My Inquiry
My Account
NXP Semiconductors SPC5607BF1VLQ6R
- Part No.:
- SPC5607BF1VLQ6R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
SPC5607BF1VLQ6R.pdf
- Description:
- IC MCU 32BIT 1.5MB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,731
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5607BF1VLQ6R from NXP Semiconductors (formerly Freescale) is a 32-bit automotive MCU based on the e200z0 Power Architecture core, featuring 1.5 MB Flash, 6 CAN interfaces, 10 LINFlex modules, 96 KB RAM, and 176-pin LQFP packaging - deployed in central body controllers and gateway systems for vehicle network management.
For engineers reviewing the SPC5607BF1VLQ6R datasheet, SPC5607BF1VLQ6R pinout, SPC5607BF1VLQ6R application, or SPC5607BF1VLQ6R equivalent, key selection criteria include CAN/LIN peripheral count, Flash/RAM sizing, temperature grade (–40 °C to +125 °C), and compatibility with Qorivva toolchain and AUTOSAR-compliant BSW stacks.
Technical Context
The SPC5607BF1VLQ6R implements a scalable e200z0 core with Variable Length Encoding (VLE) support, integrated FMPLL clock generation, and memory protection unit (MPU) for ASIL-B capable designs. It includes dual ADC subsystems (12-bit/16-ch + 10-bit/32-ch) and cross-triggering unit (CTU) for synchronized PWM and ADC sampling.
Its FlexCAN module supports both FIFO and mailbox modes for mixed event-driven and periodic CAN traffic handling, while LINFlex provides hardware-managed LIN 2.1/2.2 frame transmission and reception without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | e200z0 Power Architecture with VLE instruction set, enabling compact code footprint and deterministic real-time execution. |
| Max Clock Speed | 64 MHz - delivers sufficient compute headroom for multi-channel LIN/CAN gateway scheduling and diagnostic routines. |
| Flash Memory | 1.5 MB with ECC - supports large AUTOSAR OS images, bootloader redundancy, and field-upgradeable application partitions. |
| RAM | 96 KB SRAM with ECC - accommodates runtime data buffers for CAN message queues, LIN frame stacks, and sensor fusion variables. |
| CAN Interfaces | 6 FlexCAN modules - enables full-featured body gateway with dedicated CAN channels for powertrain, chassis, infotainment, and comfort domains. |
| LIN Interfaces | 10 LINFlex modules - allows direct control of multiple LIN slave nodes (e.g., door modules, seat controls, mirror actuators) without external LIN transceivers. |
| ADC System | Dual ADC: 12-bit/16-ch + 10-bit/32-ch - supports simultaneous analog sensing across battery monitoring, HVAC thermistors, and potentiometer inputs. |
| Operating Temp | –40 °C to +125 °C - qualified for under-hood and cabin-mounted automotive ECU deployments per AEC-Q100 Grade 1. |
Pinout & Package
SPC5607BF1VLQ6R is housed in a 176-pin LQFP package (16 × 16 mm, 0.5 mm pitch) with exposed thermal pad. Pin assignments follow Qorivva MPC560xB/C/D family standard layout, including dedicated CANH/CANL differential pairs, LIN_TX/LIN_RX pins per LINFlex channel, and multiplexed ADC input channels mapped to specific port pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_IO_0–VDD_IO_7 | I/O supply rails | Eight independent 3.3 V I/O banks enable voltage domain isolation between CAN, LIN, ADC, and general-purpose GPIO groups. |
| CAN0_TX / CAN0_RX | Differential CAN bus interface | Direct connection to external CAN transceiver; supports ISO 11898-2 compliant signaling up to 1 Mbps. |
| LIN0_TX / LIN0_RX | Single-wire LIN physical layer interface | Drives LIN bus directly via internal pull-up; compatible with LIN 2.1/2.2 protocol timing and error detection. |
| ADC0_IN0–ADC0_IN15 | Analog input channels (12-bit) | Map to PORTA/PORTE pins; support simultaneous sampling triggered by eMIOS or CTU for motor current sensing. |
| EMIOS_0–EMIOS_199 | Enhanced modular timer channels | 200-channel eMIOS supports PWM generation, input capture for hall sensor edges, and quadrature decoding for window lift position feedback. |
Key Features
| Feature | Design Value |
|---|---|
| FlexCAN with FIFO + mailbox mode | Enables concurrent handling of high-priority event messages (e.g., door lock status) and low-latency periodic frames (e.g., HVAC fan speed) without software arbitration overhead. |
| LINFlex hardware frame management | Reduces CPU load by >70% during LIN communication cycles, freeing cycles for diagnostics or sensor processing in resource-constrained gateways. |
| eMIOS with shifted PWM output | Supports interleaved PWM signals across multiple motor drivers to lower peak EMI emissions - critical for meeting CISPR 25 Class 5 compliance in body ECUs. |
| Cross-triggering unit (CTU) | Synchronizes PWM edge transitions with ADC sampling windows to eliminate phase-induced measurement errors in closed-loop motor control loops. |
| Scalable e200z0 core + VLE | Provides binary compatibility with higher-performance Qorivva derivatives (e.g., MPC5643L), enabling software reuse across platform generations. |
Applications
| Central Body Controller | Gateway Controller |
|---|---|
Use Scenario: Manages lighting, wipers, horn, and interior switches in modern vehicle platforms with centralized architecture. IC Role / Device Role / Timing Role: Primary host controller executing body domain software stack, coordinating LIN slaves and routing CAN messages between subnets. Use Value: 10 LINFlex modules allow direct integration of all door, seat, and mirror modules without external LIN transceivers, reducing BOM cost and PCB area. | Use Scenario: Bridges CAN FD (powertrain) and legacy CAN (body) networks while translating LIN commands into CAN-based actuator control. IC Role / Device Role / Timing Role: Protocol translator and traffic scheduler with deterministic latency for safety-critical gateway functions. Use Value: Six independent FlexCAN modules support isolated bus domains, preventing fault propagation between chassis and infotainment CAN networks. |
| Comfort Control Module | Roof Module Controller |
Use Scenario: Controls seat heating, climate zone actuators, and ambient lighting with analog sensor feedback and PWM-driven heaters. IC Role / Device Role / Timing Role: Mixed-signal controller performing real-time ADC sampling, PID loop execution, and multi-channel PWM output. Use Value: Dual ADC subsystem enables simultaneous 12-bit battery voltage monitoring and 10-bit thermistor readings for adaptive heater duty cycle adjustment. | Use Scenario: Integrates sunroof, panoramic roof, and rain sensor logic in premium vehicle roof modules. IC Role / Device Role / Timing Role: Safety-aware motion controller with watchdog supervision, CTU-synchronized motor current sampling, and fail-safe stop detection. Use Value: Cross-triggering unit ensures precise correlation between PWM-driven motor drive signals and ADC-measured current waveforms for accurate stall detection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive body controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5606BF1VLQ6R | 1 MB Flash, 80 KB RAM, 8 LINFlex, same 6 CAN, 176 LQFP package | Lower Flash/RAM capacity; suitable for reduced-feature gateways with fewer LIN nodes | Select when software image size and LIN node count are constrained but CAN channel count and package compatibility are retained. |
| SPC560B50L5CEFBR | NXP SPC560B series successor with enhanced debug, 1.25 MB Flash, 80 KB RAM, 6 CAN, 8 LINFlex, 144 LQFP | Smaller package, no 176-pin option; lacks eMIOS200 channel count and dual ADC resolution depth | Choose for new designs prioritizing toolchain continuity and lifecycle longevity, accepting trade-offs in analog/peripheral scalability. |
Compared with MPC5606BF1VLQ6R and SPC560B50L5CEFBR, the SPC5607BF1VLQ6R offers the highest Flash/RAM density and LINFlex count in the Qorivva 176-LQFP footprint - making it optimal for feature-rich body gateways requiring long-term software maintainability and LIN node expansion headroom.
Availability
SPC5607BF1VLQ6R is available at Aetrix Electronics and suitable for central body controllers, automotive gateways, comfort control modules, and roof module controllers requiring stable component supply across extended automotive production lifecycles.
Supply support for SPC5607BF1VLQ6R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in Power Architecture-based microcontrollers.
