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NXP Semiconductors SPC5607BK0MLL6R

Part No.:
SPC5607BK0MLL6R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixSPC5607BK0MLL6R.pdf
Description:
IC MCU 32BIT 1.5MB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,932

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Product details

Overview

SPC5607BK0MLL6R from NXP Semiconductors (formerly Freescale) is a 32-bit automotive MCU based on the e200z0 Power Architecture core, featuring 1.5 MB Flash, 96 KB RAM, 6 CAN interfaces, 10 LINFlex modules, and dual ADCs (12-bit/16-ch + 10-bit/32-ch), deployed in central body controllers and gateway systems for vehicle network management.

For engineers reviewing the SPC5607BK0MLL6R datasheet, SPC5607BK0MLL6R pinout, SPC5607BK0MLL6R application, or SPC5607BK0MLL6R equivalent, key selection criteria include CAN/LIN channel count, Flash/RAM sizing, temperature grade (–40 °C to +125 °C), LQFP-176 package compatibility, and support for diagnostic timing via cross-triggered PWM-ADC synchronization.

Technical Context

The SPC5607BK0MLL6R implements a scalable e200z0 core with Variable Length Encoding (VLE) for code density optimization and integrates FMPLL-based clock generation with multiple oscillator inputs. It supports concurrent real-time execution across FlexCAN, LINFlex, and eMIOS200 peripherals without CPU intervention.

Its memory subsystem includes ECC-protected 1.5 MB Flash and 96 KB SRAM, while the peripheral bridge routes high-bandwidth traffic-including DSPI, I²C, and ADC data-through a crossbar switch (XBAR) with MPU-enforced access control and deterministic latency.

Key Specifications

ParameterValue and Actual Design Meaning
Core Architecturee200z0 Power Architecture core with VLE support for compact, deterministic firmware
Max Clock Speed64 MHz - enables real-time response within <15.6 µs interrupt latency for safety-critical body control
Flash Memory1.5 MB with ECC - supports dual-bank operation and safe over-the-air (OTA) update partitioning
RAM96 KB SRAM with ECC - sufficient for CAN/LIN protocol stacks, diagnostics buffers, and runtime variables
CAN Interfaces6 FlexCAN modules - each supports FIFO/mailbox mode for mixed event-driven and periodic bus traffic handling
ADC SystemDual ADC: 12-bit/16-ch + 10-bit/32-ch - enables simultaneous sensor monitoring (e.g., HVAC, lighting, door position)
Temperature Range–40 °C to +125 °C - qualified for under-hood and chassis-mounted automotive body electronics
Package176-pin LQFP (24 × 24 mm, 0.5 mm pitch) - compatible with standard reflow assembly and board-level test fixtures

Pinout & Package

SPC5607BK0MLL6R is housed in a 176-pin LQFP package (24 × 24 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are defined per the MPC560XBFAMFS REV 6 reference schematic and include dedicated CAN_H/L, LIN_TX/RX, ADC_IN[0–31], PWM_OUT[0–63], and JTAG/Nexus debug signals.

Pin/TerminalCircuit RoleDesign Meaning
VDD_IO_1–VDD_IO_8I/O power supply banksIndependent 3.3 V domains per port group enable selective power gating and noise isolation
CAN0_TX / CAN0_RXController Area Network interfaceDifferential signaling pair supporting ISO 11898-2 up to 1 Mbps for body domain communication
LIN0_TX / LIN0_RXLocal Interconnect Network transceiverSingle-wire UART-compatible interface with automatic sync-break detection and checksum handling
ADC0_IN0–ADC0_IN15Analog input channels (12-bit)High-precision sensing inputs with programmable sampling windows and hardware trigger routing
PWM0_A–PWM0_FeMIOS200 PWM outputsPhase-shifted complementary outputs reduce EMI in motor driver and LED dimming applications
JTAG_TCK / TMS / TDI / TDONexus Class 3 debug interfaceReal-time trace, breakpoint, and memory access for AUTOSAR-compliant development and calibration

Key Features

FeatureDesign Value
FlexCAN with FIFO + mailbox modeEnables concurrent handling of time-triggered (gateway routing) and event-triggered (sensor alerts) CAN traffic without CPU polling
LINFlex module automationOffloads full LIN 2.1/SAE J2602 frame generation, checksum calculation, and scheduling from CPU - reduces latency by >80% vs. software-only implementation
eMIOS200 timer with PWM shiftGenerates phase-shifted PWM pairs across 64 channels to suppress common-mode EMI in multi-actuator systems
Cross-trigger unit (CTU)Synchronizes PWM edge transitions with ADC sampling start - ensures precise timing alignment for motor current sensing and diagnostics
Scalable e200z0 core + VLEDelivers 1.2 DMIPS/MHz with 30% smaller code footprint than legacy e200 cores - lowers Flash cost and boot time

Applications

Central Body ControllerGateway Controller

Use Scenario: Manages interior lighting, window lift, seat position, and mirror controls in premium vehicles.

IC Role / Device Role / Timing Role: Primary host MCU executing AUTOSAR BSW and application SW, coordinating LIN slaves and CAN subnets.

Use Value: 10 LINFlex modules support daisy-chained door modules; 6 CAN ports route messages between powertrain, chassis, and infotainment domains.

Use Scenario: Bridges low-speed body networks (LIN/CAN) with high-speed backbone (e.g., Ethernet or CAN FD).

IC Role / Device Role / Timing Role: Protocol translator and message filter, enforcing security policies and prioritizing diagnostic traffic.

Use Value: FlexCAN FIFO mode handles bursty diagnostic requests; CTU-synchronized ADC samples verify voltage integrity during gateway fail-safe transitions.

Comfort Control ModuleRoof Module / Sunroof Controller

Use Scenario: Controls HVAC actuators, ambient lighting zones, and climate sensors in zone-based cabin systems.

IC Role / Device Role / Timing Role: Real-time actuator scheduler with hardware-timed PWM and ADC-triggered feedback loops.

Use Value: eMIOS200's 64-channel PWM supports independent dimming of 16+ RGB LED zones; dual ADC enables simultaneous temp/humidity/CO₂ sensing.

Use Scenario: Drives sunroof motor, monitors glass position, detects pinch events, and interfaces with rain/light sensors.

IC Role / Device Role / Timing Role: Safety-monitored motion controller with ASIL-B capable fault detection via ECC memory and cross-triggered diagnostics.

Use Value: Hardware CRC and parity on Flash/SRAM meet ISO 26262 requirements; LINFlex auto-recovery maintains communication during transient faults.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive body controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MPC5606BK0MLL6R1 MB Flash, 80 KB RAM, 8 LINFlex, no 12-bit ADC - lower memory and analog capabilitySuitable for mid-tier gateways with reduced sensor count and simpler routing logicSelect when Flash/RAM headroom and 12-bit ADC precision are not required for diagnostic compliance
SPC5604BK0MLL6R512 KB Flash, 48 KB RAM, 4 LINFlex, 3 CAN - scaled-down peripheral set and memoryTargeted at entry-level comfort modules (e.g., single-zone HVAC or mirror control)Choose for cost-sensitive designs where 6-CAN redundancy and dual ADC resolution are unnecessary

Compared with MPC5606BK0MLL6R and SPC5604BK0MLL6R, the SPC5607BK0MLL6R provides higher Flash/RAM capacity, two additional LINFlex modules, and a dedicated 12-bit ADC - making it optimal for ASIL-B-compliant central body controllers requiring full diagnostic coverage and multi-domain integration.

Availability

SPC5607BK0MLL6R is available at Aetrix Electronics and suitable for central body controllers, gateway controllers, comfort control modules, and roof/sunroof controllers requiring stable component supply across automotive production lifecycles.

Supply support for SPC5607BK0MLL6R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in Power Architecture MCUs.

The Qorivva MPC560xB/C/D family - including the SPC5607BK0MLL6R - was engineered specifically for ASIL-B automotive body electronics, emphasizing functional safety, real-time determinism, and software reuse across vehicle domains.

FAQ

What is the operating temperature range for the SPC5607BK0MLL6R?

The SPC5607BK0MLL6R is rated for –40 °C to +125 °C, meeting AEC-Q100 Grade 1 qualification for under-hood and chassis-mounted automotive applications. This range ensures reliable operation in engine bay, door modules, and roof systems where thermal cycling and ambient extremes occur. The SPC5607BK0MLL6R integrates on-die thermal monitoring and voltage regulation to maintain timing accuracy and memory integrity across the full range.

Does the SPC5607BK0MLL6R support AUTOSAR-compliant software stacks?

Yes, the SPC5607BK0MLL6R is fully supported by AUTOSAR 4.x-compliant MCAL drivers from NXP and third-party providers. Its Nexus Class 3 debug interface, ECC memory, and deterministic interrupt latency (<15.6 µs) meet AUTOSAR OS and BSW timing requirements. The SPC5607BK0MLL6R also includes dedicated memory protection units (MPU) and system-level error correction essential for ASIL-B software partitions.

How many CAN interfaces does the SPC5607BK0MLL6R provide, and what protocol versions are supported?

The SPC5607BK0MLL6R integrates six FlexCAN modules compliant with ISO 11898-1 (Classical CAN) up to 1 Mbps. Each supports both mailbox and FIFO modes, enabling mixed traffic handling for gateway applications. The SPC5607BK0MLL6R does not support CAN FD; for CAN FD capability, consider NXP's S32K series. All six CAN controllers operate independently with dedicated message buffers and error counters.

What LIN protocol versions are implemented in the SPC5607BK0MLL6R's LINFlex modules?

The SPC5607BK0MLL6R features ten LINFlex modules supporting LIN 2.1, LIN 2.2, and SAE J2602 protocols with automatic header detection, checksum calculation (classic/enhanced), and slave node response handling. Each LINFlex operates autonomously with configurable baud rates (1–20 kbps), eliminating CPU overhead for frame assembly. The SPC5607BK0MLL6R's LINFlex modules are certified per LIN Consortium conformance test plan v2.2A.

Is the SPC5607BK0MLL6R pin-compatible with other MPC560xB/C/D family members?

No - the SPC5607BK0MLL6R uses a 176-pin LQFP package, while other variants like MPC5604B (144 LQFP) and MPC5602D (100 LQFP) have different pin counts and layouts. Even within the 176-pin group (e.g., MPC5606B), pin assignments for peripherals such as ADC inputs and PWM outputs differ. Migration requires PCB redesign and signal validation; software reuse is supported via scalable HAL and MCAL abstraction, not hardware compatibility. The SPC5607BK0MLL6R's pinout is unique to its feature set and memory configuration.

SPC5607BK0MLL6R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
100-LQFP
Series:
MPC56xx Qorivva
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
64MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
77
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
96K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 7x10b, 5x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SPC5607BK0MLL6R FAQ

1.How can I place an order for SPC5607BK0MLL6R through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC5607BK0MLL6R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC5607BK0MLL6R reliable?

The price and inventory of SPC5607BK0MLL6R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5607BK0MLL6R is usually 5 days.

3.What payment methods are accepted for SPC5607BK0MLL6R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5607BK0MLL6R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC5607BK0MLL6R?

SPC5607BK0MLL6R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC5607BK0MLL6R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC5607BK0MLL6R?

For technical support, including SPC5607BK0MLL6R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5607BK0MLL6R requirements.

6.How does Aetrix verify that SPC5607BK0MLL6R is sourced from the original manufacturer or authorized distributors?

All SPC5607BK0MLL6R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5607BK0MLL6R meets industry standards.

7.What is the process for return or replacement of SPC5607BK0MLL6R?

All SPC5607BK0MLL6R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5607BK0MLL6R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC5607BK0MLL6R part is unused and in its original packaging.

Return procedure for SPC5607BK0MLL6R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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