My Inquiry
My Account
NXP Semiconductors SPC5607BAMLQ6
- Part No.:
- SPC5607BAMLQ6
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
SPC5607BAMLQ6.pdf
- Description:
- IC MCU 32BIT 1.5MB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,342
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5607BAMLQ6 from NXP Semiconductors is an automotive-grade 32-bit Power Architecture® microcontroller featuring the e200z0h CPU core (up to 64 MHz), 1.5 MB on-chip code flash, 64 KB data flash with ECC, 96 KB SRAM, and integrated FlexCAN, LINFlex, DSPI, ADC (10-bit + 12-bit), and eMIOS timer subsystems. It targets body control modules, gateway ECUs, and lighting control units requiring ASIL-B functional safety support.
For engineers reviewing the SPC5607BAMLQ6 datasheet, SPC5607BAMLQ6 pinout, SPC5607BAMLQ6 application, or SPC5607BAMLQ6 equivalent, key selection criteria include its 144-pin LQFP (20 mm × 20 mm) package, FMPLL clock generation, Nexus 2+ debug interface, crossbar switch architecture for concurrent peripheral access, and dual ADC subsystem with CTU synchronization - all validated for automotive operating temperatures (–40 °C to 125 °C).
Technical Context
The SPC5607BAMLQ6 implements a single-issue e200z0h core compliant with Power Architecture embedded category and supports Variable Length Encoding (VLE) for reduced code footprint. Its memory subsystem includes MPU with 8 region descriptors and 32-byte granularity, boot assist module (BAM) enabling Flash programming via CAN or SCI, and FMPLL with frequency modulation for EMI reduction.
Peripherals are interconnected via a 64-bit wide, 2×3 crossbar switch supporting simultaneous master-to-slave transactions. The device integrates 6 FlexCAN modules (with configurable message buffers), 10 LINFlex interfaces, 6 DSPI controllers, and two independent ADCs (10-bit with 15 channels, 12-bit with 5 dedicated channels), synchronized via Cross Trigger Unit (CTU) to eMIOS or PIT timers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h, 32-bit Power Architecture®, VLE-enabled, up to 64 MHz - enables compact firmware and deterministic real-time execution in automotive body electronics. |
| Flash Memory | 1.5 MB code flash + 64 KB (4 × 16 KB) data flash with ECC - supports robust over-the-air updates and parameter storage with error correction. |
| RAM | 96 KB on-chip SRAM - sufficient for AUTOSAR OS stacks, CAN/LIN protocol stacks, and real-time control buffers. |
| ADC System | Two independent converters: 10-bit (15 ch) + 12-bit (5 ch), CTU-synchronized - enables precise sensor acquisition (e.g., temperature, voltage, position) with time-aligned sampling. |
| Timers & PWM | eMIOS with 33 I/O channels (16-bit), 8 PITs (32-bit), RTC with 1 ms wakeup resolution - delivers flexible timing for LED dimming, motor commutation, and low-power wake events. |
| Communication | 6 FlexCAN (ISO 11898-1), 10 LINFlex (LIN 2.2A), 6 DSPI, 1 I²C - meets full vehicle network requirements for body domain gateways and distributed control nodes. |
| Package | 144-pin LQFP, 20 mm × 20 mm, 0.5 mm pitch - industrial-standard footprint compatible with automated assembly and thermal management in under-hood environments. |
Pinout & Package
SPC5607BAMLQ6 is housed in a 144-pin LQFP (20 mm × 20 mm) package with exposed thermal pad. Pin functions follow NXP's standardized SIUL mapping, supporting up to 121 GPIOs (including analog inputs, CAN transceiver pins, oscillator connections, and Nexus 2+ debug signals). All supply pins (VDD_HV/VSS_HV, VDD_LV/VSS_LV, VDD_BV, VDD_HV_ADC0/1, VSS_HV_ADC0/1) are distributed across multiple corners for optimal power integrity and noise suppression.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Active-low reset input with Schmitt trigger and noise filter | Ensures reliable power-on and brownout recovery; weak pull-up after RGM PHASE2 enables flash-boot default behavior. |
| XTAL / EXTAL | Differential crystal oscillator input/output pair | Supports 4–16 MHz external crystal for high-accuracy system clock; bypass mode allows external clock injection. |
| VDD_HV / VSS_HV | Digital supply and ground (3.3 V nominal) | Four dedicated pairs minimize IR drop and switching noise; required for stable operation of CPU, Flash, and digital peripherals. |
| VDD_LV / VSS_LV | 1.2 V core regulator decoupling pins | Three pairs must be paired with local 100 nF capacitors to stabilize internal voltage regulator output for CPU and memory subsystems. |
| PA[0]–PA[15], PB[0]–PB[15], etc. | Configurable GPIO ports with alternate functions | Each port supports programmable slew rate (S/M/F), pull-up/down, and interrupt capability; multiplexed with CAN, LIN, SPI, ADC, and eMIOS signals. |
Key Features
| Feature | Design Value |
|---|---|
| FMPLL with frequency modulation | Reduces electromagnetic interference (EMI) by spreading spectral energy - critical for passing CISPR 25 Class 5 emissions tests in automotive applications. |
| Crossbar switch (XBAR) | Enables concurrent access to Flash, SRAM, and peripherals by CPU, eDMA, and debug masters - eliminates bus contention and improves real-time determinism. |
| Boot Assist Module (BAM) | Allows in-system Flash reprogramming via CAN or SCI without external debugger - simplifies field updates and production programming. |
| Memory Protection Unit (MPU) | 8-region hardware-enforced memory access control with 32-byte granularity - enforces AUTOSAR OS memory partitioning and prevents unintended code/data corruption. |
| Nexus 2+ debug interface | IEEE-ISTO 5001-2003 Class Two Plus compliance enables real-time trace, non-intrusive breakpoints, and complex trigger conditions - accelerates ISO 26262 ASIL-B software validation. |
Applications
| Body Control Module (BCM) | Vehicle Gateway ECU |
|---|---|
|
Use Scenario: Centralized control of door locks, window lifts, interior lighting, and mirror adjustment in modern passenger vehicles. IC Role / Device Role / Timing Role: Main application controller executing AUTOSAR-compliant BSW and application SW, managing LIN slave nodes and CAN communication with instrument cluster and HVAC. Use Value: 10× LINFlex interfaces enable direct connection to 10+ LIN sensors/actuators; 96 KB SRAM accommodates multi-tasking OS and diagnostic stacks (UDS, DoIP). |
Use Scenario: Aggregation and routing of messages between high-speed CAN FD backbone, low-speed LIN subnets, and Ethernet-based infotainment systems. IC Role / Device Role / Timing Role: Protocol translation hub with real-time message filtering, gateway security enforcement, and secure boot verification. Use Value: Dual CAN controllers (6 total FlexCAN modules) support redundant CAN paths; FMPLL and crossbar ensure deterministic latency for safety-critical routing decisions. |
| Adaptive Front Lighting System (AFS) | LED Headlamp Driver Controller |
|
Use Scenario: Dynamic beam shaping using stepper motors and MEMS mirrors, coordinated with vehicle speed, steering angle, and ambient light. IC Role / Device Role / Timing Role: Real-time motion controller interfacing with ADC (light/position sensors), eMIOS (PWM for motor drivers), and CAN (vehicle bus feedback). Use Value: CTU-synchronized ADC sampling ensures precise correlation between optical sensor readings and motor position - essential for closed-loop beam calibration. |
Use Scenario: High-fidelity dimming and fault monitoring of multi-segment automotive LED headlamps with thermal derating and short-circuit protection. IC Role / Device Role / Timing Role: PWM generator and current monitor controller with fast ADC response (<1 µs conversion time) and hardware-triggered shutdown. Use Value: 33-channel eMIOS provides independent, phase-shifted PWM outputs per LED segment; 12-bit ADC enables accurate current sensing at 100 kHz sampling rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC5606BAMLQ6 | 1 MB code flash, 80 KB SRAM, 5 FlexCAN, 8 LINFlex, no 12-bit ADC - smaller memory and peripheral set. | Suitable for cost-sensitive entry-level BCMs with fewer LIN nodes and no high-resolution sensor requirements. | Select when application firmware size < 1 MB and 12-bit ADC precision is unnecessary; reduces BOM cost without sacrificing core AUTOSAR compatibility. |
| MPC5607BCVLQ6 | Same silicon, but qualified to AEC-Q100 Grade 1 (–40 °C to 125 °C) vs. SPC5607BAMLQ6's Grade 2 (–40 °C to 105 °C); identical pinout and firmware. | Required for under-hood applications exceeding 105 °C ambient (e.g., engine bay proximity, transmission control). | Choose MPC5607BCVLQ6 for higher-temperature deployments; firmware and layout are drop-in compatible with SPC5607BAMLQ6. |
Compared with SPC5607BAMLQ6, the SPC5606BAMLQ6 offers reduced memory and peripheral count for simpler body nodes, while the MPC5607BCVLQ6 extends thermal range without architectural change - enabling scalable platform design across cabin and powertrain domains.
Availability
SPC5607BAMLQ6 is available at Aetrix Electronics and suitable for automotive body electronics, vehicle gateway systems, and adaptive lighting control requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 qualification.
Supply support for SPC5607BAMLQ6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade reliability.
The SPC5607BAMLQ6 belongs to NXP's SPC56x automotive MCU family, designed specifically for ASIL-B compliant body electronics and gateway applications - emphasizing robust communication stacks, integrated safety mechanisms, and automotive-qualified packaging.
FAQ
What is the maximum operating temperature rating for the SPC5607BAMLQ6?
The SPC5607BAMLQ6 is qualified to AEC-Q100 Grade 2, with a specified operating junction temperature range of –40 °C to 105 °C. This makes it suitable for cabin and front-end module applications where ambient temperatures remain below 105 °C. For under-hood use above that threshold, the MPC5607BCVLQ6 (Grade 1, –40 °C to 125 °C) is the recommended alternative. The SPC5607BAMLQ6 datasheet specifies thermal characteristics including θJA = 28.5 °C/W for the 144 LQFP package.
Does the SPC5607BAMLQ6 support AUTOSAR-compliant software stacks?
Yes, the SPC5607BAMLQ6 is fully supported by AUTOSAR 4.x-compliant MCAL drivers, configuration tools (e.g., EB tresos), and RTOS integrations (e.g., FreeRTOS, ETAS RTA-OS). Its memory protection unit (MPU), Nexus 2+ debug interface, and deterministic eMIOS/PIT timers meet AUTOSAR OS memory partitioning and timing requirements. NXP provides validated SPC5607BAMLQ6 board support packages and safety manuals aligned with ISO 26262 ASIL-B.
How many CAN interfaces does the SPC5607BAMLQ6 integrate, and what protocol versions are supported?
The SPC5607BAMLQ6 integrates six independent FlexCAN modules, each compliant with ISO 11898-1 (Classical CAN) up to 1 Mbps. All modules support mailbox-based message buffering, programmable acceptance filtering, and loopback self-test modes. They do not support CAN FD natively; for CAN FD capability, NXP's S32K144 or S32K3xx families are recommended alternatives. Each FlexCAN module connects to dedicated pins on the SPC5607BAMLQ6's 144 LQFP package.
What debug interface does the SPC5607BAMLQ6 provide, and is JTAG available?
The SPC5607BAMLQ6 features a Nexus 2+ debug interface compliant with IEEE-ISTO 5001-2003 Class Two Plus, supporting real-time trace, complex breakpoints, and non-intrusive profiling. JTAG (IEEE 1149.1) is also implemented for boundary scan testing and basic debug access. Both interfaces share physical pins (TCK, TMS, TDI, TDO, TRST), with Nexus functionality enabled via configuration fuse settings. The SPC5607BAMLQ6 does not support SWD or ARM-specific debug protocols.
Can the SPC5607BAMLQ6 perform simultaneous ADC conversions on both the 10-bit and 12-bit converters?
Yes, the SPC5607BAMLQ6 supports concurrent operation of its two independent ADC subsystems: the 10-bit ADC (15 channels) and the 12-bit ADC (5 dedicated channels). The Cross Trigger Unit (CTU) allows hardware-synchronized start of conversions across both ADCs using triggers from eMIOS timers or PIT channels. This enables time-aligned sampling of multiple sensor types - for example, correlating battery voltage (12-bit) with cabin temperature (10-bit) within a single control cycle.
SPC5607BAMLQ6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit
- Speed:
- 64MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 149
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 34x10b, 24x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5607BAMLQ6 FAQ
1.How can I place an order for SPC5607BAMLQ6 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5607BAMLQ6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5607BAMLQ6 reliable?
The price and inventory of SPC5607BAMLQ6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5607BAMLQ6 is usually 5 days.
3.What payment methods are accepted for SPC5607BAMLQ6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5607BAMLQ6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5607BAMLQ6?
SPC5607BAMLQ6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5607BAMLQ6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5607BAMLQ6?
For technical support, including SPC5607BAMLQ6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5607BAMLQ6 requirements.
6.How does Aetrix verify that SPC5607BAMLQ6 is sourced from the original manufacturer or authorized distributors?
All SPC5607BAMLQ6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5607BAMLQ6 meets industry standards.
7.What is the process for return or replacement of SPC5607BAMLQ6?
All SPC5607BAMLQ6 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5607BAMLQ6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5607BAMLQ6 part is unused and in its original packaging.
Return procedure for SPC5607BAMLQ6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5607BAMLQ6 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
