPC5602DF1VLH3R pinout, SPC5602DF1VLH3R application, or SPC5602DF1VLH3R equivalent, key selection criteria include VLE instruction support for code density reduction, FMPLL clock generation, Nexus Class 1 debug interface, 100-pin LQFP package with 79 GPIOs, and automotive AEC-Q100 qualification.

Technical Context

The SPC5602DF1VLH3R implements the e200z0h core with Variable Length Encoding (VLE) only - no full Power ISA - enabling compact firmware for resource-constrained automotive ECUs. Its memory subsystem includes ECC-protected Code Flash (256 KB), Data Flash (64 KB), and SRAM (16 KB), all accessible via a 64-bit-wide crossbar switch supporting concurrent access from multiple bus masters including eDMA and peripherals.

Peripheral integration centers on deterministic real-time operation: FlexCAN supports configurable message buffers and CAN 2.0B; LINFlex modules offer master/slave capability (LINFlex0) and dual master mode (LINFlex1/2); the 33-channel 12-bit ADC features CTU-triggered synchronization; and eMIOS-lite provides 16-bit input capture, output compare, and PWM with flexible channel grouping (Type X/Y/G/H).

Key Specifications

ParameterValue and Actual Design Meaning
CPU Coree200z0h with VLE-only instruction set - reduces flash footprint by ~30% vs. full 32-bit encoding, critical for boot ROM and safety-critical code space.
Max Operating Frequency48 MHz - enables real-time response in body control tasks such as window lift sequencing and mirror positioning.
Code Flash256 KB with ECC - supports ASIL-B compliant firmware storage and field updates without corruption risk.
Data Flash64 KB with ECC - retains calibration data, odometer values, and configuration parameters across power cycles with error correction.
SRAM16 KB with ECC - provides fault-tolerant runtime memory for AUTOSAR OS stacks and safety monitor variables.
ADC Resolution & Channels12-bit, 33 channels - captures sensor inputs (temperature, voltage, position) with ±1 LSB INL for HVAC and lighting control.
Communication Interfaces1 FlexCAN, 3 LINFlex (0: master/slave; 1/2: master), 2 DSPI - meets multi-bus vehicle architecture requirements for body domain communication.
Package100-pin LQFP, 14 mm × 14 mm - compatible with standard automotive PCB assembly processes and thermal management for under-hood mounting.

Pinout & Package

SPC5602DF1VLH3R is housed in a 100-pin LQFP (14 mm × 14 mm) package with exposed pad for thermal dissipation. Pin functions are multiplexed across SIUL-controlled GPIOs, supporting up to 79 configurable I/Os depending on peripheral enable state.

Pin/TerminalCircuit RoleDesign Meaning
VDD_HV (pins 15,37,52,70,84)Digital supply voltageSupplies core logic at nominal 3.3 V; five dedicated pins reduce IR drop and improve noise immunity in high-speed switching domains.
VSS_HV (pins 14,16,35,51,69,83)Digital groundSix return paths ensure low-impedance reference for digital I/O and internal logic, minimizing ground bounce during simultaneous GPIO transitions.
RESET (pin 17)Bidirectional reset with Schmitt triggerAccepts external reset assertion and generates internal POR/NMI signals; weak pull-up after PHASE2 enables reliable boot sequence initiation.
XTAL / EXTAL (pins 34,36)Crystal oscillator interfaceSupports 4–16 MHz external crystal; differential input stage enables robust clock sourcing for FMPLL with <±100 ppm stability over temperature.
PA[8] / ABS[0] (pin 72)Boot mode selectPull-up at reset configures device to boot from internal flash - essential for fail-safe startup in junction box applications.
PA[9] / FAB (pin 73)Factory boot selectPull-down at reset forces serial boot via CAN or SCI using BAM - enables reprogramming without JTAG during service operations.

