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NXP Semiconductors SPC5607BF1MLU6
- Part No.:
- SPC5607BF1MLU6
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
SPC5607BF1MLU6.pdf
- Description:
- IC MCU 32BIT 1.5MB FLASH 176LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,917
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Product details
Overview
SPC5607BF1MLU6 from NXP Semiconductors is an automotive-grade 32-bit Power Architecture® microcontroller featuring the e200z0h CPU core, 1.5 MB on-chip code flash, 96 KB SRAM, dual ADCs (10-bit and 12-bit), six FlexCAN modules, and 10 LINFlex interfaces. It operates up to 64 MHz and supports FMPLL clock generation, crossbar switch architecture, and Nexus 2+ debug interface - deployed in body control modules requiring functional safety and real-time I/O management.
For engineers reviewing the SPC5607BF1MLU6 datasheet, SPC5607BF1MLU6 pinout, SPC5607BF1MLU6 application, or SPC5607BF1MLU6 equivalent, this page delivers verified technical context, package-specific pin roles, automotive-qualified peripheral capabilities, and validated alternative options for ECU design continuity and supply chain resilience.
Technical Context
The SPC5607BF1MLU6 implements a single-issue e200z0h core compliant with Power Architecture® embedded category and optimized for VLE (Variable-Length Encoding) to reduce code footprint. Its FMPLL supports programmable frequency modulation for EMI reduction, while the 64-bit 2×3 crossbar switch enables concurrent access to Flash, SRAM, and peripherals by multiple bus masters including eDMA and CPU.
It integrates a memory protection unit (MPU) with 8 region descriptors, a 204-source interrupt controller (INTC), and dual ADC subsystems synchronized via Cross Trigger Unit (CTU). The device includes 149 configurable GPIOs (package-dependent), RTC with 1 ms wakeup resolution from internal 128 kHz oscillator, and support for external 32 kHz crystal for 1-second wakeup timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h - single-issue 32-bit Power Architecture® core with VLE support for reduced code size and deterministic execution. |
| Max Clock Frequency | 64 MHz - defines real-time processing bandwidth for time-critical automotive tasks like PWM generation and CAN message handling. |
| Code Flash Memory | 1.5 MB - provides ample non-volatile storage for AUTOSAR-compliant firmware, bootloader, and calibration data. |
| SRAM | 96 KB - supports multi-tasking OS stacks, CAN/LIN buffers, and real-time signal processing without external RAM. |
| ADC Channels | 15 ch 10-bit + 19 ch 12-bit (shared) - enables simultaneous sensor monitoring (e.g., temperature, voltage, position) with configurable resolution and CTU-triggered sampling. |
| FlexCAN Modules | 6 × - supports redundant or domain-separated CAN networks (e.g., powertrain, chassis, body) with configurable message buffers. |
| LINFlex Interfaces | 10 × - allows direct connection to LIN slave nodes (e.g., door modules, seat controls) without external transceivers in many configurations. |
| Package | LQFP-144 (20 mm × 20 mm) - RoHS-compliant surface-mount package with 0.5 mm pitch, suitable for automated PCB assembly and thermal management in automotive ECUs. |
Pinout & Package
LQFP-144 (20 mm × 20 mm) package with 0.5 mm pitch, 144 leads, and exposed thermal pad per NXP mechanical drawing SOT497-1. Pinout conforms to MPC5607B Rev. 10 datasheet Figure 3 (144 LQFP configuration).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Active-low reset input with Schmitt trigger and noise filter | Asserted low for ≥40 FIRC cycles after power-up; enables robust system initialization under noisy automotive environments. |
| VDD_HV / VSS_HV | Digital supply and ground (3.3 V nominal) | Four dedicated VDD_HV/VSS_HV pairs ensure stable core/peripheral operation and minimize ground bounce in high-speed I/O switching. |
| VDD_LV / VSS_LV | 1.2 V regulator decoupling pins | Three VDD_LV/VSS_LV pairs require local 100 nF ceramic capacitors to stabilize internal voltage regulator output for CPU and memory subsystems. |
| XTAL / EXTAL | Crystal oscillator input/output terminals | Supports 4–16 MHz external crystal; enables precise clock source for FMPLL with ±50 ppm stability over automotive temperature range. |
| PA[0]–PA[15], PB[0]–PB[15], etc. | Configurable general-purpose I/O ports | 149 total GPIOs with SIUL control; each pin supports multiple alternate functions (e.g., CAN, LIN, DSPI, eMIOS) via IMUX routing. |
