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NXP Semiconductors SPC5604BK0MLH6
- Part No.:
- SPC5604BK0MLH6
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
SPC5604BK0MLH6.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,220
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Product details
Overview
SPC5604BK0MLH6 from NXP Semiconductors is a 32-bit automotive microcontroller based on the Power Architecture® e200z0h core, operating up to 64 MHz with VLE instruction encoding. It integrates 512 KB code flash, 64 KB data flash, 48 KB SRAM (all with ECC), 6 FlexCAN modules, 4 LINFlex interfaces, and a 10-bit 36-channel ADC - deployed in body control modules for vehicle lighting and door actuation.
For engineers reviewing the SPC5604BK0MLH6 datasheet, SPC5604BK0MLH6 pinout, SPC5604BK0MLH6 application, or SPC5604BK0MLH6 equivalent, key selection criteria include FMPLL clock generation, Nexus 2+ debug support, crossbar switch concurrency, boot assist via CAN/SCI, and automotive-grade thermal operation up to 125 °C ambient.
Technical Context
The SPC5604BK0MLH6 implements a single-issue e200z0h CPU core with Variable Length Encoding (VLE) for reduced code footprint and optimized low-power execution. Its memory subsystem includes ECC-protected 512 KB flash, 64 KB data flash, and 48 KB SRAM, managed by an 8-region MPU with 32-byte granularity.
Peripherals are interconnected via a 64-bit crossbar switch enabling concurrent access among CPU, DMA, and peripherals. Clocking relies on a frequency-modulated PLL (FMPLL), dual RC oscillators (16 MHz fast / 128 kHz slow), and external crystal support (4–16 MHz XTAL/EXTAL), all monitored by the Clock Monitor Unit (CMU).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h Power Architecture® core with VLE encoding for 30% average code size reduction vs. pure 32-bit ISA |
| Max Operating Frequency | 64 MHz at 125 °C ambient - enables real-time body control loop execution within AUTOSAR timing constraints |
| Flash Memory | 512 KB on-chip code flash with ECC and 64 KB data flash (4 × 16 KB sectors) supporting field firmware updates |
| RAM | 48 KB SRAM with ECC - protects safety-critical variables and stack integrity per ISO 26262 ASIL-B requirements |
| ADC | 10-bit, 36-channel SAR ADC with CTU-triggered conversion synchronization for precise sensor sampling |
| Communication Interfaces | 6 FlexCAN (ISO 11898-1 compliant), 4 LINFlex (LIN 2.2A), 3 DSPI, 1 I²C - supports multi-bus vehicle network topologies |
| Debug & Test | Nexus 2+ interface (IEEE-ISTO 5001-2003 Class Two Plus) and JTAG (IEEE 1149.1) for production boundary scan and real-time trace |
Pinout & Package
SPC5604BK0MLH6 is packaged in 144-pin LQFP (20 × 20 × 1.4 mm), with 123 configurable GPIO pins (package-dependent), dedicated voltage domains (VDD_HV/VSS_HV, VDD_LV/VSS_LV, VDD_BV), and analog supply rails (VDD_HV_ADC/VSS_HV_ADC) isolated for ADC noise immunity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Asynchronous reset input | Pulled high after PHASE2 completion; initiates full device reset with internal power-on sequence and register initialization |
| XTAL / EXTAL | Crystal oscillator inputs | Support 4–16 MHz external crystal; tristated during reset - require external 12 pF load capacitors for stable startup |
| VDD_HV / VSS_HV | Digital supply and ground | Three pairs (pins 19, 51, 123 / 18, 49, 122) provide low-impedance power delivery and reduce simultaneous switching noise |
| VDD_LV / VSS_LV | 1.2 V core regulator decoupling | Three dedicated pairs (pins 23, 46, 124 / 22, 47, 125) require local 100 nF ceramic capacitors for stable internal voltage regulation |
| PA[7] | Multi-function port pin | Configurable as GPIO[7], eMIOS_0 channel, or LIN3TX - selected via SIUL PCR register for LIN physical layer output |
| PC[0] | General-purpose input | Default WKPU[1] wakeup source; supports edge-triggered interrupt with programmable debounce filtering |
Key Features
| Feature | Design Value |
|---|---|
| Boot Assist Module (BAM) | Enables in-system flash programming over CAN or SCI without external debugger - reduces manufacturing test time and field update complexity |
| Crossbar Switch Architecture | 64-bit data bus with 2×3 master-slave arbitration allows concurrent CPU, DMA, and peripheral access to flash/SRAM - eliminates bus contention in high-throughput control loops |
| Real-Time Counter (RTC) | Autonomous 1 ms resolution timer with 128 kHz or 16 MHz clock source - provides wake-from-sleep capability with ≤2 s max timeout for low-power body electronics |
| Memory Protection Unit (MPU) | 8 region descriptors with 32-byte granularity enforce isolation between application, bootloader, and safety monitor tasks - foundational for ASIL-B software partitioning |
| Enhanced Modular I/O System (eMIOS-lite) | 56-channel 16-bit timer subsystem supporting input capture, output compare, and PWM generation - replaces discrete timers in motor drive and LED dimming functions |
Applications
| Body Control Module (BCM) | Seat Position Memory System |
|---|---|
Use Scenario: Centralized control of exterior lighting, window lifts, mirror adjustment, and door locks in modern passenger vehicles. IC Role / Device Role / Timing Role: Primary host controller executing AUTOSAR-compliant BSW and application layers; manages LIN/CAN gateway functions and real-time PWM for LED drivers. Use Value: 6 FlexCAN channels enable direct integration with engine, chassis, and infotainment networks; 36-channel ADC monitors potentiometers and temperature sensors for closed-loop seat position calibration. |
Use Scenario: Storing and recalling driver-specific seat, mirror, and steering column positions using non-volatile memory and motor feedback. IC Role / Device Role / Timing Role: Safety-aware motion controller with position tracking, current sensing, and EEPROM emulation via data flash for wear-leveling. Use Value: 64 KB data flash with ECC ensures reliable storage of 100+ seat profiles across 15-year vehicle lifetime; eMIOS-lite generates synchronized PWM for dual DC motor drives. |
| Roof Module with Sunroof Control | Smart Rearview Mirror Interface |
Use Scenario: Coordinating sunroof open/close, tilt, pinch detection, and rain sensor response in roof-mounted electronic modules. IC Role / Device Role / Timing Role: Real-time safety monitor interfacing with Hall-effect position sensors, current sense amplifiers, and LIN-connected rain sensor. Use Value: CTU synchronizes ADC sampling with eMIOS timer events for precise pinch detection timing; RTC triggers periodic self-test routines during vehicle sleep mode. |
Use Scenario: Aggregating signals from ambient light, glare, and vehicle speed sensors to auto-dim electrochromic mirrors and display ADAS alerts. IC Role / Device Role / Timing Role: Sensor fusion hub with LINFlex for interior network communication and SPI for display driver interface. Use Value: 4 LINFlex modules support concurrent connection to HVAC, lighting, and instrument cluster; 10-bit ADC resolves 0.1 lux ambient light changes for smooth dimming transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5604BK0MLH6 | Same silicon die and package; SPC5604BK0MLH6 is NXP's automotive-qualified version with extended temperature (-40 °C to 125 °C) and AEC-Q100 Grade 2 certification | Required for production automotive ECUs; supports full diagnostic features (ECSM, SWT, WKPU) and safety libraries | Select SPC5604BK0MLH6 for certified production use; MPC5604BK0MLH6 is for prototyping only |
| S32K144HAT0VLHT | ARM Cortex-M4F core, 112 MHz, 512 KB flash, 128 KB RAM; includes hardware security module (HSM) and CAN FD support - no VLE or Power Architecture compatibility | Better suited for new designs requiring CAN FD, secure boot, or higher compute throughput; lacks native AUTOSAR BSW for legacy Power Architecture toolchains | Choose S32K144HAT0VLHT for next-gen platforms needing cybersecurity or CAN FD; retain SPC5604BK0MLH6 for cost-sensitive, CAN-only body electronics with existing software investment |
Compared with MPC5604BK0MLH6, the SPC5604BK0MLH6 delivers guaranteed automotive qualification and diagnostic readiness, while the S32K144HAT0VLHT offers modern ARM architecture and CAN FD but requires full software re-architecture - making SPC5604BK0MLH6 optimal for incremental upgrades of established Power Architecture-based BCMs.
Availability
SPC5604BK0MLH6 is available at Aetrix Electronics and suitable for automotive body electronics, seat control systems, and roof module applications requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 compliance.
Supply support for SPC5604BK0MLH6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with headquarters in Eindhoven, Netherlands.
The SPC5604BK0MLH6 belongs to NXP's SPC560x automotive MCU family, designed specifically for cost-optimized body electronics control units requiring functional safety, robust EMC performance, and seamless integration with legacy Power Architecture development tools.
FAQ
What is the maximum junction temperature specification for the SPC5604BK0MLH6?
The SPC5604BK0MLH6 is rated for operation up to 150 °C junction temperature, with recommended ambient operating conditions of –40 °C to +125 °C per AEC-Q100 Grade 2 qualification. Thermal derating begins above 125 °C ambient, and PCB layout must include adequate copper pour and thermal vias under the exposed pad (if applicable) to maintain safe junction temperatures during sustained 64 MHz operation. The SPC5604BK0MLH6 datasheet specifies thermal resistance θJA = 32 °C/W for the 144 LQFP package.
Does the SPC5604BK0MLH6 support CAN FD or only classical CAN?
The SPC5604BK0MLH6 supports only classical CAN (ISO 11898-1) via its six FlexCAN modules - it does not implement CAN FD protocol features such as variable bit rate or extended data length. Each FlexCAN module is configurable for standard (11-bit) or extended (29-bit) identifiers and supports programmable message buffers, but lacks the transceiver-independent FD frame handling logic found in later-generation MCUs like the S32K series. For CAN FD migration, the SPC5604BK0MLH6 requires external protocol translation or platform upgrade.
How is flash programming performed on the SPC5604BK0MLH6 in production?
Flash programming on the SPC5604BK0MLH6 is performed via the Boot Assist Module (BAM) using either CAN or SCI serial interfaces, eliminating need for JTAG during mass production. The BAM executes VLE code from ROM to configure clocks, initialize memory controllers, and load flash algorithms - enabling secure, high-speed programming at line speeds up to 1 Mbps on CAN. Production programming requires NXP's SPC56xx Flash Programming Software and compatible host adapter; JTAG remains available for debug and pre-production validation of the SPC5604BK0MLH6.
What debug interfaces does the SPC5604BK0MLH6 provide, and are they accessible simultaneously?
The SPC5604BK0MLH6 provides both Nexus 2+ (IEEE-ISTO 5001-2003 Class Two Plus) and JTAG (IEEE 1149.1) debug interfaces. They are electrically multiplexed on shared pins (e.g., TCK/TMS/TDI/TDO map to Nexus MCKO/MSEO/MDO[0:3]), so only one interface can be active at a time. Nexus 2+ supports real-time trace, complex breakpoints, and data watchpoints essential for AUTOSAR stack development, while JTAG is used for boundary scan testing and basic register access. Selection is controlled by boot mode configuration pins at reset.
Is the SPC5604BK0MLH6 pin-compatible with other members of the MPC5604B/C family?
The SPC5604BK0MLH6 is pin-compatible with other 144-pin LQFP variants in the MPC5604B/C family (e.g., MPC5604BK0MLH6, MPC5604CK0MLH6), sharing identical mechanical footprint, power pin mapping, and core peripheral signal locations. However, peripheral availability (e.g., number of FlexCAN modules, ADC channels, or LINFlex instances) varies by part number due to mask-ROM configuration - software must verify runtime feature enablement via ECSM registers rather than assuming full peripheral presence solely from the SPC5604BK0MLH6 package.
SPC5604BK0MLH6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 64MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5604BK0MLH6 FAQ
1.How can I place an order for SPC5604BK0MLH6 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5604BK0MLH6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5604BK0MLH6 reliable?
The price and inventory of SPC5604BK0MLH6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5604BK0MLH6 is usually 5 days.
3.What payment methods are accepted for SPC5604BK0MLH6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5604BK0MLH6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5604BK0MLH6?
SPC5604BK0MLH6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5604BK0MLH6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5604BK0MLH6?
For technical support, including SPC5604BK0MLH6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5604BK0MLH6 requirements.
6.How does Aetrix verify that SPC5604BK0MLH6 is sourced from the original manufacturer or authorized distributors?
All SPC5604BK0MLH6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5604BK0MLH6 meets industry standards.
7.What is the process for return or replacement of SPC5604BK0MLH6?
All SPC5604BK0MLH6 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5604BK0MLH6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5604BK0MLH6 part is unused and in its original packaging.
Return procedure for SPC5604BK0MLH6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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