Key Features

FeatureDesign Value
VLE instruction encodingReduces compiled firmware size by up to 30%, lowering required flash capacity and enabling faster flash programming in production test.
ECC-protected memoriesCorrects single-bit errors and detects double-bit errors in Code Flash, Data Flash, and SRAM - satisfies ISO 26262 ASIL-B requirements for memory safety.
FMPLL with frequency modulationGenerates stable system clocks while spreading spectral energy to reduce EMI emissions - critical for passing CISPR 25 Class 5 radiated emissions tests.
Nexus Class 1 debug interfaceEnables real-time trace, non-intrusive breakpoints, and hardware watchpoints - accelerates AUTOSAR BSW validation and functional safety verification.
CTU-synchronized ADCTriggers precise ADC conversions aligned with eMIOS or PIT timer events - eliminates jitter in motor current sampling for seat actuator control loops.
SIUL-configurable GPIOs79 pins support dynamic remapping of peripheral functions (e.g., LIN/CAN/DSPI) without hardware changes - simplifies variant management across vehicle platforms.

Applications

Central Body ControllerSmart Junction Box

Use Scenario: Manages power distribution, lighting, wipers, and door locks across vehicle body networks.

IC Role / Device Role / Timing Role: Primary system-on-chip executing AUTOSAR-compliant body domain controller software with real-time scheduling via STM and PIT.

Use Value: Integrates FlexCAN for gateway communication, LINFlex for slave node control, and 33-channel ADC for ambient/light sensor monitoring - consolidating three legacy ICs into one AEC-Q100 qualified device.

Use Scenario: Distributes fused power to interior modules (mirrors, seats, HVAC) while monitoring load currents and faults.

IC Role / Device Role / Timing Role: Safety-monitoring MCU running diagnostic routines with periodic interrupt timers (PIT) and autonomous wakeup via RTC for sleep-mode current audits.

Use Value: Uses 64 KB Data Flash with ECC to retain fuse mapping and fault logs; leverages WKPU with 18 external wakeup sources to respond within 1 ms to door handle or key fob events.

Front Module ControlSeat Control Unit

Use Scenario: Controls headlamp leveling, washer fluid heating, and adaptive front-lighting systems (AFS) in premium vehicles.

IC Role / Device Role / Timing Role: Real-time motion controller coordinating LINFlex-driven actuators and ADC-monitored temperature sensors with sub-millisecond loop timing.

Use Value: eMIOS-lite's Type G/H timer channels generate synchronized PWM for brushless motor drivers; CTU ensures phase-aligned current sampling for torque ripple suppression.

Use Scenario: Drives seat position motors, memory functions, and occupant detection via pressure sensors and seatbelt switches.

IC Role / Device Role / Timing Role: Motor control MCU executing closed-loop position algorithms using eMIOS input capture for encoder feedback and PWM outputs for H-bridge gate drivers.

Use Value: 16 KB SRAM with ECC stores PID coefficients and position history; 12-bit ADC resolves 0.1° seat angle changes with <±0.5° total error across -40°C to 125°C.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SPC5603DK0MLH3RHigher-performance e200z3 core, 512 KB Code Flash, 48 KB SRAM, adds Ethernet MAC and additional DSPI.Targeted at gateway and domain controller roles requiring higher throughput and network connectivity.Select when migrating from body control to zone controller architecture with Ethernet backbone integration.
SPC5604PK0MLH3Re200z4 core, 1 MB Code Flash, 80 KB SRAM, dual FlexCAN, enhanced security (HSM), no LINFlex.Designed for safety-critical chassis and powertrain applications requiring ASIL-D compliance and secure boot.Choose for new designs needing HSM-based secure OTA updates and dual-CAN redundancy - not a drop-in replacement for LIN-dependent body systems.

Compared with SPC5602DF1VLH3R, the SPC5603DK0MLH3R offers greater memory and peripheral bandwidth for evolving domain architectures, while the SPC5604PK0MLH3R shifts focus toward security and functional safety at the expense of LIN support - making SPC5602DF1VLH3R optimal for cost-sensitive, LIN-heavy body electronics where VLE efficiency and AEC-Q100 reliability are primary.