| MDO0–MDO3, MCKO, EVTO, MSEO | Nexus 2+ debug interface outputs | Enable real-time trace, breakpoint, and register visibility during development and production diagnostics per IEEE-ISTO 5001-2003 Class Two Plus. |
Key Features
| Feature | Design Value |
|---|---|
| Boot Assist Module (BAM) | Enables in-system flash programming via CAN or SCI without external debugger - critical for field firmware updates in vehicle networks. |
| Cross Trigger Unit (CTU) | Synchronizes ADC conversions with eMIOS timer events - eliminates software latency in sensor sampling for closed-loop motor control. |
| Enhanced Modular I/O System (eMIOS) | 64-channel 16-bit timer subsystem supporting input capture, output compare, PWM, and dead-time generation - replaces discrete timing ICs in lighting and actuator drivers. |
| Memory Protection Unit (MPU) | 8-region hardware-enforced memory access control - isolates AUTOSAR OS tasks and prevents stack overflow or pointer corruption in ASIL-B designs. |
| FMPLL with frequency modulation | Reduces electromagnetic interference (EMI) peak emissions by spreading clock spectrum - simplifies compliance with CISPR 25 Class 5 radiated emissions limits. |
| Wakeup Unit (WKPU) | 27 configurable wakeup sources including GPIO, RTC, and CAN bus activity - enables ultra-low-power standby mode (<50 µA) with sub-second response to vehicle events. |
Applications
| Body Control Module (BCM) | Seat Control Unit (SCU) |
|---|---|
|
Use Scenario: Centralized management of door locks, windows, mirrors, interior lighting, and climate fan speed in modern vehicles. IC Role / Device Role / Timing Role: Main system controller executing AUTOSAR BSW and application software; handles LIN communication to slave nodes and CAN gateway functions. Use Value: 10 LINFlex interfaces eliminate need for external LIN transceivers; 6 FlexCAN modules enable seamless integration with powertrain and infotainment networks. |
Use Scenario: Real-time control of electric seat motors, heating elements, and position sensors with occupant detection and memory recall. IC Role / Device Role / Timing Role: Safety-aware motion controller using eMIOS PWM channels for H-bridge drive and CTU-synchronized ADC sampling of current/voltage feedback. Use Value: Dual ADC subsystem (10-bit + 12-bit) allows simultaneous high-speed current sensing and precision temperature monitoring within same time window. |
| Roof Module Controller | Smart Junction Box (SJB) |
|
Use Scenario: Integration of sunroof, panoramic roof, ambient lighting, and rain/light sensors in premium vehicle roof systems. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating analog (light/temp), digital (I²C), and serial (LIN) inputs; executes real-time shading and dimming logic. Use Value: 149 GPIOs support mixed-signal I/O expansion; RTC with 1 ms wakeup resolution enables precise scheduling of periodic sensor polling during sleep. |
Use Scenario: Distributed power distribution and load monitoring across vehicle domains (e.g., lighting, HVAC, wipers) with diagnostic reporting. IC Role / Device Role / Timing Role: High-integrity power manager using MPU-protected SRAM for fault logging and watchdog-timed safe state transitions. Use Value: On-chip voltage regulator (VREG) and integrated LDOs reduce external component count; FMPLL modulation lowers conducted EMI on power rails. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC5606BK0MLU6 | 1 MB code flash, 80 KB SRAM, 5 DSPI, 8 LINFlex, no 12-bit ADC dedicated channels | Suitable for cost-optimized BCMs with lower firmware complexity and fewer analog sensing requirements | Select when full 1.5 MB flash and dual ADC resolution are not required; offers identical LQFP-144 pinout and software compatibility. |
| MPC5607BF1MLU6 | Same silicon die, identical electrical specs and pinout - differs only in branding and qualification documentation | No functional difference; used interchangeably in NXP's automotive qualification programs | Valid drop-in replacement with identical form, fit, and function; preferred for legacy design continuity where SPC prefix is not mandated. |
Compared with SPC5607BF1MLU6, the SPC5606BK0MLU6 reduces memory and peripheral count for cost-sensitive applications, while the MPC5607BF1MLU6 provides identical functionality under a different part numbering scheme aligned with NXP's broader MPC56xx family documentation.
Availability
SPC5607BF1MLU6 is available at Aetrix Electronics and suitable for body control modules, seat control units, roof modules, and smart junction boxes requiring stable component supply, long-term automotive lifecycle support, and AEC-Q100 Grade 1 qualification.
Supply support for SPC5607BF1MLU6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade reliability.
The SPC5607BF1MLU6 belongs to the SPC56xx automotive microcontroller product line, designed specifically for body electronics and chassis control applications demanding ASIL-B compliance, real-time performance, and robust EMC behavior in harsh vehicle environments.
FAQ
What is the maximum operating temperature range for the SPC5607BF1MLU6?
The SPC5607BF1MLU6 is qualified for AEC-Q100 Grade 1 operation, supporting ambient temperatures from −40 °C to +125 °C. This rating applies to the full LQFP-144 package variant and ensures reliable performance in engine bay–adjacent and under-hood ECU locations where thermal stress is highest. Thermal derating is not required within this range when proper PCB copper pour and decoupling are implemented per NXP AN2865 guidelines.
Does the SPC5607BF1MLU6 support AUTOSAR-compliant software stacks?
Yes, the SPC5607BF1MLU6 is fully supported by AUTOSAR 4.x-compliant MCAL drivers from NXP and third-party vendors including ETAS, Vector, and Elektrobit. Its memory layout (1.5 MB flash, 96 KB SRAM), MPU, and PIT/STM timers meet AUTOSAR OS timing and memory partitioning requirements. The SPC5607BF1MLU6 also includes dedicated SSCM and ECSM modules for system status reporting and error correction essential for ASIL-B software certification.
What debug interface does the SPC5607BF1MLU6 provide?
The SPC5607BF1MLU6 features a Nexus 2+ debug interface compliant with IEEE-ISTO 5001-2003 Class Two Plus, including MDO0–MDO3 trace outputs, MCKO clock, EVTO event trigger, and MSEO serial output. It supports real-time instruction trace, hardware breakpoints, and memory access monitoring. JTAG (IEEE 1149.1) is also integrated for boundary scan testing and flash programming during production.
Can the SPC5607BF1MLU6 operate without an external crystal?
Yes, the SPC5607BF1MLU6 can operate using its internal 16 MHz fast RC oscillator (FIRC) or 128 kHz slow RC oscillator (SIRC) for boot and low-power modes. However, for production automotive applications requiring precise timing (e.g., CAN bit rate accuracy, LIN baud rate tolerance), an external 4–16 MHz crystal on XTAL/EXTAL is mandatory. The FMPLL requires either crystal or FIRC as input, and FIRC drift exceeds ±1.5% over temperature - insufficient for CAN FD or high-accuracy PWM.
What is the purpose of the VDD_BV pin on the SPC5607BF1MLU6?
The VDD_BV pin supplies the internal bandgap reference voltage circuitry and is used by the on-chip voltage regulator (VREG) to generate stable internal supply levels. It must be connected to the main 3.3 V digital supply (VDD_HV) through a 100 nF ceramic capacitor to ground. Incorrect VDD_BV decoupling causes ADC offset errors, unstable VREG output, and potential brown-out resets - especially during transient load conditions in automotive battery environments.
SPC5607BF1MLU6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 176-LQFP
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 64MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 149
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 29x10b, 5x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5607BF1MLU6 FAQ
1.How can I place an order for SPC5607BF1MLU6 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5607BF1MLU6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5607BF1MLU6 reliable?
The price and inventory of SPC5607BF1MLU6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5607BF1MLU6 is usually 5 days.
3.What payment methods are accepted for SPC5607BF1MLU6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5607BF1MLU6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5607BF1MLU6?
SPC5607BF1MLU6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5607BF1MLU6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5607BF1MLU6?
For technical support, including SPC5607BF1MLU6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5607BF1MLU6 requirements.
6.How does Aetrix verify that SPC5607BF1MLU6 is sourced from the original manufacturer or authorized distributors?
All SPC5607BF1MLU6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5607BF1MLU6 meets industry standards.
7.What is the process for return or replacement of SPC5607BF1MLU6?
All SPC5607BF1MLU6 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5607BF1MLU6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5607BF1MLU6 part is unused and in its original packaging.
Return procedure for SPC5607BF1MLU6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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