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NXP Semiconductors SPC5604BF2MLL6
- Part No.:
- SPC5604BF2MLL6
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
SPC5604BF2MLL6.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:450
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Product details
Overview
SPC5604BF2MLL6 from NXP Semiconductors is a 32-bit automotive microcontroller based on the Power Architecture® e200z0h core, operating up to 64 MHz with VLE instruction encoding. It integrates 512 KB code flash, 64 KB data flash, 48 KB SRAM (all with ECC), 6 FlexCAN modules, 4 LINFlex interfaces, and a 10-bit 36-channel ADC - deployed in body control modules for vehicle lighting, door actuation, and HVAC fan control.
For engineers reviewing the SPC5604BF2MLL6 datasheet, SPC5604BF2MLL6 pinout, SPC5604BF2MLL6 application, or SPC5604BF2MLL6 equivalent, key selection considerations include its 100-pin LQFP package, FMPLL clock generation, Nexus 2+ debug interface, and support for AUTOSAR-compliant real-time timers (STM/PIT) in safety-critical automotive subsystems.
Technical Context
The SPC5604BF2MLL6 implements a single-issue e200z0h CPU core with Variable Length Encoding (VLE) for reduced code footprint and operates at up to 64 MHz via its Frequency-Modulated PLL (FMPLL). Its crossbar switch enables concurrent access to flash, SRAM, and peripherals by multiple bus masters including eMIOS, FlexCAN, and DSPI controllers.
It features a Memory Protection Unit (MPU) with 8 region descriptors and 32-byte granularity, an Interrupt Controller (INTC) supporting 148 vectors (including 18 wakeup-capable sources), and integrated power management via MC_PCU, MC_RGM, and on-chip voltage regulation - all designed for ASIL-B capable automotive applications per ISO 26262 functional safety requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h 32-bit Power Architecture® core with VLE support - enables compact firmware binaries and deterministic execution for real-time automotive tasks. |
| Max Operating Frequency | 64 MHz - delivers sufficient throughput for multi-sensor body control logic while maintaining low dynamic power consumption. |
| Flash Memory | 512 KB code flash + 64 KB data flash, both with ECC - ensures robust program storage and parameter retention across automotive temperature range (−40°C to 125°C). |
| RAM | 48 KB SRAM with ECC - supports fault-tolerant runtime data handling for safety-critical variables and stack operations. |
| ADC | 10-bit, 36-channel analog-to-digital converter - provides high-resolution sensor acquisition for potentiometers, thermistors, and current sense in HVAC and lighting systems. |
| Communication Interfaces | 6 FlexCAN (ISO 11898-1 compliant), 4 LINFlex, 3 DSPI, 1 I²C - enables full-vehicle network integration with ECUs, sensors, and actuators without external protocol bridges. |
| Timers & Real-Time Support | System Timer Module (STM), 6 Periodic Interrupt Timers (PIT), Real-Time Counter (RTC) - meets AUTOSAR OS timing requirements and supports precise task scheduling and wake-up events. |
Pinout & Package
SPC5604BF2MLL6 is housed in a 100-pin LQFP package (14 × 14 × 1.4 mm), RoHS-compliant, with exposed thermal pad. Pin assignments follow the MPC5604B/C family pinout for 100 LQFP as defined in NXP Document MPC5604BC Rev. 15.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Active-low reset input | Triggers hardware reset with Schmitt-trigger input and internal noise filter - ensures reliable recovery from brown-out or ESD events. |
| VDD_HV / VSS_HV | Digital supply and ground | Three dedicated VDD_HV/VSS_HV pairs (pins 15, 37, 70, 84 / 14, 16, 35, 69, 83) provide stable 3.3 V domain power distribution and noise isolation. |
| VDD_LV / VSS_LV | 1.2 V regulator decoupling | Pins 19, 32, 85 (VDD_LV) and 18, 33, 86 (VSS_LV) require local 100 nF ceramic capacitors - critical for core voltage stability and EMC performance. |
| XTAL / EXTAL | Crystal oscillator inputs | Supports 4–16 MHz external crystal (XTAL) or external clock (EXTAL) - feeds FMPLL for precise system clock generation with jitter tolerance. |
| PA[0]–PA[15], PB[0]–PB[15], etc. | Configurable GPIO / peripheral multiplexing | 123 total I/O pins (package-dependent); each configurable via SIUL PCR registers for GPIO, CAN, LIN, DSPI, ADC, or timer functions. |
Key Features
| Feature | Design Value |
|---|---|
| VLE-enabled e200z0h core | Reduces firmware memory footprint by ~30% vs. standard 32-bit encoding - lowers flash cost and improves cache efficiency in resource-constrained body ECUs. |
| On-chip ECC for all memories | Corrects single-bit errors and detects double-bit errors in flash/SRAM - satisfies ASIL-B fault coverage requirements without software overhead. |
| 6 FlexCAN modules with configurable buffers | Enables concurrent CAN FD-ready communication on multiple buses (e.g., body, chassis, infotainment) - eliminates need for external CAN controllers or gateways. |
| Nexus 2+ debug interface (IEEE-ISTO 5001) | Provides real-time trace, non-intrusive breakpoints, and memory access during operation - accelerates AUTOSAR BSW validation and calibration. |
| Boot Assist Module (BAM) | Allows flash reprogramming over CAN or SCI without external debugger - supports field updates and production line programming in manufacturing. |
| Crossbar switch architecture | Enables simultaneous DMA transfers (eDMA), CPU fetches, and peripheral accesses - prevents bus contention in high-throughput sensor fusion or PWM-driven motor control. |
Applications
| Body Control Module (BCM) | Seat & Mirror Control Unit |
|---|---|
Use Scenario: Centralized management of exterior lighting, door locks, window lifts, and interior ambient lighting in modern vehicles. IC Role / Device Role / Timing Role: Primary host controller executing body domain software stack with LIN/CAN gateway functionality and real-time PWM dimming control. Use Value: Integrated 36-channel ADC and 6 FlexCAN modules eliminate discrete signal conditioning and protocol translation ICs - reducing BOM count and PCB area by >15%. |
Use Scenario: Actuation and position feedback for power seats, side mirrors, and memory presets using DC motors and potentiometers. IC Role / Device Role / Timing Role: Motor control MCU running closed-loop position algorithms with 16-bit eMIOS PWM outputs and analog current sensing via ADC. Use Value: On-chip 48 KB ECC SRAM enables safe storage of seat/mirror position profiles and fault logs - meeting ISO 26262 ASIL-B data integrity requirements. |
| HVAC Blower Control | Roof Module (Sunroof/Convertibles) |
Use Scenario: Variable-speed control of HVAC blower fans using 12 V/24 V brushed or brushless DC motors. IC Role / Device Role / Timing Role: Dedicated motor driver MCU interfacing with Hall sensors, thermistors, and LIN-connected climate panel. Use Value: Integrated 10-bit ADC with 36 channels supports simultaneous temperature, voltage, and current monitoring - enabling adaptive thermal protection without external ADCs. |
Use Scenario: Safety-critical sunroof or convertible top actuation with obstacle detection, pinch sensing, and position tracking. IC Role / Device Role / Timing Role: Safety-monitoring MCU performing dual-core lockstep not applicable, but leveraging MPU, ECC, and watchdog timers for fault detection. Use Value: Real-Time Counter (RTC) with 1 ms resolution and autonomous wakeup supports timed initialization sequences and low-power standby modes - extending battery life during vehicle sleep states. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC5605BF2MLL6 | Same 100-pin LQFP package; upgraded to 64 KB SRAM (vs. 48 KB) and adds eDMA controller. | Better suited for complex sensor fusion or OTA update buffering where high-bandwidth memory access is required. | Select when additional SRAM and hardware DMA offload are needed for real-time data pipelines beyond SPC5604BF2MLL6 capability. |
| MPC5604BK0MLL6 | Identical core, memory, and peripheral set; differs only in qualification grade (AEC-Q100 Grade 2 vs. Grade 1) and screening - lower max junction temperature (105°C vs. 125°C). | Approved for cabin interior applications (e.g., center console) but not under-hood or engine bay deployments. | Choose for cost-sensitive interior modules where extended temperature range is unnecessary and qualification cost must be minimized. |
Compared with SPC5604BF2MLL6, SPC5605BF2MLL6 adds eDMA and SRAM for higher data throughput, while MPC5604BK0MLL6 reduces thermal rating and qualification rigor - making the original SPC5604BF2MLL6 the optimal balance of performance, safety margin, and cost for mainstream body electronics.
Availability
SPC5604BF2MLL6 is available at Aetrix Electronics and suitable for automotive body control modules, HVAC fan drivers, and seat/mirror actuation systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified reliability.
Supply support for SPC5604BF2MLL6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade microcontrollers.
The SPC5604BF2MLL6 belongs to the SPC5604B automotive MCU family, designed specifically for cost-optimized, ASIL-B capable body electronics - emphasizing integration, ECC memory protection, and AUTOSAR-ready peripherals.
FAQ
What is the maximum operating temperature for the SPC5604BF2MLL6?
The SPC5604BF2MLL6 is qualified to AEC-Q100 Grade 1, supporting continuous operation from −40°C to +125°C ambient temperature. This rating applies to the full device - including core logic, flash memory, and I/O pads - and is validated per JEDEC JESD22-A108. The SPC5604BF2MLL6 maintains full electrical specifications across this range, making it suitable for under-hood and chassis-mounted automotive applications.
Does the SPC5604BF2MLL6 support AUTOSAR OS and MCAL?
Yes, the SPC5604BF2MLL6 is fully supported by NXP's AUTOSAR Basic Software (MCAL) v4.x and compatible with AUTOSAR OS 4.2+. Its System Timer Module (STM), PIT timers, Nexus 2+ debug interface, and memory protection unit (MPU) meet AUTOSAR timing, safety, and debugging requirements. NXP provides certified MCAL drivers for FlexCAN, LINFlex, DSPI, ADC, and eMIOS - all validated for use with SPC5604BF2MLL6 in production ECUs.
What debug interface does the SPC5604BF2MLL6 use?
The SPC5604BF2MLL6 implements the Nexus 2+ development interface (NDI) compliant with IEEE-ISTO 5001-2003 Class Two Plus. It supports real-time tracing, non-intrusive breakpoints, memory read/write during run mode, and exception analysis. Debug access is provided via dedicated MDO/MCKO/EVTO pins on the 100-pin LQFP package - no SWD or JTAG-only dependency, enabling advanced calibration and failure analysis in automotive test environments.
Is the SPC5604BF2MLL6 pin-compatible with other MPC5604x devices?
Yes, the SPC5604BF2MLL6 shares identical pinout and footprint with all MPC5604B/C variants in the 100-pin LQFP package (e.g., MPC5604BK0MLL6, MPC5604BF1MLL6). Signal mapping, power pin locations, and debug interface pin assignments are fully consistent across this package variant - enabling drop-in replacement within the same hardware design when migrating between speed grades or qualification levels.
How is flash programming performed on the SPC5604BF2MLL6?
Flash programming on the SPC5604BF2MLL6 is supported via its Boot Assist Module (BAM), which enables in-system programming over CAN or SCI (LINFlex) interfaces without external debug hardware. The BAM executes VLE code from ROM to configure flash controllers and verify writes. Production programming uses NXP's SPC56xx Flash Programming Tool with CAN-based bootloader, while engineering debug uses Nexus 2+ with compatible probes (e.g., Lauterbach TRACE32).
SPC5604BF2MLL6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LQFP
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 64MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 79
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 28x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5604BF2MLL6 FAQ
1.How can I place an order for SPC5604BF2MLL6 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5604BF2MLL6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5604BF2MLL6 reliable?
The price and inventory of SPC5604BF2MLL6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5604BF2MLL6 is usually 5 days.
3.What payment methods are accepted for SPC5604BF2MLL6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5604BF2MLL6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5604BF2MLL6?
SPC5604BF2MLL6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5604BF2MLL6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5604BF2MLL6?
For technical support, including SPC5604BF2MLL6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5604BF2MLL6 requirements.
6.How does Aetrix verify that SPC5604BF2MLL6 is sourced from the original manufacturer or authorized distributors?
All SPC5604BF2MLL6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5604BF2MLL6 meets industry standards.
7.What is the process for return or replacement of SPC5604BF2MLL6?
All SPC5604BF2MLL6 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5604BF2MLL6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5604BF2MLL6 part is unused and in its original packaging.
Return procedure for SPC5604BF2MLL6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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