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NXP Semiconductors SPC5607BK0MLQ6
- Part No.:
- SPC5607BK0MLQ6
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
SPC5607BK0MLQ6.pdf
- Description:
- IC MCU 32BIT 1.5MB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,772
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Product details
Overview
SPC5607BK0MLQ6 from NXP Semiconductors (formerly Freescale) is a 32-bit automotive MCU based on the e200z0 Power Architecture core, featuring 1.5 MB Flash, 96 KB RAM, 6 CAN interfaces, 10 LINFlex modules, and dual ADCs (12-bit/16-ch + 10-bit/32-ch), deployed in central body controllers and gateway applications.
For engineers reviewing the SPC5607BK0MLQ6 datasheet, SPC5607BK0MLQ6 pinout, SPC5607BK0MLQ6 application, or SPC5607BK0MLQ6 equivalent, key selection criteria include CAN/LIN channel count, Flash/RAM sizing for AUTOSAR stack deployment, LQFP-176 thermal performance, and eMIOS200 timer flexibility for PWM-synchronized diagnostics.
Technical Context
The SPC5607BK0MLQ6 integrates an e200z0 core with Variable Length Encoding (VLE) support, FMPLL clock generation up to 64 MHz, and memory protection unit (MPU) for ASIL-B–capable partitioning. It uses ECC-protected Flash and SRAM with built-in error correction logic.
Its peripheral set includes FlexCAN with FIFO/mailbox modes, LINFlex with hardware message scheduling, eMIOS200 with input capture/output compare/PWM (including shifted PWM for EMI reduction), and cross-triggering unit (CTU) linking PWM edges to ADC sampling-enabling precise sensor actuator control loops.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | e200z0 Power Architecture, VLE-enabled, 64 MHz max operation |
| Flash Memory | 1.5 MB main Flash + 64 KB data Flash, both with ECC for functional safety compliance |
| RAM | 96 KB SRAM with ECC, sufficient for AUTOSAR OS + BSW + application task stacks |
| CAN Interfaces | 6 FlexCAN modules supporting ISO 11898-1, each with configurable mailboxes/FIFO for mixed event/periodic traffic |
| LIN Interfaces | 10 LINFlex modules with automatic header/checksum handling and slave node emulation capability |
| ADC System | Dual ADC: 12-bit/16-channel + 10-bit/32-channel, CTU-synchronized sampling for phase-aligned measurements |
| Timer System | eMIOS200 with 64 channels, supporting input capture, output compare, and PWM with dead-time insertion and phase shift |
Pinout & Package
SPC5607BK0MLQ6 is housed in a 176-pin LQFP package (24 × 24 mm, 0.5 mm pitch), RoHS-compliant, with exposed thermal pad for enhanced heat dissipation in automotive under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_A, VDD_IO | Analog & I/O supply rails | Separate 3.3 V domains enable noise isolation between ADC and digital peripherals |
| VSS_A, VSS_IO | Analog & I/O ground returns | Dedicated ground planes reduce coupling between sensitive analog and switching digital signals |
| RESET_IN | Asynchronous reset input | Accepts external watchdog or system-level reset assertion; internal pull-up ensures safe startup |
| JTAG_TCK/TMS/TDI/TDO | JTAG debug interface | Supports boundary scan, flash programming, and real-time debugging via standard ARM-compatible tools |
| CAN0_TX/CAN0_RX | Channel 0 differential transceiver interface | Direct connection to external CAN transceiver; supports high-speed (1 Mbps) and fault-tolerant modes |
| LIN0_TX/LIN0_RX | Channel 0 LIN physical layer interface | Single-wire bus interface with integrated LIN driver/receiver control; supports LIN 2.2A protocol timing |
| ADC0_IN0–ADC0_IN15 | Analog input channels (12-bit) | High-impedance inputs with programmable gain and sample-and-hold; routed through dedicated analog multiplexer |
| PWM0_A–PWM0_H | eMIOS200 PWM output terminals | Eight complementary PWM outputs per module with programmable dead time and edge alignment |
Key Features
| Feature | Design Value |
|---|---|
| FlexCAN with mailbox/FIFO mode | Enables deterministic CAN gateway behavior: mailboxes for priority messages, FIFO for periodic sensor data aggregation |
| LINFlex hardware protocol engine | Offloads CPU from LIN frame assembly/disassembly, reducing latency to <10 µs per message and freeing cycles for control tasks |
| eMIOS200 with shifted PWM | Generates interleaved PWM waveforms across multiple outputs to lower peak EMI emissions by spreading spectral energy |
| Cross-triggering unit (CTU) | Synchronizes PWM edge events with ADC conversion start, enabling precise timing-critical measurements like motor current sampling |
| Scalable e200z0 core + software compatibility | Allows reuse of AUTOSAR BSW, MCAL drivers, and configuration tools across MPC560xB/C/D family for cost-efficient platform scaling |
Applications
| Central Body Controller | Gateway Controller |
|---|---|
Use Scenario: Integrated control of lighting, door locks, window lifts, and seat position in premium vehicle platforms. IC Role / Device Role / Timing Role: Primary host MCU managing distributed LIN nodes and coordinating CAN-based subsystems via message routing. Use Value: 10 LINFlex modules eliminate need for external LIN transceivers; 6 CAN ports support multi-bus architecture without external bridge ICs. | Use Scenario: Protocol translation between high-speed CAN FD backbone and low-speed LIN/UART subnetworks in modern vehicle architectures. IC Role / Device Role / Timing Role: Real-time message filtering, prioritization, and retransmission engine with deterministic latency under 500 µs. Use Value: FlexCAN mailbox mode handles urgent diagnostic frames; FIFO buffers handle bulk sensor telemetry, ensuring no frame loss during bus congestion. |
| Comfort Control Module | Roof Module Controller |
Use Scenario: HVAC actuator control, ambient light sensing, and climate zone management with feedback from multiple analog sensors. IC Role / Device Role / Timing Role: Sensor fusion hub using dual ADCs and eMIOS200 PWM for brushless fan control and valve positioning. Use Value: CTU-synchronized ADC sampling captures motor current at exact commutation points, improving efficiency and reducing audible noise. | Use Scenario: Sunroof, panoramic roof, and interior lighting control with anti-pinch detection and smooth motion profiling. IC Role / Device Role / Timing Role: Safety-critical motion controller with PWM-driven motor drivers and redundant analog position feedback processing. Use Value: ECC-protected Flash and SRAM meet ASIL-B requirements; eMIOS200's dead-time insertion prevents shoot-through in H-bridge drivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive body control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5606BK0MLQ6 | 1 MB Flash, 80 KB RAM, 8 LINFlex, same 6 CAN, 176 LQFP, 64 MHz | Lower Flash/RAM margin for complex AUTOSAR stacks; reduced LIN count limits node scalability | Select when gateway functionality is secondary and LIN node count ≤8; reduces BOM cost without sacrificing CAN bandwidth |
| SPC5607BK0MLU6 | Same core, memory, and peripheral set; differs only in 144-pin LQFP package (smaller footprint, fewer I/O) | Reduced GPIO count limits expansion for add-on modules; thermal derating required above 105 °C ambient | Select when board space is constrained and full 176-pin I/O is unnecessary; verify thermal profile for under-dash mounting |
Compared with SPC5607BK0MLQ6, MPC5606BK0MLQ6 trades Flash/RAM headroom and LIN capacity for cost savings, while SPC5607BK0MLU6 maintains identical functionality in a smaller package-making it suitable for space-constrained but thermally benign deployments.
Availability
SPC5607BK0MLQ6 is available at Aetrix Electronics and suitable for central body controllers, gateway controllers, and comfort control modules requiring stable component supply across automotive production lifecycles.
Supply support for SPC5607BK0MLQ6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and ASIL-certified microcontrollers.
The Qorivva MPC560xB/C/D product line was designed specifically for automotive body electronics and gateway systems, emphasizing CAN/LIN integration, real-time determinism, and ASIL-B–ready memory and peripheral subsystems.
FAQ
What is the operating temperature range for SPC5607BK0MLQ6?
The SPC5607BK0MLQ6 is rated for –40 °C to +125 °C ambient operation, meeting AEC-Q100 Grade 1 requirements. This range supports placement in engine compartments, under-dash enclosures, and other thermally demanding automotive locations where junction temperature must remain within safe limits under full load.
Does SPC5607BK0MLQ6 support AUTOSAR-compliant MCAL drivers?
Yes, SPC5607BK0MLQ6 is fully supported by NXP's AUTOSAR MCAL 4.3+ drivers, including CAN, LIN, ADC, PWM, and DIO modules. The SPC5607BK0MLQ6's memory layout, interrupt structure, and peripheral register mapping align with AUTOSAR 4.x specifications for seamless integration into production-grade automotive software stacks.
How many CAN and LIN interfaces does SPC5607BK0MLQ6 provide?
The SPC5607BK0MLQ6 provides six FlexCAN modules and ten LINFlex modules. Each FlexCAN supports ISO 11898-1 with configurable mailboxes and FIFOs, while each LINFlex implements full LIN 2.2A protocol handling-including automatic checksum, header generation, and sleep/wake management-without CPU intervention.
What package type and pin count does SPC5607BK0MLQ6 use?
SPC5607BK0MLQ6 uses a 176-pin LQFP package (24 × 24 mm, 0.5 mm pitch) with exposed thermal pad. This package provides optimal signal integrity for high-speed CAN and robust thermal performance for sustained 64 MHz operation in automotive environments.
Is SPC5607BK0MLQ6 pin-compatible with other MPC560xB/C/D family members?
No, SPC5607BK0MLQ6 is not pin-compatible with other MPC560xB/C/D variants due to differing pin assignments for peripherals, power domains, and debug interfaces-even within the same 176 LQFP footprint. Board design must be validated per specific part number; migration requires PCB revision.
SPC5607BK0MLQ6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 64MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 121
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 15x10b, 5x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5607BK0MLQ6 FAQ
1.How can I place an order for SPC5607BK0MLQ6 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5607BK0MLQ6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5607BK0MLQ6 reliable?
The price and inventory of SPC5607BK0MLQ6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5607BK0MLQ6 is usually 5 days.
3.What payment methods are accepted for SPC5607BK0MLQ6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5607BK0MLQ6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5607BK0MLQ6?
SPC5607BK0MLQ6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5607BK0MLQ6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5607BK0MLQ6?
For technical support, including SPC5607BK0MLQ6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5607BK0MLQ6 requirements.
6.How does Aetrix verify that SPC5607BK0MLQ6 is sourced from the original manufacturer or authorized distributors?
All SPC5607BK0MLQ6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5607BK0MLQ6 meets industry standards.
7.What is the process for return or replacement of SPC5607BK0MLQ6?
All SPC5607BK0MLQ6 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5607BK0MLQ6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5607BK0MLQ6 part is unused and in its original packaging.
Return procedure for SPC5607BK0MLQ6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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