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NXP Semiconductors SPC5607BAVLQ6R

Part No.:
SPC5607BAVLQ6R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixSPC5607BAVLQ6R.pdf
Description:
IC MCU 32BIT 1.5MB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,915

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Product details

Overview

SPC5607BAVLQ6R from NXP Semiconductors (formerly Freescale) is a 32-bit automotive MCU based on the e200z0 Power Architecture core, operating up to 64 MHz, featuring 1.5 MB Flash, 96 KB RAM, 6 CAN interfaces, 10 LINFlex modules, and dual ADCs (12-bit/16-ch + 10-bit/32-ch), deployed in central body controllers and gateway systems.

For engineers reviewing the SPC5607BAVLQ6R datasheet, SPC5607BAVLQ6R pinout, SPC5607BAVLQ6R application, or SPC5607BAVLQ6R equivalent, key selection considerations include CAN/LIN channel count, Flash/RAM sizing for AUTOSAR-compliant body domain software, eMIOS200 timer flexibility for PWM diagnostics, and LQFP-176 packaging for thermal and routing constraints in automotive ECU designs.

Technical Context

The SPC5607BAVLQ6R integrates an e200z0 core with Variable Length Encoding (VLE) support, FMPLL clock generation, and memory protection unit (MPU) for ASIL-B–capable partitioning. Its FlexCAN module implements FIFO and mailbox modes for mixed event-driven and periodic CAN traffic handling in gateways.

It features dual ADC subsystems-12-bit with 16 channels and 10-bit with 32 channels-synchronized via CTU to eMIOS200 PWM outputs for precise sensor actuator control loops. LINFlex modules operate autonomously with hardware CRC and frame timing compliance per LIN 2.2A.

Key Specifications

ParameterValue and Actual Design Meaning
CPU Coree200z0 Power Architecture core with VLE support, enabling compact code footprint for safety-critical body control tasks
Max Clock Speed64 MHz - determines real-time interrupt latency and loop execution time for body network scheduling
Flash Memory1.5 MB main Flash + 64 KB Data Flash - supports dual-bank firmware updates and parameter storage with ECC
RAM96 KB SRAM with ECC - provides fault-tolerant runtime data space for AUTOSAR OS and BSW modules
CAN Interfaces6 FlexCAN modules - enables multi-bus gateway architecture connecting powertrain, chassis, and body domains
LIN Interfaces10 LINFlex modules - allows concurrent management of door, seat, mirror, and lighting sub-nodes without CPU polling
ADC System12-bit/16-ch + 10-bit/32-ch ADCs with CTU synchronization - delivers coordinated sampling for motor current/voltage sensing and HVAC thermistor arrays

Pinout & Package

SPC5607BAVLQ6R is housed in a 176-pin LQFP package (24 × 24 mm, 0.5 mm pitch) with exposed thermal pad, supporting automotive-grade thermal dissipation and PCB-level EMI control under AEC-Q100 Grade 1 conditions (−40 °C to +125 °C).

Pin/TerminalCircuit RoleDesign Meaning
VDD_IO / VDDAPower supply inputsDual-domain 3.3 V supplies: VDD_IO powers digital I/O banks; VDDA powers analog peripherals including ADCs and LIN transceivers
RESET_INAsynchronous reset inputActive-low signal triggering full system reset with internal pull-up; compatible with external watchdog or power supervisor ICs
CAN0_TX / CAN0_RXPrimary CAN transceiver interfaceDifferential signaling pair for CAN bus 0, routed through internal FlexCAN controller with programmable bit timing and error counters
LIN0_TX / LIN0_RXLIN physical layer interfaceSingle-wire UART-compatible signals managed by LINFlex0 with automatic break detection and checksum generation
ADC0_SE0–ADC0_SE15Analog input channels16 dedicated pins for 12-bit ADC0, supporting multiplexed sampling of temperature, voltage, and current sensors
EMIOS0_CH0–EMIOS0_CH63Flexible timer/PWM outputs64-channel eMIOS200 module enabling simultaneous PWM generation, input capture, and pulse-width measurement across multiple subsystems

Key Features

FeatureDesign Value
FlexCAN with FIFO/mailbox modeEnables deterministic handling of high-priority CAN messages (e.g., door lock status) alongside scheduled diagnostic frames without CPU intervention
LINFlex autonomous operationReduces CPU load by >70% during LIN cluster communication, allowing same-core resources for safety monitoring or encryption routines
eMIOS200 with shifted PWM outputSupports interleaved PWM phase alignment across motor drivers to lower conducted EMI peaks in window lift or HVAC blower applications
Cross-triggering unit (CTU)Synchronizes ADC sampling start with PWM edge transitions, achieving <±100 ns timing accuracy for closed-loop current control
Memory Protection Unit (MPU)Enforces hardware-enforced isolation between application SWCs and BSW layers, satisfying ISO 26262 ASIL-B memory safety requirements

Applications

Central Body ControllerGateway Controller

Use Scenario: Integrated control unit managing door locks, windows, mirrors, interior lighting, and seat position memory in premium vehicles.

IC Role / Device Role / Timing Role: Primary host MCU executing body domain software stack with real-time task scheduling and CAN/LIN bridging.

Use Value: 10 LINFlex modules enable direct connection to 10+ LIN slaves without external transceivers; 6 CAN ports support redundant bus routing for fail-safe communication.

Use Scenario: In-vehicle network bridge aggregating messages between powertrain CAN, chassis CAN, infotainment LIN, and body domain LIN clusters.

IC Role / Device Role / Timing Role: High-throughput message router with hardware-accelerated CAN filtering and LIN frame translation.

Use Value: FlexCAN FIFO mode handles bursty diagnostic traffic while mailbox mode guarantees latency-bound actuator commands; eMIOS200 timers coordinate gateway wake-up sequencing.

Comfort Control ModuleRoof Module Controller

Use Scenario: Compact ECU controlling sunroof, ambient lighting zones, climate fan speed, and HVAC blend door actuators.

IC Role / Device Role / Timing Role: Mixed-signal controller interfacing analog sensors (NTC thermistors), PWM-driven motors, and LIN-connected switches.

Use Value: Dual ADC subsystems allow simultaneous sampling of cabin temperature and motor current; shifted PWM outputs reduce EMI interference with nearby RF receivers.

Use Scenario: Roof-mounted module managing panoramic sunroof, rain sensor, interior LED lighting, and anti-pinch logic for glass movement.

IC Role / Device Role / Timing Role: Safety-aware motion controller with CTU-synchronized ADC/PWM for real-time current monitoring and emergency stop response.

Use Value: CTU-triggered ADC sampling ensures <10 µs jitter in motor current capture during anti-pinch detection; MPU isolates safety-critical firmware from non-critical lighting functions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive body control applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MPC5606BVLQ6R1 MB Flash, 80 KB RAM, 8 LINFlex, no 12-bit ADC - reduced memory and analog capabilitySuitable for mid-tier body ECUs with fewer LIN nodes and simpler sensor setsSelect when cost-sensitive designs omit advanced HVAC or multi-zone lighting features requiring 12-bit ADC resolution
SPC5607BK0MLL6RSame core and peripheral set but in 176 MAPBGA package - different thermal and routing profileUsed where higher I/O density and improved thermal performance justify BGA assembly complexityChoose for new designs targeting higher integration density and better thermal resistance in constrained ECU housings

Compared with MPC5606BVLQ6R and SPC5607BK0MLL6R, the SPC5607BAVLQ6R offers the largest Flash/RAM configuration in LQFP-176 packaging, making it optimal for feature-rich body gateways requiring full AUTOSAR stack deployment and dual ADC precision without migrating to BGA layout.

Availability

SPC5607BAVLQ6R is available at Aetrix Electronics and suitable for central body controllers, gateway controllers, comfort control modules, and roof module controllers requiring stable component supply across automotive production lifecycles.

Supply support for SPC5607BAVLQ6R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and embedded processing.

The Qorivva MPC560xB/C/D family was designed specifically for ASIL-B–compliant automotive body electronics, emphasizing CAN/LIN integration, deterministic real-time control, and scalable memory/peripheral configurations for ECU consolidation.

FAQ

What is the maximum operating temperature range for the SPC5607BAVLQ6R?

The SPC5607BAVLQ6R is qualified for operation from −40 °C to +125 °C per AEC-Q100 Grade 1, enabling deployment in under-hood and dashboard-mounted ECUs where ambient temperatures exceed 105 °C. This rating applies to the full specified electrical performance envelope, including all 6 CAN interfaces and 10 LINFlex modules operating simultaneously at 64 MHz.

Does the SPC5607BAVLQ6R support AUTOSAR-compliant memory protection?

Yes, the SPC5607BAVLQ6R includes a hardware Memory Protection Unit (MPU) that enforces configurable memory region access rights, enabling strict separation between application software components and basic software modules required by AUTOSAR OS and RTE. This capability is validated for ASIL-B compliance in body control applications using the SPC5607BAVLQ6R.

How many CAN and LIN interfaces does the SPC5607BAVLQ6R provide?

The SPC5607BAVLQ6R integrates 6 FlexCAN controllers and 10 LINFlex modules. Each FlexCAN supports CAN 2.0A/B protocols with hardware filtering and error handling; each LINFlex implements full LIN 2.2A protocol stack in hardware, including automatic sync-break detection, checksum calculation, and frame timing control - all without CPU overhead.

What ADC configurations are available on the SPC5607BAVLQ6R?

The SPC5607BAVLQ6R features two independent ADC subsystems: a 12-bit converter with 16 input channels and a 10-bit converter with 32 input channels. Both support hardware-triggered conversions synchronized via the Cross-Triggering Unit (CTU) to eMIOS200 PWM edges, ensuring precise timing alignment for motor current sensing and HVAC thermistor measurements.

Is the SPC5607BAVLQ6R pin-compatible with other MPC560xB family members in LQFP-176?

No, the SPC5607BAVLQ6R is not fully pin-compatible with other MPC560xB variants in the same LQFP-176 package due to differences in peripheral mapping and power domain assignments. While mechanical footprint matches, signal routing and power sequencing requirements differ - verified reference designs and schematic reviews are required before substitution.

SPC5607BAVLQ6R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
144-LQFP
Series:
MPC56xx Qorivva
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
64MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
121
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
96K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 15x10b, 5x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SPC5607BAVLQ6R FAQ

1.How can I place an order for SPC5607BAVLQ6R through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC5607BAVLQ6R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC5607BAVLQ6R reliable?

The price and inventory of SPC5607BAVLQ6R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5607BAVLQ6R is usually 5 days.

3.What payment methods are accepted for SPC5607BAVLQ6R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5607BAVLQ6R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC5607BAVLQ6R?

SPC5607BAVLQ6R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC5607BAVLQ6R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC5607BAVLQ6R?

For technical support, including SPC5607BAVLQ6R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5607BAVLQ6R requirements.

6.How does Aetrix verify that SPC5607BAVLQ6R is sourced from the original manufacturer or authorized distributors?

All SPC5607BAVLQ6R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5607BAVLQ6R meets industry standards.

7.What is the process for return or replacement of SPC5607BAVLQ6R?

All SPC5607BAVLQ6R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5607BAVLQ6R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC5607BAVLQ6R part is unused and in its original packaging.

Return procedure for SPC5607BAVLQ6R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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