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NXP Semiconductors SPC5604BF2CLL4R

Part No.:
SPC5604BF2CLL4R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixSPC5604BF2CLL4R.pdf
Description:
IC MCU 32BIT 512KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,565

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Product details

Overview

SPC5604BF2CLL4R from NXP Semiconductors is an automotive-grade 32-bit Power Architecture® microcontroller featuring the e200z0h CPU core, 512 KB code flash with ECC, 48 KB SRAM with ECC, and 64 KB data flash. It integrates six FlexCAN modules, four LINFlex interfaces, three DSPI controllers, a 10-bit 36-channel ADC, and supports up to 123 GPIOs in 144 LQFP packaging. It is deployed in body control modules for real-time sensor fusion and actuator coordination.

For engineers reviewing the SPC5604BF2CLL4R datasheet, SPC5604BF2CLL4R pinout, SPC5604BF2CLL4R application, or SPC5604BF2CLL4R equivalent, key selection considerations include FMPLL clock synthesis, Nexus 2+ debug compliance, VLE instruction encoding for code density, and automotive-qualified power management with integrated voltage regulator and low-voltage detection.

Technical Context

The SPC5604BF2CLL4R implements a single-issue e200z0h core compliant with Power Architecture® embedded category and supports Variable Length Encoding (VLE) to reduce code footprint by mixing 16-bit and 32-bit instructions. Its crossbar switch enables concurrent access to flash, SRAM, and peripherals by multiple bus masters including eMIOS, FlexCAN, and DSPI.

It features a Frequency-Modulated PLL (FMPLL) for jitter-reduced system clock generation, a Memory Protection Unit (MPU) with eight region descriptors and 32-byte granularity, and a Boot Assist Module (BAM) enabling flash programming via CAN or SCI serial link - all critical for ASIL-B–capable automotive firmware updates.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core e200z0h - single-issue 32-bit Power Architecture core with VLE support for reduced memory footprint and deterministic execution.
Max Operating Frequency 64 MHz - defines real-time processing bandwidth for time-critical automotive tasks like PWM generation and CAN message scheduling.
Code Flash 512 KB with ECC - provides robust non-volatile storage for application code and bootloader, supporting field updates with error correction.
SRAM 48 KB with ECC - enables safe runtime data storage for AUTOSAR OS tasks and safety-critical variables with hardware-level integrity checking.
ADC Resolution & Channels 10-bit, 36-channel - delivers sufficient dynamic range and multiplexing flexibility for analog sensor monitoring (e.g., temperature, voltage, position).
FlexCAN Modules 6 × configurable CAN 2.0B controllers - supports multi-bus vehicle networks (e.g., body, chassis, infotainment domains) with autonomous buffer management.
Debug Interface Nexus 2+ per IEEE-ISTO 5001-2003 - enables real-time trace, breakpoint injection, and register visibility required for ISO 26262 tool qualification.
Package 144-pin LQFP (20 × 20 × 1.4 mm) - surface-mount package with 0.5 mm pitch, compatible with standard automotive PCB assembly processes.

Pinout & Package

SPC5604BF2CLL4R is housed in a 144-pin LQFP package (20 × 20 × 1.4 mm) with exposed thermal pad. Pin functions are defined across 16 functional port groups (PA–PH), system pins (RESET, EXTAL, XTAL), and dedicated debug/Nexus signals (MDO0–MDO3, MCKO, EVTO, MSEO). All I/O pads support programmable drive strength and slew rate via Pad Configuration Registers (PCR).

Pin/Terminal Circuit Role Design Meaning
RESET Active-low bidirectional reset input Triggers cold/warm reset with Schmitt-trigger input and internal noise filter; weak pull-up enabled only after PHASE2 completion.
XTAL / EXTAL Crystal oscillator interface Supports external 4–16 MHz crystal or ceramic resonator; tristate during reset; bypass mode allows external clock injection.
VDD_HV / VSS_HV Digital supply and ground Multiple 3.3 V digital supply pins distributed across package corners to minimize IR drop and EMI; requires local decoupling.
VDD_LV / VSS_LV 1.2 V core regulator supply Three dedicated 1.2 V supply/ground pairs for internal voltage regulator stabilization; each pair requires ≥1 µF ceramic decoupling.
VDD_HV_ADC / VSS_HV_ADC Analog reference supply Isolated 3.3 V analog domain supply and ground for ADC; physically separated to prevent digital switching noise coupling into conversion path.
PA[0]–PA[15], PB[0]–PB[15], etc. Configurable general-purpose I/O Up to 123 GPIOs with alternate functions (e.g., LINFlex, DSPI, FlexCAN, eMIOS); pad type (S/M/F) and direction programmable per PCR register.

Key Features

Feature Design Value
VLE instruction encoding Reduces compiled code size by up to 30% vs. pure 32-bit encoding - directly lowers flash memory cost and improves cache hit rate in safety-critical boot code.
FMPLL with frequency modulation Enables spread-spectrum clocking to reduce electromagnetic emissions - meets CISPR 25 Class 5 requirements without external filtering components.
Memory Protection Unit (MPU) Eight 32-byte-granularity regions enforce isolation between AUTOSAR OS applications, drivers, and safety monitors - foundational for ASIL-B partitioning.
Boot Assist Module (BAM) ROM-resident VLE code enables secure in-field flash reprogramming over CAN or SCI - eliminates need for external debugger during production calibration or OTA updates.
Crossbar switch architecture 64-bit data bus with dual master / triple slave arbitration - prevents bus contention between eMIOS timers, FlexCAN buffers, and DMA transfers during high-throughput sensor acquisition.
Real-Time Counter (RTC) Autonomous 128 kHz or 16 MHz RC-based counter with 1 ms resolution and 2 s max timeout - supports low-power wake-up events without CPU involvement.

Applications

Body Control Module (BCM) Seat Position Control Unit

Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in modern passenger vehicles.

IC Role / Device Role / Timing Role: Main application processor executing AUTOSAR-compliant BSW and application software; manages LINFlex communication with slave nodes and FlexCAN messaging with gateway ECUs.

Use Value: 36-channel ADC enables simultaneous monitoring of potentiometer feedback, motor current sense, and ambient light sensors; VLE reduces boot ROM footprint for faster startup.

Use Scenario: Real-time position tracking and motor control for power-adjustable driver and passenger seats with memory presets.

IC Role / Device Role / Timing Role: Dedicated motion controller coordinating eMIOS-generated PWM for DC motors, ADC sampling for Hall-effect position sensors, and CAN status reporting to instrument cluster.

Use Value: Six FlexCAN modules allow independent bus assignment (e.g., seat CAN, comfort CAN, diagnostics CAN); MPU enforces separation between motor control and user interface tasks.

Roof Module Controller Smart Rearview Mirror ECU

Use Scenario: Integration of sunroof actuation, panoramic roof shading, rain sensor logic, and ambient light-controlled LED strips.

IC Role / Device Role / Timing Role: Sensor fusion hub aggregating analog inputs (rain/light), digital switches (switch banks), and LIN commands from overhead console; schedules periodic CAN status broadcasts.

Use Value: 48 KB ECC SRAM ensures reliable storage of shading profiles and calibration data; RTC enables timed auto-close functionality without external RTC IC.

Use Scenario: Embedded control for electrochromic dimming, camera feed overlay, and gesture recognition in premium rearview mirrors.

IC Role / Device Role / Timing Role: Real-time coordinator managing ADC-based ambient light sensing, DSPI interface to image sensor, and LINFlex communication with display driver ICs.

Use Value: Three DSPI controllers support concurrent image capture, flash memory access, and display command streaming; FMPLL minimizes EMI interference with camera analog video path.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPC5604BK0MLL4 Same e200z0h core and peripheral set, but rated for -40°C to +125°C (vs. SPC5604BF2CLL4R's -40°C to +105°C) and includes enhanced watchdog (SWT) with windowed mode. Targeted at under-hood applications requiring extended temperature operation and stricter ASIL-B watchdog supervision. Select MPC5604BK0MLL4 when operating ambient exceeds 105°C or when windowed SWT is mandated by functional safety analysis.
SPC5607BK0MLL6 Higher-tier variant with 1 MB code flash, 128 KB SRAM, dual e200z4 cores, and additional FlexCAN/LINFlex channels - not pin-compatible. Designed for domain controller consolidation where higher compute throughput and inter-core communication are required. Choose SPC5607BK0MLL6 only when scaling beyond BCM-class workloads; requires PCB redesign due to 176 LQFP package and different pinout.

Compared with MPC5604BK0MLL4, SPC5604BF2CLL4R offers identical peripheral count and VLE capability but trades extended temperature rating and advanced watchdog for lower cost and optimized power consumption in cabin-mounted modules. Against SPC5607BK0MLL6, it provides a cost- and footprint-optimized solution for single-domain controllers without over-provisioning.

Availability

SPC5604BF2CLL4R is available at Aetrix Electronics and suitable for body control modules, seat position systems, roof modules, and smart mirror ECUs requiring stable component supply across automotive production lifecycles.

Supply support for SPC5604BF2CLL4R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The SPC5604BF2CLL4R belongs to NXP's SPC560x automotive MCU family, designed specifically for ASIL-B–compliant body electronics applications with emphasis on functional safety, low-power operation, and seamless integration into AUTOSAR-based software stacks.

FAQ

What is the maximum operating temperature specification for the SPC5604BF2CLL4R?

The SPC5604BF2CLL4R is qualified for operation from –40 °C to +105 °C ambient temperature. This rating aligns with AEC-Q100 Grade 2 requirements and is validated across all electrical parameters including flash endurance, ADC accuracy, and clock stability. The device incorporates on-chip temperature monitoring and low-voltage detection circuitry to support thermal derating strategies in SPC5604BF2CLL4R-based designs.

Does the SPC5604BF2CLL4R support AUTOSAR-compliant memory protection?

Yes, the SPC5604BF2CLL4R includes a hardware Memory Protection Unit (MPU) with eight configurable regions and 32-byte granularity, enabling strict memory access control between AUTOSAR OS applications, BSW modules, and safety monitors. This feature is essential for achieving ASIL-B compliance and is fully supported by NXP's SPC560x AUTOSAR MCAL stack used in SPC5604BF2CLL4R implementations.

How many CAN interfaces does the SPC5604BF2CLL4R integrate, and what protocol versions are supported?

The SPC5604BF2CLL4R integrates six FlexCAN modules compliant with CAN 2.0A/B protocols and ISO 11898-1 physical layer timing. Each module supports configurable message buffers, flexible ID filtering, and loopback self-test modes. These six CAN controllers are used independently in SPC5604BF2CLL4R-based systems for body domain segmentation, diagnostic communication, and gateway bridging.

What debug interface does the SPC5604BF2CLL4R provide, and is it production-programmable?

The SPC5604BF2CLL4R implements the Nexus 2+ development interface per IEEE-ISTO 5001-2003 Class Two Plus standard, supporting real-time trace, hardware breakpoints, and register visibility. It also includes JTAG for boundary scan and production programming. Both interfaces remain accessible post-manufacture, enabling field firmware updates and diagnostics in deployed SPC5604BF2CLL4R units.

Can the SPC5604BF2CLL4R operate without an external crystal oscillator?

Yes, the SPC5604BF2CLL4R includes two internal RC oscillators: a 16 MHz fast oscillator and a 128 kHz slow oscillator. These can serve as primary clock sources during startup or low-power modes, eliminating the need for external crystals in cost-sensitive or space-constrained SPC5604BF2CLL4R applications - though external crystals are recommended for highest timing accuracy in CAN and LIN communication.

SPC5604BF2CLL4R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
100-LQFP
Series:
MPC56xx Qorivva
Packaging:
Tape & Reel (TR)
Product Status:
Not For New Designs
Programmable:
Not Verified
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
79
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 28x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SPC5604BF2CLL4R FAQ

1.How can I place an order for SPC5604BF2CLL4R through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC5604BF2CLL4R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC5604BF2CLL4R reliable?

The price and inventory of SPC5604BF2CLL4R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5604BF2CLL4R is usually 5 days.

3.What payment methods are accepted for SPC5604BF2CLL4R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5604BF2CLL4R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC5604BF2CLL4R?

SPC5604BF2CLL4R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC5604BF2CLL4R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC5604BF2CLL4R?

For technical support, including SPC5604BF2CLL4R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5604BF2CLL4R requirements.

6.How does Aetrix verify that SPC5604BF2CLL4R is sourced from the original manufacturer or authorized distributors?

All SPC5604BF2CLL4R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5604BF2CLL4R meets industry standards.

7.What is the process for return or replacement of SPC5604BF2CLL4R?

All SPC5604BF2CLL4R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5604BF2CLL4R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC5604BF2CLL4R part is unused and in its original packaging.

Return procedure for SPC5604BF2CLL4R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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