Availability

SPC5602DF1VLH3R is available at Aetrix Electronics and suitable for central body controllers, smart junction boxes, front module control units, and seat control units requiring stable component supply, long-term automotive lifecycle support, and AEC-Q100 qualified inventory.

Supply support for SPC5602DF1VLH3R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure solutions, with deep expertise in secure microcontrollers and radar processing.

The SPC5602DF1VLH3R belongs to the SPC560x family of automotive MCUs designed specifically for body electronics and chassis control - emphasizing functional safety, low-power operation, and seamless integration with AUTOSAR and Classic Platform software stacks.

FAQ

What is the maximum operating frequency of the SPC5602DF1VLH3R?

The SPC5602DF1VLH3R operates at a maximum frequency of 48 MHz. This speed is achieved using the integrated FMPLL with external crystal (4–16 MHz) or internal RC oscillators. The e200z0h core delivers deterministic real-time performance suitable for body control tasks such as window lift sequencing and mirror positioning, while maintaining low power consumption in sleep modes.

Does the SPC5602DF1VLH3R support AUTOSAR-compliant software stacks?

Yes, the SPC5602DF1VLH3R supports AUTOSAR-compliant software stacks. Its System Timer Module (STM), Periodic Interrupt Timers (PIT), and Nexus Class 1 debug interface are explicitly designed for AUTOSAR OS task scheduling, timing services, and runtime error detection. NXP provides validated MCAL drivers and configuration tools compatible with major AUTOSAR vendors, enabling rapid integration into Classic Platform implementations.

What type of flash memory does the SPC5602DF1VLH3R include, and how is it protected?

The SPC5602DF1VLH3R includes 256 KB of Code Flash and 64 KB of Data Flash, both featuring Error Correction Code (ECC) circuitry. ECC provides single-bit error correction and double-bit error detection - meeting ISO 26262 ASIL-B requirements for memory safety. This protection applies during normal operation, erase/write cycles, and power-loss scenarios, ensuring firmware integrity and calibration data retention.

How many LIN and CAN interfaces does the SPC5602DF1VLH3R support?

The SPC5602DF1VLH3R supports three LINFlex modules and one FlexCAN module. LINFlex0 operates in master/slave mode and connects to eDMA for zero-CPU-overhead messaging; LINFlex1 and LINFlex2 operate in master-only mode. The single FlexCAN module supports CAN 2.0B protocol with configurable message buffers, enabling communication with engine, transmission, and gateway ECUs in body domain networks.

Is the SPC5602DF1VLH3R qualified for automotive use, and what is its temperature grade?

Yes, the SPC5602DF1VLH3R is AEC-Q100 qualified for automotive applications and rated for operation from −40°C to +125°C (junction temperature). It meets stringent automotive reliability standards including HTOL, ESD, and EMC testing per CISPR 25 and ISO 11452. The device is commonly deployed in under-hood and cabin-mounted ECUs such as smart junction boxes and seat control units.

SPC5602DF1VLH3R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
64-LQFP
Series:
MPC56xx Qorivva
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SPC5602DF1VLH3R FAQ

1.How can I place an order for SPC5602DF1VLH3R through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC5602DF1VLH3R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC5602DF1VLH3R reliable?

The price and inventory of SPC5602DF1VLH3R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5602DF1VLH3R is usually 5 days.

3.What payment methods are accepted for SPC5602DF1VLH3R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5602DF1VLH3R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC5602DF1VLH3R?

SPC5602DF1VLH3R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC5602DF1VLH3R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC5602DF1VLH3R?

For technical support, including SPC5602DF1VLH3R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5602DF1VLH3R requirements.

6.How does Aetrix verify that SPC5602DF1VLH3R is sourced from the original manufacturer or authorized distributors?

All SPC5602DF1VLH3R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5602DF1VLH3R meets industry standards.

7.What is the process for return or replacement of SPC5602DF1VLH3R?

All SPC5602DF1VLH3R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5602DF1VLH3R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC5602DF1VLH3R part is unused and in its original packaging.

Return procedure for SPC5602DF1VLH3R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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