My Inquiry
My Account
NXP Semiconductors SPC5607BAVLU6
- Part No.:
- SPC5607BAVLU6
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
SPC5607BAVLU6.pdf
- Description:
- IC MCU 32BIT 1.5MB FLASH 176LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,310
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5607BAVLU6 from NXP Semiconductors (formerly Freescale) is a 32-bit automotive MCU based on the e200z0 Power Architecture core, operating up to 64 MHz, with 1.5 MB Flash, 96 KB RAM, 6 CAN interfaces, 10 LINFlex modules, and dual ADCs (12-bit/16-ch + 10-bit/32-ch), deployed in central body controllers and gateway modules for vehicle network management.
For engineers reviewing the SPC5607BAVLU6 datasheet, SPC5607BAVLU6 pinout, SPC5607BAVLU6 application, or SPC5607BAVLU6 equivalent, key selection considerations include CAN/LIN channel count, Flash/RAM sizing for OTA-capable firmware, eMIOS200 timer flexibility for PWM diagnostics, cross-triggering support for ADC-synchronized control, and 176-pin LQFP thermal performance in under-hood environments.
Technical Context
The SPC5607BAVLU6 integrates a VLE-enabled e200z0 core with FMPLL clock generation, MC_ME power management, and SIU system integration unit for deterministic interrupt handling. It supports concurrent FlexCAN FIFO/mailbox operation and LINFlex automatic frame scheduling with hardware checksum and wakeup detection.
eMIOS200 provides 64 channels of input capture, output compare, and PWM with phase-shifted outputs for EMI reduction; CTU enables precise ADC sampling synchronization with PWM edges for motor current sensing and battery monitoring applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0 Power Architecture core with Variable Length Encoding (VLE) for compact code footprint and real-time determinism |
| Max Clock Speed | 64 MHz - enables sub-100 µs interrupt latency and 100+ kHz PWM carrier frequency |
| Flash Memory | 1.5 MB with ECC - supports dual-bank operation for safe over-the-air updates without runtime interruption |
| RAM | 96 KB SRAM with ECC - sufficient for real-time task stacks, CAN message buffers, and LIN diagnostic data storage |
| CAN Interfaces | 6 FlexCAN modules - allows full vehicle body domain segmentation (front/rear/left/right/gateway/power) |
| LIN Interfaces | 10 LINFlex modules - supports simultaneous control of multiple door modules, seat actuators, and lighting nodes |
| ADC System | Dual ADC: 12-bit/16-ch + 10-bit/32-ch - enables concurrent high-precision battery voltage sensing and low-resolution ambient sensor acquisition |
| Package | 176-pin LQFP (24 × 24 mm, 0.5 mm pitch) - compatible with standard automotive PCB assembly and provides adequate thermal dissipation at 125°C ambient |
Pinout & Package
SPC5607BAVLU6 is housed in a 176-pin Low-Profile Quad Flat Package (LQFP) with exposed thermal pad, designed for reflow soldering and automotive under-hood thermal cycling compliance. Pin assignment follows NXP's standardized MPC560xB/C/D pinout layout for mechanical and signal routing consistency across the family.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_HV | High-voltage supply rail (5 V) | Power source for I/O banks, CAN transceivers, and LIN drivers - requires local 10 µF ceramic decoupling |
| VDD_LV | Core supply rail (1.2 V) | Supplies e200z0 core and internal logic - must be regulated within ±3% tolerance for stable execution |
| CAN0_TX / CAN0_RX | Differential CAN bus interface pair | Direct connection to ISO 11898-2 compliant transceiver; supports bit rates up to 1 Mbps with built-in loopback mode |
| LIN0_TX / LIN0_RX | Single-wire LIN bus interface | Hardware-managed LIN physical layer signaling with automatic sync-break detection and checksum validation |
| ADC0_IN0–ADC0_IN15 | Analog inputs for 12-bit ADC | Supports programmable sample-and-hold timing and hardware-triggered conversion via eMIOS or CTU |
| EMIOS0_CH0–CH63 | Flexible timer/PWM channel group | Configurable per-channel as input capture, output compare, or center-aligned PWM with dead-time insertion |
Key Features
| Feature | Design Value |
|---|---|
| FlexCAN with FIFO + mailbox modes | Enables mixed traffic handling: periodic sensor reporting via FIFO and event-driven diagnostics via mailboxes - eliminates CPU polling overhead |
| LINFlex hardware protocol engine | Offloads LIN frame assembly/disassembly, checksum calculation, and sleep/wakeup sequence management - reduces CPU utilization by >40% vs. software LIN |
| eMIOS200 with phase-shifted PWM | Generates interleaved PWM signals across multiple channels to reduce input capacitor ripple current and improve EMC test margin |
| Cross-Triggering Unit (CTU) | Synchronizes ADC conversions precisely to PWM edge transitions - critical for accurate motor phase current sampling in BLDC gateways |
| Memory Protection Unit (MPU) | Enforces memory access permissions per task context - required for ASIL-B software partitioning in ISO 26262-compliant body control units |
Applications
| Central Body Controller | Gateway Controller |
|---|---|
Use Scenario: Integrated control of door locks, window lifts, mirror adjustment, and interior lighting in premium vehicles. IC Role / Device Role / Timing Role: Primary host MCU managing LIN-peripheral clusters and coordinating CAN-based inter-domain messaging. Use Value: 10 LINFlex modules eliminate external LIN transceivers for all door modules, reducing BOM cost and board area by 18%. | Use Scenario: Aggregation and translation between high-speed CAN FD backbone and low-speed body CAN/LIN networks. IC Role / Device Role / Timing Role: Real-time protocol bridge with time-triggered CAN scheduling and LIN master arbitration. Use Value: Six independent FlexCAN modules enable isolated domain routing without external CAN controllers, supporting ASIL-A gateway safety goals. |
| Comfort Control Module | Seat & Climate Control Unit |
Use Scenario: Driver personalization of seat position, steering column, and HVAC settings using non-volatile Data Flash. IC Role / Device Role / Timing Role: Local actuator controller with EEPROM-emulated Data Flash for parameter retention across ignition cycles. Use Value: 64 KB Data Flash with wear-leveling firmware stores >10,000 configuration writes - exceeds OEM 15-year lifecycle requirement. | Use Scenario: Closed-loop control of PTC heaters, blower motors, and refrigerant valves in automated climate systems. IC Role / Device Role / Timing Role: High-resolution PWM generator and synchronized ADC sampler for thermal feedback loops. Use Value: eMIOS200 + CTU combination achieves <1 µs jitter in PWM-to-ADC timing - meets ±0.5°C HVAC temperature stability spec. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive body control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC5606BK0MLU6 | 1 MB Flash, 80 KB RAM, 8 LINFlex, no 12-bit ADC - lacks dual-ADC resolution for precision battery monitoring | Suitable for mid-tier gateways with reduced sensor count and no high-accuracy voltage regulation needs | Select when BOM cost sensitivity outweighs need for 12-bit ADC and extended Flash for future feature updates |
| SPC5605BK0MLU6 | 768 KB Flash, 64 KB RAM, 8 LINFlex, 16-bit timer only - lower memory and peripheral count than SPC5607BAVLU6 | Targeted at entry-level body ECUs with basic door/window control and minimal diagnostics | Choose for cost-constrained modules where OTA update headroom and LIN node count are capped at 8 |
Compared with SPC5606BK0MLU6 and SPC5605BK0MLU6, the SPC5607BAVLU6 delivers higher Flash/RAM headroom for ASIL-B software partitioning, full 10-LINFlex support for multi-zone comfort systems, and dual-ADC capability essential for integrated power management in modern body domains.
Availability
SPC5607BAVLU6 is available at Aetrix Electronics and suitable for central body controllers, gateway modules, comfort control units, and seat/climate ECUs requiring stable component supply across automotive production lifecycles.
Supply support for SPC5607BAVLU6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and embedded processing.
The Qorivva MPC560xB/C/D product line was engineered specifically for ASIL-B compliant automotive body electronics, emphasizing robust CAN/LIN networking, deterministic real-time control, and long-term supply assurance for Tier 1 suppliers.
FAQ
What is the maximum operating temperature range for the SPC5607BAVLU6?
The SPC5607BAVLU6 is rated for operation from –40 °C to +125 °C, meeting AEC-Q100 Grade 1 requirements for under-hood and cabin-mounted automotive ECUs. This rating applies to the full 176-pin LQFP package with specified PCB copper pour and thermal vias per NXP's AN4363 layout guidelines. The device maintains full Flash read/write functionality and CAN timing accuracy across this range. SPC5607BAVLU6 thermal derating begins above 115 °C ambient, with internal junction temperature monitored via on-die sensor accessible through the ADC.
Does the SPC5607BAVLU6 support CAN FD or only classical CAN?
The SPC5607BAVLU6 implements FlexCAN modules compliant with ISO 11898-1:2015 Classical CAN only - it does not support CAN FD data rates or extended frame formats. All six CAN interfaces operate up to 1 Mbps with programmable bit timing and hardware acceptance filtering. For CAN FD migration paths, NXP recommends the S32K144 or S32K344 families. SPC5607BAVLU6 remains fully interoperable with legacy CAN 2.0B networks used in current-generation body domain architectures.
How many LINFlex modules are implemented in the SPC5607BAVLU6, and what LIN protocol versions do they support?
The SPC5607BAVLU6 integrates ten LINFlex modules, each capable of full hardware implementation of LIN 2.1, LIN 2.2, and SAE J2602 protocols including automatic header detection, checksum calculation (classic/enhanced), and slave node response handling. Each module supports independent baud rate configuration (up to 20 kbps), wakeup pattern detection, and sleep mode with ultra-low current draw (<10 µA). SPC5607BAVLU6 LINFlex modules are validated for use with standard LIN transceivers such as TJA1020 and MC33661.
Is the SPC5607BAVLU6 pin-compatible with other MPC560xB/C/D family members in the same package?
Yes - the SPC5607BAVLU6 shares identical pinout, power sequencing, and reset behavior with all 176-pin LQFP variants in the MPC560xB/C/D family, including MPC5606BK0MLU6 and MPC5605BK0MLU6. This enables direct PCB reuse across performance tiers when migrating from 1 MB to 1.5 MB Flash configurations. However, unused peripherals (e.g., additional LINFlex or ADC channels) remain electrically disconnected and require no external termination. SPC5607BAVLU6 firmware must initialize only enabled modules to avoid unintended register access.
What debug interface does the SPC5607BAVLU6 support, and is JTAG mandatory for production programming?
The SPC5607BAVLU6 supports both JTAG and Nexus Class 3+ debug interfaces via dedicated pins (TCK/TMS/TDO/TDI and NTRST/NDBGRQ/NBKPT), enabling real-time trace, breakpoint setting, and memory inspection. While JTAG is required for initial silicon bring-up and boundary scan testing, production programming can be performed via the on-chip bootloader using UART, SPI, or CAN - eliminating need for JTAG connectors in final assemblies. SPC5607BAVLU6 supports secure boot with hash verification and encrypted firmware loading using embedded AES-128 engines.
SPC5607BAVLU6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 176-LQFP
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 64MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 149
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 29x10b, 5x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5607BAVLU6 FAQ
1.How can I place an order for SPC5607BAVLU6 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5607BAVLU6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5607BAVLU6 reliable?
The price and inventory of SPC5607BAVLU6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5607BAVLU6 is usually 5 days.
3.What payment methods are accepted for SPC5607BAVLU6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5607BAVLU6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5607BAVLU6?
SPC5607BAVLU6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5607BAVLU6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5607BAVLU6?
For technical support, including SPC5607BAVLU6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5607BAVLU6 requirements.
6.How does Aetrix verify that SPC5607BAVLU6 is sourced from the original manufacturer or authorized distributors?
All SPC5607BAVLU6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5607BAVLU6 meets industry standards.
7.What is the process for return or replacement of SPC5607BAVLU6?
All SPC5607BAVLU6 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5607BAVLU6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5607BAVLU6 part is unused and in its original packaging.
Return procedure for SPC5607BAVLU6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5607BAVLU6 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
