NXP Semiconductors SPC5603BF2MLH6
- Part No.:
- SPC5603BF2MLH6
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
SPC5603BF2MLH6.pdf
- Description:
- IC MCU 32BIT 384KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,227
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Product details
Overview
SPC5603BF2MLH6 from NXP Semiconductors is a 32-bit automotive microcontroller based on the Power Architecture® e200z0h core, operating up to 64 MHz with 384 KB code flash, 64 KB data flash, and 32 KB SRAM - all featuring ECC protection. It integrates six FlexCAN modules, four LINFlex interfaces, three DSPI controllers, and a 10-bit 28-channel ADC for body control unit (BCU) and gateway applications.
For engineers reviewing the SPC5603BF2MLH6 datasheet, SPC5603BF2MLH6 pinout, SPC5603BF2MLH6 application, or SPC5603BF2MLH6 equivalent, key selection criteria include its LQFP-144 package, FMPLL clock generation, Nexus 2+ debug interface, and support for AUTOSAR-compliant real-time timers (PIT/STM/RTC).
Technical Context
The SPC5603BF2MLH6 implements the e200z0h CPU core with Variable Length Encoding (VLE) for reduced code footprint and executes at up to 64 MHz using a frequency-modulated PLL (FMPLL). Its crossbar switch enables concurrent access to flash, SRAM, and peripherals by multiple bus masters including eMIOS, FlexCAN, and DSPI.
Memory subsystem includes ECC-protected 384 KB on-chip code flash, 64 KB data flash (4 × 16 KB), and 32 KB SRAM. The MPU provides 8-region memory protection with 32-byte granularity, while the INTC supports 148 interrupt vectors including 18 wakeup-capable sources.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h Power Architecture® core with VLE instruction set for compact firmware binaries |
| Max Clock Speed | 64 MHz system frequency enabled by FMPLL with programmable modulation |
| Code Flash | 384 KB with ECC and flash controller for robust in-field reprogramming |
| Data Flash | 64 KB (4 × 16 KB) with ECC for parameter storage and calibration data retention |
| SRAM | 32 KB with ECC for safety-critical runtime variables and stack integrity |
| ADC | 10-bit, 28-channel analog-to-digital converter with CTU-triggered sampling synchronization |
| FlexCAN Modules | 6 independent CAN 2.0B controllers with configurable message buffers and loopback test mode |
| Debug Interface | Nexus 2+ compliant per IEEE-ISTO 5001-2003 for real-time trace and non-intrusive debugging |
Pinout & Package
SPC5603BF2MLH6 is housed in a 144-pin LQFP package (20 × 20 × 1.4 mm) with exposed thermal pad. Pin functions are multiplexed across GPIO, peripheral I/O, power, and debug domains, supporting automotive-grade signal integrity and ESD robustness.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Asynchronous reset input | Pulled high after PHASE2 completion; triggers full device initialization and state clearing |
| XTAL / EXTAL | Crystal oscillator inputs | Supports 4–16 MHz external crystal; enables precise clock source for FMPLL and RTC |
| VDD_HV / VSS_HV | Digital supply rails | Multiple distributed 3.3 V supply/ground pairs reduce voltage drop and improve noise immunity |
| VDD_LV / VSS_LV | Core regulator decoupling | Three dedicated 1.2 V supply/ground pairs require local 100 nF capacitors for stable core operation |
| PA[0]–PA[15], PB[0]–PB[15], etc. | Configurable GPIO ports | 123 total pins support alternate functions including LINFlex, DSPI, FlexCAN, and eMIOS channels |
| MDO[0]–MDO[3], MCKO, EVTO | Nexus 2+ debug outputs | Enable real-time instruction trace, data watchpoints, and non-intrusive profiling during development |
Key Features
| Feature | Design Value |
|---|---|
| VLE-enabled e200z0h core | Reduces firmware size by up to 30% vs. standard 32-bit encoding, lowering flash cost and boot time |
| ECC-protected memories | Ensures ASIL-B compliance via automatic single-bit error correction and double-bit error detection in flash/SRAM |
| 6 FlexCAN modules | Enables multi-bus automotive gateways with independent timing, filtering, and buffer management per CAN node |
| CTU-synchronized ADC | Allows deterministic trigger of ADC conversions from eMIOS or PIT events for sensor sampling alignment |
| Boot Assist Module (BAM) | Permits flash programming over CAN or SCI without external debugger, simplifying field updates |
| Real-time counter (RTC) | Autonomous 1 ms-resolution wakeup timer with 128 kHz RC or 16 MHz crystal source, usable in stop mode |
Applications
| Body Control Module (BCM) | Automotive Gateway |
|---|---|
Use Scenario: Centralized control of lighting, door locks, window lifts, and climate actuators in modern vehicles. IC Role / Device Role / Timing Role: Main application processor executing AUTOSAR OS, managing LIN/FlexCAN communication, and performing real-time PWM for LED dimming. Use Value: 32 KB ECC SRAM ensures safe task scheduling; 6 FlexCAN modules enable concurrent communication with chassis, powertrain, and infotainment networks. | Use Scenario: Protocol translation and message routing between CAN FD, classic CAN, LIN, and Ethernet domains in zonal architectures. IC Role / Device Role / Timing Role: High-integrity bridge controller with deterministic latency, leveraging crossbar switch for parallel peripheral access and PIT/STM for AUTOSAR timing services. Use Value: 384 KB code flash stores dual-application firmware images; Nexus 2+ enables production-line diagnostics and secure firmware validation. |
| Seat Control Unit | Roof Module Controller |
Use Scenario: Motorized seat position memory, heating, ventilation, and occupancy sensing in premium vehicles. IC Role / Device Role / Timing Role: Safety-aware motor driver supervisor using eMIOS for PWM generation and ADC for current/temperature monitoring. Use Value: 28-channel 10-bit ADC supports simultaneous sampling of seat sensor arrays; MPU enforces memory isolation between safety and comfort functions. | Use Scenario: Integration of sunroof, ambient lighting, rain sensor, and interior camera in overhead console assemblies. IC Role / Device Role / Timing Role: Low-power domain manager with RTC-driven wakeups and WKPU handling 18 external interrupt sources. Use Value: 123 configurable GPIOs route signals to diverse sensors/actuators; VDD_BV pin supplies internal regulator for consistent low-voltage operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5604BF2MLH6 | 512 KB code flash, 48 KB SRAM, same 144 LQFP package and peripheral set | Higher memory capacity suits complex gateway stacks with OTA update partitions and diagnostic log buffers | Select when >384 KB flash or >32 KB SRAM is required for AUTOSAR BSW configuration or extended logging |
| SPC5603BK0MLH6 | Same 384 KB flash and 32 KB SRAM but rated for -40°C to +125°C junction temperature (vs. -40°C to +105°C) | Required for under-hood applications exceeding 105°C ambient, such as engine bay modules | Choose for extended temperature grade where thermal derating of SPC5603BF2MLH6 is insufficient |
Compared with MPC5604BF2MLH6, SPC5603BF2MLH6 trades flash/SRAM capacity for cost-sensitive BCU designs; versus SPC5603BK0MLH6, it offers lower thermal rating but identical feature set for cabin-mounted modules.
Availability
SPC5603BF2MLH6 is available at Aetrix Electronics and suitable for body control modules, automotive gateways, seat control units, and roof module controllers requiring stable component supply across automotive production lifecycles.
Supply support for SPC5603BF2MLH6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and ASIL-certified microcontrollers.
The SPC5603BF2MLH6 belongs to NXP's SPC5603B automotive MCU family, designed specifically for cost-optimized body electronics applications requiring ASIL-B compliance, CAN/LIN connectivity, and robust flash-based firmware execution.
FAQ
What is the maximum operating frequency of the SPC5603BF2MLH6?
The SPC5603BF2MLH6 operates at a maximum system clock frequency of 64 MHz, achieved via its integrated frequency-modulated phase-locked loop (FMPLL). This speed is validated across the full industrial temperature range (−40°C to +105°C) and supports real-time deterministic execution for AUTOSAR-compliant software stacks running on the e200z0h core.
Does the SPC5603BF2MLH6 support CAN FD?
No, the SPC5603BF2MLH6 supports only classical CAN 2.0B protocol through its six FlexCAN modules. It does not implement CAN FD physical layer or protocol enhancements. For CAN FD capability, engineers should evaluate newer families such as S32K1 or S32K3 series microcontrollers from NXP.
What debug interface does the SPC5603BF2MLH6 provide?
The SPC5603BF2MLH6 features a Nexus 2+ development interface compliant with IEEE-ISTO 5001-2003 Class Two Plus standard. This enables real-time instruction trace, data watchpoints, non-intrusive profiling, and hardware-assisted breakpoints - essential for AUTOSAR stack validation and ISO 26262 tool qualification workflows.
How many ADC channels does the SPC5603BF2MLH6 have, and what is their resolution?
The SPC5603BF2MLH6 integrates a 10-bit analog-to-digital converter with 28 input channels. It supports configurable sample-and-hold timing, hardware triggering via CTU from eMIOS or PIT, and conversion results stored in dedicated result buffers - enabling synchronized multi-sensor acquisition for body electronics sensing.
Is the SPC5603BF2MLH6 pin-compatible with other MPC560xB/C devices?
Yes, the SPC5603BF2MLH6 in 144 LQFP package shares identical pinout with other MPC560xB/C variants in the same package option (e.g., MPC5604BF2MLH6, SPC5603BK0MLH6), allowing PCB reuse across memory or temperature grade variants. Signal mapping, power pin locations, and debug interface pins are fully aligned per NXP's MPC5604B/C datasheet Rev. 15.
SPC5603BF2MLH6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 64MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 28K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5603BF2MLH6 FAQ
1.How can I place an order for SPC5603BF2MLH6 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5603BF2MLH6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5603BF2MLH6 reliable?
The price and inventory of SPC5603BF2MLH6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5603BF2MLH6 is usually 5 days.
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SPC5603BF2MLH6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5603BF2MLH6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5603BF2MLH6?
For technical support, including SPC5603BF2MLH6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5603BF2MLH6 requirements.
6.How does Aetrix verify that SPC5603BF2MLH6 is sourced from the original manufacturer or authorized distributors?
All SPC5603BF2MLH6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5603BF2MLH6 meets industry standards.
7.What is the process for return or replacement of SPC5603BF2MLH6?
All SPC5603BF2MLH6 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5603BF2MLH6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5603BF2MLH6 part is unused and in its original packaging.
Return procedure for SPC5603BF2MLH6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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