The Qorivva MPC560xB/C/D product line was engineered specifically for ASIL-B automotive body electronics, emphasizing functional safety, peripheral integration, and toolchain maturity for production-grade ECU development.
FAQ
What is the operating temperature range of the SPC5607BF1VLQ6R?
The SPC5607BF1VLQ6R is rated for operation from –40 °C to +125 °C, meeting AEC-Q100 Grade 1 requirements for under-hood and cabin-mounted automotive electronic control units. This range ensures reliable performance in extreme environmental conditions encountered in body electronics applications such as door modules and gateway controllers. The SPC5607BF1VLQ6R incorporates on-die thermal monitoring and voltage regulation circuitry to maintain functional integrity across its full temperature envelope.
Does the SPC5607BF1VLQ6R support AUTOSAR-compliant software stacks?
Yes, the SPC5607BF1VLQ6R is supported by AUTOSAR 4.x-compliant basic software (BSW) modules from major middleware vendors and NXP's own SPC5 Studio toolchain. Its memory protection unit (MPU), interrupt nesting capability, and deterministic e200z0 core execution make it suitable for ASIL-B partitioning. The SPC5607BF1VLQ6R has been validated with production AUTOSAR stacks for CAN/LIN driver integration, ECU state management, and diagnostic event manager deployment.
How many CAN and LIN interfaces does the SPC5607BF1VLQ6R provide?
The SPC5607BF1VLQ6R integrates six FlexCAN modules and ten LINFlex modules - the highest peripheral count in the Qorivva MPC560xB/C/D family. Each CAN module supports ISO 11898-2 up to 1 Mbps, and each LINFlex handles full LIN 2.1/2.2 protocol framing, checksum, and wakeup detection autonomously. This configuration enables the SPC5607BF1VLQ6R to serve as a full-featured automotive gateway without external bridge ICs.
What package type and pin count does the SPC5607BF1VLQ6R use?
The SPC5607BF1VLQ6R uses a 176-pin LQFP package (16 mm × 16 mm, 0.5 mm pitch) with an exposed thermal pad for enhanced heat dissipation in high-duty-cycle automotive applications. This package matches the pinout of other Qorivva MPC560xB/C/D devices in the same footprint, enabling board-level compatibility across the family. The SPC5607BF1VLQ6R's pin assignment includes dedicated CANH/CANL differential pairs, LIN_TX/LIN_RX lines per channel, and multiplexed ADC inputs mapped to PORTA/PORTE.
Is the SPC5607BF1VLQ6R pin-compatible with the MPC5606B or MPC5605B?
Yes, the SPC5607BF1VLQ6R is pin-compatible with the MPC5606BF1VLQ6R and MPC5605BF1VLQ6R in the 176 LQFP package variant, sharing identical mechanical footprint, power pin locations, and peripheral pin mappings. However, differences in Flash size, RAM allocation, and LINFlex count mean firmware must be reconfigured for full utilization. The SPC5607BF1VLQ6R retains backward compatibility for hardware reuse in upgraded gateway designs where increased LIN node support is required.
SPC5607BF1VLQ6R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- MPC56xx Qorivva
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 64MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 121
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 15x10b, 5x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5607BF1VLQ6R FAQ
1.How can I place an order for SPC5607BF1VLQ6R through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5607BF1VLQ6R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5607BF1VLQ6R reliable?
The price and inventory of SPC5607BF1VLQ6R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5607BF1VLQ6R is usually 5 days.
3.What payment methods are accepted for SPC5607BF1VLQ6R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5607BF1VLQ6R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5607BF1VLQ6R?
SPC5607BF1VLQ6R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5607BF1VLQ6R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5607BF1VLQ6R?
For technical support, including SPC5607BF1VLQ6R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5607BF1VLQ6R requirements.
6.How does Aetrix verify that SPC5607BF1VLQ6R is sourced from the original manufacturer or authorized distributors?
All SPC5607BF1VLQ6R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5607BF1VLQ6R meets industry standards.
7.What is the process for return or replacement of SPC5607BF1VLQ6R?
All SPC5607BF1VLQ6R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5607BF1VLQ6R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5607BF1VLQ6R part is unused and in its original packaging.
Return procedure for SPC5607BF1VLQ6R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5607BF1VLQ6R Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
