Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors SPC5602DF1VLL4R

Part No.:
SPC5602DF1VLL4R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixSPC5602DF1VLL4R.pdf
Description:
IC MCU 32BIT 256KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,576

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

SPC5602DF1VLL4R from NXP Semiconductors (formerly Freescale) is an automotive-qualified 32-bit Power Architecture® microcontroller featuring the e200z0h CPU core, 256 KB Code Flash with ECC, 64 KB Data Flash with ECC, 16 KB SRAM with ECC, and integrated FlexCAN, LINFlex, DSPI, and 33-channel 12-bit ADC. It operates up to 48 MHz and targets central body control modules and smart junction boxes.

For engineers reviewing the SPC5602DF1VLL4R datasheet, SPC5602DF1VLL4R pinout, SPC5602DF1VLL4R application, or SPC5602DF1VLL4R equivalent, key selection criteria include VLE instruction support for code density reduction, FMPLL clock generation, crossbar switch architecture for concurrent peripheral access, and Nexus Class 1 debug interface compliance.

Technical Context

The SPC5602DF1VLL4R implements a single-issue e200z0h core compliant with Power Architecture embedded category and supports Variable Length Encoding (VLE) to reduce code footprint via mixed 16-/32-bit instructions. Its FMPLL provides programmable frequency modulation and high-speed system clocks.

It features a 3×3 crossbar switch enabling simultaneous access to Flash, SRAM, and peripherals by multiple bus masters, and integrates a Boot Assist Module (BAM) supporting Flash programming over CAN or SCI serial links.

Key Specifications

ParameterValue and Actual Design Meaning
CPU Coree200z0h - single-issue 32-bit Power Architecture core with VLE support for reduced memory footprint
Max Clock Speed48 MHz - defines real-time processing capability for automotive body control tasks
Code Flash256 KB with ECC - ensures reliable program storage and error detection/correction in harsh environments
Data Flash64 KB with ECC - enables robust non-volatile parameter storage with integrity protection
SRAM16 KB with ECC - provides fault-tolerant working memory for safety-critical variables
ADC33-channel 12-bit - supports high-resolution sensor acquisition across vehicle body systems
FlexCAN1 module with configurable buffers - enables standard CAN 2.0B communication for ECU interconnectivity
Debug InterfaceNexus Class 1 per IEEE-ISTO 5001-2003 - supports real-time trace and breakpoint debugging in production-grade toolchains

Pinout & Package

SPC5602DF1VLL4R is housed in a 100-pin LQFP package (14 mm × 14 mm), with dedicated voltage supply pins (VDD_HV, VSS_HV, VDD_LV, VSS_LV, VDD_BV), oscillator inputs (XTAL/EXTAL), reset (RESET), JTAG (TCK/TMS/TDI/TDO), and 79 configurable GPIOs supporting peripheral multiplexing.

Pin/TerminalCircuit RoleDesign Meaning
RESETReset input with Schmitt-trigger and noise filterActive-low asynchronous reset with built-in filtering for robust operation in electrically noisy automotive environments
VDD_HV / VSS_HVDigital power supply and groundSupports 3.3 V digital domain; multiple pins ensure low-impedance power delivery and noise suppression
VDD_LV / VSS_LV1.2 V regulator decoupling pairRequires external decoupling capacitors per pair to stabilize internal core voltage and meet EMC requirements
XTAL / EXTALCrystal oscillator connectionsSupports 4–16 MHz external crystal; bypass mode allows direct clock injection
PA[0]–PA[15], PB[0]–PB[15], etc.Multiplexed GPIO and peripheral signals79 total configurable I/Os; each pin supports up to four alternate functions (e.g., LINFlex, DSPI, ADC, eMIOS)

Key Features

FeatureDesign Value
VLE instruction encodingReduces compiled code size by up to 30% vs. pure 32-bit encoding-critical for Flash-constrained automotive firmware
FMPLL with frequency modulationEnables EMI reduction through spread-spectrum clocking while maintaining timing accuracy for CAN/LIN timing budgets
Crossbar switch (XBAR)Allows concurrent access to Flash, SRAM, and peripherals by CPU, eDMA, and other masters-eliminates bus contention bottlenecks
Boot Assist Module (BAM)Enables field firmware updates via CAN or SCI without external programmer-reduces service cost and enables OTA-like workflows
ECC on all memory blocksProvides single-bit error correction and double-bit error detection for Flash and SRAM-meets ASIL-B functional safety requirements
Real-Time Counter (RTC)Autonomous wakeup with 1 ms resolution and 2 s max timeout using internal 128 kHz RC oscillator-enables ultra-low-power sleep modes

Applications

Central Body Control Unit (CBCU)Smart Junction Box (SJB)

Use Scenario: Centralized management of lighting, door locks, window lifts, and seat position in modern vehicles.

IC Role / Device Role / Timing Role: Primary system-on-chip controller executing AUTOSAR-compliant body domain software stack.

Use Value: Integrates 33-channel ADC for analog sensor monitoring, FlexCAN for gateway communication, and LINFlex for actuator control-reducing BOM count and PCB area.

Use Scenario: Distributed power distribution and signal routing unit replacing traditional fuse boxes with intelligent load switching and diagnostics.

IC Role / Device Role / Timing Role: Real-time power domain supervisor coordinating relay control, current sensing, and fault reporting.

Use Value: Leverages eMIOS-lite timers for precise PWM-driven load control and PIT/STM for AUTOSAR OS tick generation-ensuring deterministic response under ISO 16750 stress conditions.

Front Module ControllerDoor Control Module

Use Scenario: Integration of HVAC controls, headlight leveling, rain/light sensors, and wiper logic into a single front-end ECU.

IC Role / Device Role / Timing Role: Sensor fusion hub with synchronized ADC sampling and CTU-triggered conversions.

Use Value: Uses cross-triggering unit (CTU) to align ADC captures with eMIOS timer events-enabling phase-accurate motor current measurement for brushless blower control.

Use Scenario: Localized control of power windows, mirrors, and interior lighting with anti-pinch detection and LIN communication.

IC Role / Device Role / Timing Role: Dedicated LIN master node managing up to 16 slave devices (e.g., mirror motors, LED drivers).

Use Value: LINFlex modules 1 and 2 operate as masters with hardware CRC and auto-resynchronization-guaranteeing >99.9% message integrity at 19.2 kbps in door harness EMI environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SPC5603DF1MLL4RHigher memory: 512 KB Code Flash, 96 KB SRAM; adds eDMA controllerRequired for complex AUTOSAR stacks with multiple COM stacks or OTA update partitionsSelect when >256 KB Flash or hardware DMA offload is needed for sensor data streaming
SPC5604PF1MLL3REnhanced peripheral set: dual FlexCAN, 4 LINFlex, 4 DSPI; no VLE supportSuitable for gateway ECUs requiring multi-bus bridging (CAN-to-LIN, CAN-to-SCI)Choose for multi-network gateway roles where VLE is less critical than peripheral count and protocol diversity

Compared with SPC5602DF1VLL4R, the SPC5603DF1MLL4R offers scalable memory for future firmware growth but increases cost and power; the SPC5604PF1MLL3R trades VLE efficiency for expanded connectivity-making it better suited for network bridge applications than body control nodes.

Availability

SPC5602DF1VLL4R is available at Aetrix Electronics and suitable for central body control units, smart junction boxes, and front module controllers requiring stable component supply across automotive production lifecycles.

Supply support for SPC5602DF1VLL4R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive qualification standards.

The SPC5602DF1VLL4R belongs to the SPC560x family of automotive MCUs designed specifically for body electronics and chassis control applications, emphasizing ASIL-B readiness, Flash reliability, and low-power operation in 125°C ambient environments.

FAQ

What is the maximum operating frequency of the SPC5602DF1VLL4R?

The SPC5602DF1VLL4R operates at a maximum CPU frequency of 48 MHz, enabled by its Frequency-Modulated Phase-Locked Loop (FMPLL). This speed is validated across the full automotive temperature range (−40°C to 125°C) and supports real-time execution of AUTOSAR-compliant body control software on the e200z0h core. The SPC5602DF1VLL4R achieves this performance while maintaining low dynamic power consumption via its on-chip voltage regulator and power domain control.

Does the SPC5602DF1VLL4R support functional safety standards such as ISO 26262?

Yes, the SPC5602DF1VLL4R is designed to support ASIL-B compliance per ISO 26262. It includes ECC on all embedded memories (256 KB Code Flash, 64 KB Data Flash, 16 KB SRAM), lockstep-capable peripherals like the FMPLL and RTC, and diagnostic features including clock monitor unit (CMU), reset generation module (MC_RGM), and error correction status module (ECSM). These capabilities enable systematic fault detection required for body control applications. The SPC5602DF1VLL4R itself is not certified, but its architecture provides the foundation for ASIL-B system-level certification.

How many CAN interfaces does the SPC5602DF1VLL4R integrate?

The SPC5602DF1VLL4R integrates one enhanced full CAN (FlexCAN) module with configurable message buffers, supporting CAN 2.0A/B protocols at data rates up to 1 Mbps. This single FlexCAN interface is sufficient for point-to-point or star-topology body networks, and it includes hardware features such as automatic retransmission, time stamping, and mailbox-based filtering. For multi-CAN applications, designers should consider the SPC5604PF1MLL3R, which includes dual FlexCAN modules. The SPC5602DF1VLL4R's FlexCAN is fully compatible with standard CAN transceivers like the TJA1042.

What debug interface does the SPC5602DF1VLL4R provide?

The SPC5602DF1VLL4R provides a Nexus development interface (NDI) compliant with IEEE-ISTO 5001-2003 Class 1 standard, accessible via the standard 5-pin JTAG port (TCK, TMS, TDI, TDO, TRST). This interface supports real-time tracing, hardware breakpoints, watchpoints, and memory access during active execution-essential for AUTOSAR stack validation and timing analysis. It does not support Nexus Class 2/3 features like data trace streaming. Debug tools from Lauterbach, iSystem, and PLS support the SPC5602DF1VLL4R's Nexus Class 1 implementation.

Is the SPC5602DF1VLL4R pin-compatible with other members of the SPC560x family?

No, the SPC5602DF1VLL4R is not pin-compatible with other SPC560x variants due to differences in package options and peripheral mapping. While it shares the 100 LQFP (14 mm × 14 mm) footprint with some higher-pin-count derivatives, pin functions differ significantly-for example, ADC input channels, LINFlex assignments, and DSPI signal routing vary between SPC5602D and SPC5603D/SPC5604D. Migration requires PCB redesign. The SPC5602DF1VLL4R's specific pinout is documented in Figures 2 and Table 5 of the MPC5602D datasheet Rev. 6.

SPC5602DF1VLL4R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
100-LQFP
Series:
MPC56xx Qorivva
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
79
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 16
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 33x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SPC5602DF1VLL4R FAQ

1.How can I place an order for SPC5602DF1VLL4R through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC5602DF1VLL4R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC5602DF1VLL4R reliable?

The price and inventory of SPC5602DF1VLL4R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5602DF1VLL4R is usually 5 days.

3.What payment methods are accepted for SPC5602DF1VLL4R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5602DF1VLL4R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC5602DF1VLL4R?

SPC5602DF1VLL4R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC5602DF1VLL4R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC5602DF1VLL4R?

For technical support, including SPC5602DF1VLL4R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5602DF1VLL4R requirements.

6.How does Aetrix verify that SPC5602DF1VLL4R is sourced from the original manufacturer or authorized distributors?

All SPC5602DF1VLL4R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5602DF1VLL4R meets industry standards.

7.What is the process for return or replacement of SPC5602DF1VLL4R?

All SPC5602DF1VLL4R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5602DF1VLL4R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC5602DF1VLL4R part is unused and in its original packaging.

Return procedure for SPC5602DF1VLL4R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SPC5602DF1VLL4R Tags

  • SPC5602DF1VLL4R
  • SPC5602DF1VLL4R PDF
  • SPC5602DF1VLL4R Datasheet
  • SPC5602DF1VLL4R Specifications
  • SPC5602DF1VLL4R Images
  • NXP Semiconductors
  • NXP Semiconductors SPC5602DF1VLL4R
  • Buy SPC5602DF1VLL4R
  • SPC5602DF1VLL4R Price
  • SPC5602DF1VLL4R Distributor
  • SPC5602DF1VLL4R Supplier
  • SPC5602DF1VLL4R Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER