Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors SPC5605BK0MLL4R

Part No.:
SPC5605BK0MLL4R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixSPC5605BK0MLL4R.pdf
Description:
IC MCU 32BIT 768KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,718

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

SPC5605BK0MLL4R from NXP Semiconductors (formerly Freescale) is a 32-bit automotive MCU based on the e200z0 Power Architecture core, featuring 768 KB Flash, 64 KB RAM, 6 CAN interfaces, up to 8 LINFlex modules, and dual ADCs (12-bit/16-ch + 10-bit/32-ch), deployed in central body controllers and gateway systems requiring ASIL-B capable control logic.

For engineers reviewing the SPC5605BK0MLL4R datasheet, SPC5605BK0MLL4R pinout, SPC5605BK0MLL4R application, or SPC5605BK0MLL4R equivalent, key selection criteria include CAN/LIN peripheral count, Flash/RAM sizing for diagnostic firmware, LQFP-144 package compatibility, and eMIOS200 timer channel scalability for PWM-synchronized sensor sampling.

Technical Context

The SPC5605BK0MLL4R implements a VLE-capable e200z0 core with FMPLL clock generation and memory protection unit (MPU), supporting deterministic real-time execution in automotive body networks. It integrates FlexCAN with FIFO/mailbox buffering and LINFlex with hardware message scheduling to offload CPU interrupt handling.

Cross-triggering between eMIOS200 PWM outputs and ADC conversions enables synchronized diagnostics, while ECC-protected Flash and SRAM meet functional safety requirements for ASIL-B software execution. The device operates across –40 °C to +125 °C with supply voltage range 3.0–3.6 V.

Key Specifications

ParameterValue and Actual Design Meaning
Core Architecturee200z0 Power Architecture core with Variable Length Encoding (VLE) for compact code footprint
Flash Memory768 KB on-chip Flash with ECC and 64 KB Data Flash for parameter storage
RAM64 KB SRAM with ECC for runtime data integrity
CAN Interfaces6 FlexCAN modules supporting ISO 11898-1, each with configurable mailboxes/FIFO
LIN InterfacesUp to 8 LINFlex modules compliant with LIN 2.2A, supporting auto-scheduling and checksum
ADC SystemDual ADC: 12-bit/16-channel + 10-bit/32-channel, cross-triggered with eMIOS200 timers
Operating Temp–40 °C to +125 °C ambient, qualified per AEC-Q100 Grade 1
Max Clock Speed64 MHz system clock via FMPLL with crystal or external oscillator input

Pinout & Package

SPC5605BK0MLL4R is housed in a 144-pin LQFP (Low-Profile Quad Flat Package) with 0.5 mm pitch, thermally enhanced for automotive under-hood environments. Pin assignment follows NXP's standardized MPC560xB/C/D pinout mapping for mechanical and signal layout reuse across family variants.

Pin/TerminalCircuit RoleDesign Meaning
VDD_MAINMain power supply3.0–3.6 V core and I/O supply, decoupled per datasheet layout guidelines
VDD_IOI/O power domainIndependent 3.3 V rail enabling mixed-voltage interface operation
RESET_INAsynchronous reset inputActive-low signal initiating cold start, watchdog timeout, or JTAG-initiated reset
CAN0_TX / CAN0_RXFlexCAN0 differential transceiver interfaceDirect connection to external CAN transceiver (e.g., TJA1042); no internal termination
LIN0_TX / LIN0_RXLINFlex0 UART-based physical layerSingle-wire bus interface supporting master/slave mode and automatic break detection
ADC0_IN0–ADC0_IN15Analog input channels16 dedicated pins for 12-bit ADC0; shared with GPIO when not configured as analog inputs
EMIOS0_CH0–CH63eMIOS200 timer channel I/OConfigurable as input capture, output compare, or PWM output with programmable dead time

Key Features

FeatureDesign Value
FlexCAN with FIFO/mailbox architectureEnables concurrent handling of periodic (gateway routing) and event-driven (diagnostic request) CAN traffic without CPU polling
LINFlex hardware protocol engineReduces CPU overhead by >70% versus software LIN stacks; supports automatic header generation and response timing
eMIOS200 with cross-triggeringSynchronizes PWM edge transitions with ADC sampling windows for precise motor current measurement and fault detection
ECC-protected Flash/SRAMEnables single-bit error correction and double-bit error detection required for ASIL-B compliance in body control applications
Scalable e200z0 core with VLESupports migration to higher-performance MPC5606B/MPC5607B without toolchain or driver rework

Applications

Central Body ControllerGateway Controller

Use Scenario: Integrated control of door locks, window lifts, lighting, and seat position in premium vehicle platforms.

IC Role / Device Role / Timing Role: Primary host MCU executing body domain software stack with real-time CAN/LIN coordination and EEPROM-backed configuration storage.

Use Value: 768 KB Flash accommodates multi-feature firmware with OTA update partitioning; 6 CAN interfaces enable direct connectivity to chassis, powertrain, and infotainment domains.

Use Scenario: Protocol translation and message filtering between high-speed CAN FD backbone and low-speed LIN subnetworks in modern E/E architectures.

IC Role / Device Role / Timing Role: Real-time gateway processor managing CAN-to-LIN bridging, diagnostic session routing, and network wake-up arbitration.

Use Value: Dual ADCs support onboard voltage/current monitoring for power rail health; eMIOS200 cross-triggering ensures synchronized sampling during gateway load transients.

Comfort Control ModuleRoof Module Controller

Use Scenario: HVAC actuator control, mirror adjustment, and ambient lighting dimming in entry/mid-tier vehicles.

IC Role / Device Role / Timing Role: Dedicated comfort domain controller interfacing with LIN slaves (blower motors, stepper drivers) and local sensors via ADC.

Use Value: Up to 8 LINFlex modules eliminate need for external LIN transceivers in multi-node comfort clusters; 64 KB RAM supports dynamic PID loop tuning tables.

Use Scenario: Sunroof, panoramic roof, and interior lighting control with anti-pinch sensing and position feedback.

IC Role / Device Role / Timing Role: Safety-aware roof domain MCU performing analog sensor fusion (potentiometer, current sense) and PWM-driven motor control with stall detection.

Use Value: 12-bit ADC with cross-triggered sampling captures motor current waveforms at exact commutation points; ECC memory prevents corruption of critical position history logs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive body control applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MPC5606B1 MB Flash, 80 KB RAM, same peripheral set but higher memory capacity and identical 144 LQFP pinoutPreferred for designs requiring larger bootloader partitions or expanded diagnostic log buffersSelect MPC5606B when firmware growth headroom exceeds 25% or when future feature expansion is planned
SPC5604BK0MLL4512 KB Flash, 32 KB RAM, 3 CAN, 4 LINFlex, same 144 LQFP package and core architectureSuitable for cost-sensitive entry-level body nodes with reduced communication bandwidth needsChoose SPC5604BK0MLL4 where CAN/LIN count and memory footprint align with minimal gateway functionality

Compared with SPC5605BK0MLL4R, MPC5606B offers scalable memory for complex gateways, while SPC5604BK0MLL4 provides a lower-cost entry point with reduced peripheral count-both share identical pinout and toolchain compatibility, enabling hardware reuse across platform tiers.

Availability

SPC5605BK0MLL4R is available at Aetrix Electronics and suitable for central body controllers, gateway controllers, and comfort control modules requiring stable component supply across automotive production lifecycles.

Supply support for SPC5605BK0MLL4R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in Power Architecture-based MCUs and functional safety certification.

The Qorivva MPC560xB/C/D product line was engineered specifically for ASIL-B automotive body electronics, emphasizing peripheral integration, memory safety, and thermal robustness in harsh vehicle environments.

FAQ

What is the operating temperature range for SPC5605BK0MLL4R?

The SPC5605BK0MLL4R is rated for continuous operation from –40 °C to +125 °C ambient temperature and is qualified to AEC-Q100 Grade 1 standards. This range supports placement in engine compartments, under-dash modules, and other thermally demanding automotive locations. The device incorporates thermal monitoring circuitry and voltage regulation designed to maintain functional integrity across this full range. SPC5605BK0MLL4R maintains specified timing and analog performance without derating within these limits.

Does SPC5605BK0MLL4R support CAN FD?

No, SPC5605BK0MLL4R implements classical CAN 2.0B (ISO 11898-1) only, with six FlexCAN modules supporting up to 1 Mbps. It does not include CAN FD (Flexible Data-Rate) capability, which was introduced in later NXP S32K and MPC57xx families. For CAN FD requirements, designers should consider migrating to S32K144 or MPC5744P. SPC5605BK0MLL4R remains fully compatible with legacy automotive CAN networks used in body and gateway applications.

What debug interface does SPC5605BK0MLL4R use?

SPC5605BK0MLL4R uses the Nexus Class 3+ debug interface via JTAG, supporting real-time trace, hardware breakpoints, and non-intrusive memory access. It is compatible with standard NXP-compatible debug probes including P&E Multilink Universal and Lauterbach TRACE32. The debug port is accessible through dedicated TDI/TDO/TCK/TMS pins on the 144 LQFP package, and no additional configuration is required to enable full debug visibility. SPC5605BK0MLL4R also supports background debug mode (BDM) for flash programming and runtime inspection.

Is SPC5605BK0MLL4R pin-compatible with other MPC560x devices?

Yes, SPC5605BK0MLL4R in the 144 LQFP package shares identical pinout with MPC5604B, MPC5604C, MPC5606B, and MPC5607B in the same package variant. Signal assignments, power/ground pin locations, and debug interface pins are fully aligned, enabling PCB reuse across the MPC560xB/C/D family. However, peripheral enablement (e.g., number of active CAN/LIN modules) and memory size differ, so firmware must be validated per part. SPC5605BK0MLL4R retains full hardware compatibility within this 144-pin footprint group.

What safety certifications apply to SPC5605BK0MLL4R?

SPC5605BK0MLL4R is AEC-Q100 qualified (Grade 1) and supports development of ASIL-B compliant systems per ISO 26262. It includes hardware safety features such as ECC on Flash/SRAM, lockstep-capable peripherals (eMIOS200, ADC), and memory protection unit (MPU). While the device itself is not certified to ASIL-B, its architecture and failure modes are documented in NXP's FMEDA report (document MPC560XB_FMEDA). SPC5605BK0MLL4R is widely deployed in production ASIL-B body control units with appropriate software safety mechanisms.

SPC5605BK0MLL4R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
100-LQFP
Series:
MPC56xx Qorivva
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
64MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
77
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 7x10b, 5x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SPC5605BK0MLL4R FAQ

1.How can I place an order for SPC5605BK0MLL4R through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC5605BK0MLL4R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC5605BK0MLL4R reliable?

The price and inventory of SPC5605BK0MLL4R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5605BK0MLL4R is usually 5 days.

3.What payment methods are accepted for SPC5605BK0MLL4R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5605BK0MLL4R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC5605BK0MLL4R?

SPC5605BK0MLL4R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC5605BK0MLL4R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC5605BK0MLL4R?

For technical support, including SPC5605BK0MLL4R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5605BK0MLL4R requirements.

6.How does Aetrix verify that SPC5605BK0MLL4R is sourced from the original manufacturer or authorized distributors?

All SPC5605BK0MLL4R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5605BK0MLL4R meets industry standards.

7.What is the process for return or replacement of SPC5605BK0MLL4R?

All SPC5605BK0MLL4R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5605BK0MLL4R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC5605BK0MLL4R part is unused and in its original packaging.

Return procedure for SPC5605BK0MLL4R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SPC5605BK0MLL4R Tags

  • SPC5605BK0MLL4R
  • SPC5605BK0MLL4R PDF
  • SPC5605BK0MLL4R Datasheet
  • SPC5605BK0MLL4R Specifications
  • SPC5605BK0MLL4R Images
  • NXP Semiconductors
  • NXP Semiconductors SPC5605BK0MLL4R
  • Buy SPC5605BK0MLL4R
  • SPC5605BK0MLL4R Price
  • SPC5605BK0MLL4R Distributor
  • SPC5605BK0MLL4R Supplier
  • SPC5605BK0MLL4R Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER