Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors SPC5605BF1CLL6R

Part No.:
SPC5605BF1CLL6R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixSPC5605BF1CLL6R.pdf
Description:
IC MCU 32BIT 768KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,920

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

SPC5605BF1CLL6R from NXP Semiconductors (formerly Freescale) is a 32-bit automotive MCU based on the e200z0 Power Architecture core, featuring 768 KB Flash, 64 KB RAM, 6 CAN interfaces, up to 8 LINFlex modules, and dual ADCs (12-bit/16-ch + 10-bit/32-ch), deployed in central body controllers and gateway modules for vehicle network management.

For engineers reviewing the SPC5605BF1CLL6R datasheet, SPC5605BF1CLL6R pinout, SPC5605BF1CLL6R application, or SPC5605BF1CLL6R equivalent, key selection criteria include CAN/LIN peripheral count, Flash/RAM sizing for AUTOSAR-compliant firmware, LQFP-100 thermal and layout constraints, and eMIOS200 timer flexibility for PWM-synchronized diagnostics.

Technical Context

The SPC5605BF1CLL6R implements a scalable e200z0 core with Variable Length Encoding (VLE) support and integrated FMPLL clock generation, enabling deterministic real-time execution at up to 64 MHz. It integrates FlexCAN modules with FIFO/mailbox buffering and LINFlex peripherals with hardware-managed frame scheduling for low-CPU-overhead communication.

Its eMIOS200 module provides 64 channels of input capture, output compare, and PWM generation-including shifted PWM outputs for EMI reduction-while the Cross Triggering Unit (CTU) synchronizes PWM edges with ADC sampling for precise closed-loop control and diagnostic acquisition.

Key Specifications

ParameterValue and Actual Design Meaning
Coree200z0 Power Architecture® core with VLE support, enabling compact code density and deterministic interrupt latency for ASIL-B–capable control tasks.
Max Clock Speed64 MHz - delivers sufficient MIPS for concurrent CAN/LIN protocol stacks, sensor fusion, and actuator PWM control in body domain ECUs.
Flash Memory768 KB Flash with ECC - supports dual-bank operation and robust firmware updates while meeting ISO 26262 memory safety requirements.
RAM64 KB SRAM with ECC - accommodates runtime variables, stack, and AUTOSAR OS objects with error detection for safety-critical data.
CAN Interfaces6 FlexCAN modules - enables full vehicle body network routing (e.g., door, seat, lighting, HVAC gateways) without external bridge ICs.
ADC SystemDual ADC: 12-bit/16-ch + 10-bit/32-ch - allows simultaneous high-resolution battery sensing and multi-channel analog monitoring (e.g., potentiometers, thermistors).
PackageLQFP-100 (14 × 14 mm, 0.5 mm pitch) - provides mechanical reliability and thermal performance suitable for under-hood and cabin-mounted automotive modules.

Pinout & Package

LQFP-100 package with exposed thermal pad; RoHS-compliant, AEC-Q100 Grade 1 qualified (−40 °C to +125 °C ambient operating range).

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VDDIOPower supply domainsSeparate analog/digital/IO supplies enable noise isolation for ADC accuracy and robust digital logic operation.
VRH, VRLAnalog reference inputsConfigurable reference voltage pair for ADC full-scale adjustment and ratiometric sensor measurement.
CAN0_TX / CAN0_RXController Area Network channel 0 differential interfaceDirect connection to external CAN transceiver; supports ISO 11898-2 physical layer at up to 1 Mbps.
LIN0_TX / LIN0_RXLocal Interconnect Network channel 0 single-wire interfaceHardware-managed LIN 2.1/2.2 frame generation and reception; eliminates software bit-banging overhead.
ADC0_IN0–ADC0_IN15Analog input channels (12-bit)Support multiplexed sampling of up to 16 sensors with programmable conversion sequences and trigger sources.
EMIOS0_CH0–CH63eMIOS200 timer/PWM channels64 flexible channels supporting input capture (edge timing), output compare (event generation), and PWM (motor/LED dimming) with synchronized start/stop.

Key Features

FeatureDesign Value
FlexCAN with FIFO + mailbox modeEnables mixed traffic handling: periodic status messages via FIFO and event-triggered alerts (e.g., crash signal) via mailboxes-critical for gateway prioritization.
LINFlex hardware protocol engineOffloads LIN frame assembly/disassembly, checksum calculation, and schedule table management from CPU, reducing latency by >80% vs. software-only LIN.
eMIOS200 with shifted PWMGenerates phase-shifted PWM outputs across multiple channels to spread electromagnetic emissions over frequency spectrum, easing EMC compliance testing.
Cross Triggering Unit (CTU)Synchronizes PWM edge transitions with ADC sampling instants, enabling precise current/voltage measurements in motor control or power diagnostics.
Scalable e200z0 core + tool compatibilityAllows migration to MPC5606B/MPC5607B without redesigning driver layers or revalidating AUTOSAR BSW components.

Applications

Central Body ControllerGateway Controller

Use Scenario: Integrated control unit managing door locks, windows, mirrors, interior lighting, and seat position memory in premium vehicles.

IC Role / Device Role / Timing Role: Primary host MCU executing body domain application software, coordinating LIN slaves and CAN subnets via internal FlexCAN and LINFlex peripherals.

Use Value: 768 KB Flash hosts AUTOSAR-compliant body control SW with OTA update capability; 6 CAN ports eliminate need for external CAN bridges.

Use Scenario: In-vehicle network gateway bridging high-speed CAN FD backbone (powertrain) with low-speed body CAN and LIN clusters (sensors/actuators).

IC Role / Device Role / Timing Role: Protocol translation and message filtering hub with real-time arbitration between heterogeneous networks using dedicated FlexCAN and LINFlex modules.

Use Value: Hardware FIFO/mailbox separation ensures time-critical crash signals bypass lower-priority infotainment traffic, meeting ASIL-B timing deadlines.

Comfort Control ModuleRoof Module Controller

Use Scenario: Sunroof, panoramic roof, and ambient lighting controller requiring precise motor positioning and RGB LED dimming.

IC Role / Device Role / Timing Role: Real-time motion control MCU using eMIOS200 PWM outputs with CTU-synchronized ADC sampling for current feedback loop closure.

Use Value: Shifted PWM reduces conducted EMI during motor commutation; dual ADC enables simultaneous voltage/current sensing for fault detection.

Use Scenario: Roof electronics module integrating rain/light sensors, sunshade position, and HVAC vent control in automated climate systems.

IC Role / Device Role / Timing Role: Sensor fusion aggregator with LINFlex-connected sensors and CAN-uplinked status reporting; uses 12-bit ADC for precision analog sensor conditioning.

Use Value: 16-channel 12-bit ADC supports ratiometric measurement of multiple thermistors and photodiodes without external signal conditioning.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive body MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MPC5606B1 MB Flash, 80 KB RAM, same peripheral set, LQFP-144/176 packages only - no LQFP-100 option.Higher memory headroom for complex diagnostics or larger AUTOSAR stacks; requires PCB redesign if migrating from SPC5605BF1CLL6R's LQFP-100 footprint.Select when firmware growth exceeds 768 KB or additional RAM is needed for logging buffers; not drop-in compatible due to package mismatch.
SPC5604B512 KB Flash, 32 KB RAM, 3 CAN, 4 LINFlex - reduced peripheral count and memory vs. SPC5605BF1CLL6R.Suitable for entry-level body nodes (e.g., single-door module); insufficient for full gateway or central controller roles requiring 6 CAN or 8 LIN.Choose for cost-sensitive, lower-functionality nodes where 64 MHz speed and e200z0 core compatibility are retained but memory/peripheral scaling is unnecessary.

Compared with MPC5606B and SPC5604B, the SPC5605BF1CLL6R delivers optimal balance of memory (768 KB Flash/64 KB RAM), 6-CAN connectivity, and LQFP-100 packaging for mid-tier automotive body controllers-avoiding both over-specification and functional limitation in gateway and central ECU designs.

Availability

SPC5605BF1CLL6R is available at Aetrix Electronics and suitable for central body controllers, gateway controllers, comfort control modules, and roof module controllers requiring stable component supply across automotive production lifecycles.

Supply support for SPC5605BF1CLL6R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in Power Architecture® MCU development.

The Qorivva MPC560xB/C/D product line was engineered specifically for ASIL-B–compliant automotive body electronics, emphasizing peripheral integration (CAN/LIN/ADC/eMIOS), functional safety features (ECC, lockstep options), and toolchain continuity across scalability tiers.

FAQ

What is the operating temperature range for SPC5605BF1CLL6R?

The SPC5605BF1CLL6R is qualified per AEC-Q100 Grade 1, supporting continuous operation from −40 °C to +125 °C ambient temperature. This rating covers under-hood and cabin-mounted automotive applications where thermal stress and long-term reliability are critical. The device includes on-die thermal monitoring and voltage regulation circuitry to maintain functional integrity across this full range. SPC5605BF1CLL6R meets automotive qualification standards without derating.

Does SPC5605BF1CLL6R support AUTOSAR-compliant software stacks?

Yes, SPC5605BF1CLL6R is fully supported by AUTOSAR 4.x-compliant MCAL drivers from NXP and third-party providers, including CAN, LIN, ADC, PWM, and EEPROM emulation modules. Its e200z0 core, memory protection unit (MPU), and deterministic interrupt latency meet ASIL-B requirements for body domain software. SPC5605BF1CLL6R has been validated in production AUTOSAR-based body control units since 2013.

What debug interface does SPC5605BF1CLL6R use?

SPC5605BF1CLL6R implements the Nexus Class 3+ debug interface via its JTAG port, supporting real-time trace, non-intrusive breakpoints, and memory access during active execution. It is compatible with Lauterbach TRACE32, PLS UDE, and NXP S32DS IDE debug probes. The JTAG interface also enables boundary scan testing and flash programming in production environments. SPC5605BF1CLL6R does not support SWD or serial wire debug.

Is SPC5605BF1CLL6R pin-compatible with other MPC560x devices?

No, SPC5605BF1CLL6R in LQFP-100 is not pin-compatible with MPC5606B (LQFP-144/176) or MPC5604B (LQFP-64/100/144 with different pin assignments). While all share the e200z0 core and peripheral IP, pin mapping differs significantly across packages-even within the same pin count-due to I/O multiplexing and power domain layout variations. SPC5605BF1CLL6R requires its own unique PCB layout.

What safety features are integrated into SPC5605BF1CLL6R?

SPC5605BF1CLL6R includes ECC on Flash and SRAM, memory protection unit (MPU), clock monitor, windowed watchdog timer, and safe startup sequence with boot ROM self-test. These features support ISO 26262 ASIL-B system-level compliance when implemented per NXP's safety manual. No lockstep core or dual-core redundancy is present-safety is achieved through hardware error detection and software-managed fault containment. SPC5605BF1CLL6R documentation specifies failure-in-time (FIT) rates for each safety mechanism.

SPC5605BF1CLL6R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
100-LQFP
Series:
MPC56xx Qorivva
Packaging:
Tape & Reel (TR)
Product Status:
Not For New Designs
Programmable:
Not Verified
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
64MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
77
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 7x10b, 5x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SPC5605BF1CLL6R FAQ

1.How can I place an order for SPC5605BF1CLL6R through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC5605BF1CLL6R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC5605BF1CLL6R reliable?

The price and inventory of SPC5605BF1CLL6R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5605BF1CLL6R is usually 5 days.

3.What payment methods are accepted for SPC5605BF1CLL6R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5605BF1CLL6R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC5605BF1CLL6R?

SPC5605BF1CLL6R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC5605BF1CLL6R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC5605BF1CLL6R?

For technical support, including SPC5605BF1CLL6R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5605BF1CLL6R requirements.

6.How does Aetrix verify that SPC5605BF1CLL6R is sourced from the original manufacturer or authorized distributors?

All SPC5605BF1CLL6R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5605BF1CLL6R meets industry standards.

7.What is the process for return or replacement of SPC5605BF1CLL6R?

All SPC5605BF1CLL6R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5605BF1CLL6R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC5605BF1CLL6R part is unused and in its original packaging.

Return procedure for SPC5605BF1CLL6R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SPC5605BF1CLL6R Tags

  • SPC5605BF1CLL6R
  • SPC5605BF1CLL6R PDF
  • SPC5605BF1CLL6R Datasheet
  • SPC5605BF1CLL6R Specifications
  • SPC5605BF1CLL6R Images
  • NXP Semiconductors
  • NXP Semiconductors SPC5605BF1CLL6R
  • Buy SPC5605BF1CLL6R
  • SPC5605BF1CLL6R Price
  • SPC5605BF1CLL6R Distributor
  • SPC5605BF1CLL6R Supplier
  • SPC5605BF1CLL6R Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER