NXP Semiconductors SPC5607BAVLL6
- Part No.:
- SPC5607BAVLL6
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
SPC5607BAVLL6.pdf
- Description:
- IC MCU 32BIT 1.5MB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,481
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5607BAVLL6 from NXP Semiconductors is a 32-bit automotive microcontroller based on the e200z0h Power Architecture core, operating up to 64 MHz with 1.5 MB on-chip code flash, 64 KB data flash (ECC-protected), and 96 KB SRAM. It integrates six FlexCAN modules, ten LINFlex interfaces, six DSPI controllers, dual ADCs (10-bit and 12-bit), and FMPLL for precise clock generation - deployed in body control modules requiring ASIL-B functional safety compliance.
For engineers reviewing the SPC5607BAVLL6 datasheet, SPC5607BAVLL6 pinout, SPC5607BAVLL6 application, or SPC5607BAVLL6 equivalent, key selection criteria include its 144-pin LQFP package, Nexus 2+ debug interface, cross-trigger unit synchronization between eMIOS timers and ADC conversions, and support for boot programming via CAN/SCI through the Boot Assist Module (BAM).
Technical Context
The SPC5607BAVLL6 implements the e200z0h CPU core with Variable Length Encoding (VLE) for reduced code footprint and operates at up to 64 MHz under 125 °C ambient conditions. Its memory subsystem includes 1.5 MB flash with ECC on data flash, MPU with 8 region descriptors, and a 64-bit 2×3 crossbar switch enabling concurrent access to Flash, SRAM, and peripherals by multiple bus masters.
Peripherals are orchestrated via dedicated modules: CTU synchronizes ADC sampling with eMIOS/PIT events; SIUL manages up to 149 GPIO pins with configurable pull-up/down and wakeup capability; and the FMPLL provides frequency-modulated system clocks with jitter suppression for noise-sensitive automotive timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h Power Architecture core with VLE instruction set, enabling compact firmware binaries and deterministic real-time execution. |
| Max Operating Frequency | 64 MHz - supports real-time control loops in body electronics with sub-16 µs interrupt latency. |
| Code Flash Memory | 1.5 MB - sufficient for AUTOSAR-compliant ECUs with bootloader, application, and diagnostic partitions. |
| Data Flash Memory | 64 KB (4 × 16 KB blocks with ECC) - enables robust parameter storage and over-the-air update logging with error correction. |
| SRAM | 96 KB - accommodates stack, heap, and real-time buffers for multi-threaded RTOS environments. |
| ADC Resolution & Channels | One 10-bit ADC (15 channels) and one 12-bit ADC (5 dedicated channels) - supports sensor fusion in HVAC and lighting control with simultaneous sampling. |
| Communication Interfaces | 6 × FlexCAN (ISO 11898-1 compliant), 10 × LINFlex, 6 × DSPI, 1 × I²C - meets full vehicle network architecture requirements for gateway and node-level communication. |
| Debug Interface | Nexus 2+ per IEEE-ISTO 5001-2003 Class Two Plus - enables trace, real-time variable monitoring, and non-intrusive breakpointing for ISO 26262 development. |
Pinout & Package
SPC5607BAVLL6 is housed in a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch), with dedicated supply domains (VDD_HV/VSS_HV for digital logic, VDD_LV/VSS_LV for 1.2 V core regulation, VDD_HV_ADC0/VSS_HV_ADC0 and VDD_HV_ADC1/VSS_HV_ADC1 for analog sections), and Nexus debug pins (MSEO, MDO0–MDO3, MCKO, EVTO) assigned to specific corner pins for signal integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Active-low reset input with Schmitt trigger and noise filter | Asserted low for ≥40 FIRC cycles after power-up; enables robust cold-start sequencing in noisy automotive environments. |
| XTAL / EXTAL | Differential crystal oscillator input/output pair | Supports external 4–16 MHz crystal for high-accuracy system clock; bypass mode allows direct clock injection. |
| VDD_HV / VSS_HV | Digital supply and ground (multiple pins) | Four VDD_HV and four VSS_HV pins distributed across package edges reduce IR drop and improve EMI resilience. |
| VDD_LV / VSS_LV | 1.2 V core regulator decoupling pair | Three dedicated VDD_LV/VSS_LV pairs require local 100 nF ceramic capacitors - critical for stable e200z0h operation. |
| PA[9] | Factory boot configuration pin (FAB) | Pull-down during reset determines boot source: internal flash (default) vs. external serial interface. |
| MSEO / MDO0–MDO3 / MCKO | Nexus 2+ debug interface signals | Enable real-time trace, instruction-level debugging, and calibration without halting CPU - required for ASIL-B tool qualification. |
Key Features
| Feature | Design Value |
|---|---|
| Boot Assist Module (BAM) | Enables in-system flash programming via CAN or SCI without external programmer - accelerates field firmware updates and reduces production test complexity. |
| Cross Trigger Unit (CTU) | Synchronizes ADC conversions with eMIOS timer events or PIT interrupts - eliminates software polling and ensures deterministic sensor sampling in motor control. |
| Memory Protection Unit (MPU) | 8-region descriptor support with 32-byte granularity - enforces AUTOSAR OS memory partitioning and prevents task interference in multi-core-like safety partitions. |
| eDMA Controller | 16-channel enhanced DMA with multiplexer-based request routing - offloads CPU from SPI/CAN buffer management, reducing ISR overhead by >70% in LIN gateway applications. |
| FMPLL with Frequency Modulation | Reduces electromagnetic emissions by spreading spectrum energy - helps meet CISPR 25 Class 5 radiated emission limits without added shielding. |
| WKPU Wakeup Sources | 27 configurable external wakeup inputs (including GPIO, CAN, LIN, RTC) - enables ultra-low-power standby modes (<50 µA) with selective peripheral wake capability. |
Applications
| Body Control Module (BCM) | Seat & Mirror Control Unit |
|---|---|
|
Use Scenario: Centralized management of door locks, window lifts, interior lighting, and mirror folding in mid-tier vehicles. IC Role / Device Role / Timing Role: Main application controller executing AUTOSAR BSW and application SW, coordinating LIN slaves and driving PWM outputs for motor control. Use Value: 10 × LINFlex interfaces eliminate external LIN transceivers; 96 KB SRAM supports concurrent diagnostics, CAN messaging, and real-time PWM generation without external memory. |
Use Scenario: Integrated seat position memory, heating control, and power-fold mirror actuation with haptic feedback. IC Role / Device Role / Timing Role: Safety-aware motor controller using eMIOS for synchronized PWM and ADC for current sensing, with CTU-triggered sampling aligned to commutation events. Use Value: Dual ADCs enable simultaneous measurement of motor phase current (12-bit) and temperature (10-bit); FMPLL minimizes EMI near sensitive audio components. |
| Roof Module (Sunroof & Panoramic Roof) | Lighting Control Unit (LCU) |
|
Use Scenario: Precise sunroof glass/motor control with anti-pinch detection, rain sensor integration, and tilt-to-vent positioning. IC Role / Device Role / Timing Role: Real-time motion controller using eMIOS input capture for encoder feedback and output compare for H-bridge gate timing. Use Value: 64-channel eMIOS supports 4x motor control channels with dead-time insertion; WKPU enables wake-on-rain-sensor event without full MCU activation. |
Use Scenario: Adaptive front-lighting (AFS), dynamic rear lighting, and interior ambient light dimming with color temperature control. IC Role / Device Role / Timing Role: PWM generator and sensor hub aggregating ambient light, temperature, and CAN commands for closed-loop brightness control. Use Value: 149 GPIOs allow direct LED string drive and photodiode interfacing; 1.5 MB flash stores multiple lighting profiles and calibration data. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC5606BK0MLL6 | Same e200z0h core, but 1 MB code flash, 80 KB SRAM, and only 5 FlexCAN modules; no 12-bit ADC. | Suitable for cost-optimized BCMs with reduced feature count and no high-resolution sensor requirements. | Select when design does not require 12-bit ADC, >1 MB flash, or sixth CAN channel - lowers BOM cost without sacrificing core AUTOSAR compatibility. |
| SPC564A70L5 | Higher-performance e200z4d core, 240 MHz, 2 MB flash, 256 KB SRAM, and integrated Ethernet MAC; requires different power domain sequencing. | Targeted at domain controllers needing Ethernet backbone connectivity and higher compute throughput for ADAS-adjacent functions. | Choose for next-gen architectures requiring time-sensitive networking (TSN) or consolidated gateway functionality - not a drop-in replacement due to pinout and voltage rail differences. |
Compared with SPC5607BAVLL6, the SPC5606BK0MLL6 offers lower memory and peripheral count for entry-level body nodes, while the SPC564A70L5 delivers scalable performance for centralized domain controllers - neither shares identical pinout or power architecture, making SPC5607BAVLL6 optimal for mid-tier automotive ECU designs balancing cost, safety, and integration density.
Availability
SPC5607BAVLL6 is available at Aetrix Electronics and suitable for body control modules, seat/mirror control units, roof modules, and lighting control units requiring stable component supply, long-term automotive lifecycle support, and ASIL-B ready silicon.
Supply support for SPC5607BAVLL6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade reliability.
The SPC5607BAVLL6 belongs to NXP's SPC560B series - a family of Power Architecture-based microcontrollers engineered specifically for automotive body electronics, emphasizing ASIL-B compliance, low-power standby, and high peripheral integration for cost-sensitive ECU platforms.
FAQ
What is the maximum operating temperature range for the SPC5607BAVLL6?
The SPC5607BAVLL6 is qualified for operation from −40 °C to 125 °C ambient temperature, meeting AEC-Q100 Grade 1 requirements. This rating is validated per the recommended operating conditions in the MPC5607B datasheet Rev. 10, Section 4.4, and applies to all functional blocks including flash, SRAM, and analog peripherals - essential for under-hood and dashboard-mounted automotive applications where thermal stress is critical. The SPC5607BAVLL6 maintains full specification compliance across this range without derating.
Does the SPC5607BAVLL6 support AUTOSAR-compliant software stacks?
Yes, the SPC5607BAVLL6 is fully supported by AUTOSAR 4.x-compliant MCAL drivers from NXP and third-party vendors, including CAN, LIN, SPI, ADC, and GPT modules. Its e200z0h core, 96 KB SRAM, and MPU with 32-byte granularity enable strict memory partitioning required by AUTOSAR OS. The SPC5607BAVLL6 also provides STM and PIT timers compatible with AUTOSAR timing services - confirmed in NXP's SPC560B MCAL release notes v4.3 and above.
How many CAN FD channels does the SPC5607BAVLL6 support?
The SPC5607BAVLL6 supports six FlexCAN modules compliant with ISO 11898-1 (Classical CAN), but does not support CAN FD. Each FlexCAN module features configurable message buffers, loopback self-test, and bus-off recovery - sufficient for legacy vehicle networks. For CAN FD capability, engineers must consider newer families such as S32K1 or S32K3. The SPC5607BAVLL6 datasheet explicitly lists "enhanced full CAN" without FD extensions in Table 1 and Section 1.1.
Is the SPC5607BAVLL6 pin-compatible with other members of the MPC5607B family?
No - the SPC5607BAVLL6 uses a 144-pin LQFP package, while other MPC5607B variants include 100-pin LQFP, 176-pin LQFP, and 208-ball MAPBGA packages. Pin assignments differ significantly across packages; for example, Nexus debug pins (MDO0–MDO3) appear on pins 139–142 in the 144-LQFP but are relocated in the 208-MAPBGA. The SPC5607BAVLL6 datasheet Figure 3 confirms its unique 144-LQFP pinout, and no pin-to-pin compatibility is claimed between package variants.
What oscillator options are available for the SPC5607BAVLL6?
The SPC5607BAVLL6 supports four clock sources: internal 128 kHz RC oscillator (for low-power RTC), internal 16 MHz RC oscillator (for fast startup), external 4–16 MHz crystal (via XTAL/EXTAL pins), and optional external 32 kHz crystal (for high-accuracy RTC). The FMPLL can lock to any of these sources to generate system clocks up to 64 MHz. All options are documented in Sections 4.11–4.15 of the MPC5607B datasheet Rev. 10, and the SPC5607BAVLL6 implements the full set without restriction.
SPC5607BAVLL6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LQFP
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit
- Speed:
- 64MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 149
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 16
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 50x10/12b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5607BAVLL6 FAQ
1.How can I place an order for SPC5607BAVLL6 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5607BAVLL6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5607BAVLL6 reliable?
The price and inventory of SPC5607BAVLL6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5607BAVLL6 is usually 5 days.
3.What payment methods are accepted for SPC5607BAVLL6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5607BAVLL6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5607BAVLL6?
SPC5607BAVLL6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5607BAVLL6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5607BAVLL6?
For technical support, including SPC5607BAVLL6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5607BAVLL6 requirements.
6.How does Aetrix verify that SPC5607BAVLL6 is sourced from the original manufacturer or authorized distributors?
All SPC5607BAVLL6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5607BAVLL6 meets industry standards.
7.What is the process for return or replacement of SPC5607BAVLL6?
All SPC5607BAVLL6 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5607BAVLL6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5607BAVLL6 part is unused and in its original packaging.
Return procedure for SPC5607BAVLL6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5607BAVLL6 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

