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NXP Semiconductors SPC5607BK0MLQ6R
- Part No.:
- SPC5607BK0MLQ6R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
SPC5607BK0MLQ6R.pdf
- Description:
- NXP 32-BIT MCU, POWER ARCH CORE,
- Quantity:
- Payment:
- Shipping:
Inventory:4,320
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Product details
Overview
SPC5607BK0MLQ6R from NXP Semiconductors is an automotive-grade 32-bit Power Architecture® microcontroller featuring the e200z0h CPU core, 1.5 MB on-chip code flash, 96 KB SRAM, dual ADC (10-bit and 12-bit), six FlexCAN modules, and 10 LINFlex interfaces. It operates up to 64 MHz and targets body electronics control units requiring ASIL-B functional safety support.
For engineers reviewing the SPC5607BK0MLQ6R datasheet, SPC5607BK0MLQ6R pinout, SPC5607BK0MLQ6R application, or SPC5607BK0MLQ6R equivalent, key selection criteria include FMPLL clock generation, cross-triggered ADC synchronization, Nexus 2+ debug interface compliance, and 144-pin LQFP package compatibility with automotive PCB layout constraints.
Technical Context
The SPC5607BK0MLQ6R implements a single-issue e200z0h core with Variable Length Encoding (VLE) for reduced code footprint and integrates a 64-bit 2×3 crossbar switch enabling concurrent access to Flash, SRAM, and peripherals by multiple bus masters. Its memory subsystem includes ECC-protected 64 KB data flash and MPU with 8 region descriptors.
Peripherals include a 16-channel eDMA controller, 6 DSPI modules, 10 LINFlex UARTs with LIN 2.2/SAE J2602 support, and a Cross Trigger Unit (CTU) that synchronizes ADC conversions with eMIOS timer events - critical for deterministic sensor sampling in motor control and lighting systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h compliant with Power Architecture® embedded category; supports VLE for ~30% smaller code size vs. full 32-bit encoding. |
| Max Clock Frequency | 64 MHz - enables real-time execution of AUTOSAR OS tasks and fast PWM generation in lighting or HVAC control. |
| Code Flash | 1.5 MB with flash memory controller - sufficient for dual-bank firmware updates and complex diagnostic stacks. |
| SRAM | 96 KB - supports large buffers for CAN/LIN message queues and real-time signal processing. |
| ADC | Dual converters: one 10-bit (15 channels), one 12-bit (19 shared channels); CTU-synchronized sampling eliminates phase skew in multi-sensor systems. |
| FlexCAN | 6 modules with configurable message buffers - meets requirements for distributed body domain ECUs with redundant CAN networks. |
| Package | 144-pin LQFP (20 mm × 20 mm); RoHS-compliant, automotive-grade temperature range (–40°C to 125°C). |
Pinout & Package
SPC5607BK0MLQ6R is housed in a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch). Pin functions are defined per NXP's MPC5607B datasheet Rev. 10, Section 3.1 (Figure 3), with dedicated voltage domains (VDD_HV/VSS_HV, VDD_LV/VSS_LV, VDD_BV), analog supplies (VDD_HV_ADC0/1, VSS_HV_ADC0/1), and Nexus 2+ debug pins (MDO0–3, MCKO, EVTO, MSEO).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESET | Active-low reset input | Pulled weakly up after RGM PHASE2; requires external RC filter for noise immunity in automotive environments. |
| XTAL / EXTAL | Crystal oscillator inputs | Supports 4–16 MHz external crystal; enables precise timing for CAN bit rate accuracy and RTC calibration. |
| VDD_HV / VSS_HV | Digital supply and ground | Four VDD_HV and five VSS_HV pins ensure low-impedance power delivery across high-speed I/O banks. |
| VDD_LV / VSS_LV | Core regulator decoupling | Three 1.2 V supply pairs require local 100 nF ceramic capacitors to stabilize internal voltage regulator output. |
| PA[0]–PA[15], PB[0]–PB[15], etc. | Configurable GPIO | 149 total I/O pins (package-dependent); SIUL-controlled pad types (S/M/F/I/J) allow per-pin slew rate and drive strength tuning. |
Key Features
| Feature | Design Value |
|---|---|
| FMPLL with frequency modulation | Reduces EMI by spreading spectral energy - essential for meeting CISPR 25 Class 5 emissions limits in vehicle cabins. |
| Boot Assist Module (BAM) | Enables in-system flash programming via CAN or SCI without external debugger - simplifies field firmware updates. |
| Memory Protection Unit (MPU) | 8-region descriptor support with 32-byte granularity isolates AUTOSAR OS, application, and driver memory spaces for ASIL-B compliance. |
| Crossbar Switch (XBAR) | 2 master × 3 slave architecture prevents bus contention during simultaneous DMA transfers to Flash and eMIOS timer reads. |
| Nexus 2+ Debug Interface | IEEE-ISTO 5001-2003 Class Two Plus compliant - provides real-time trace, data watchpoints, and non-intrusive profiling for ISO 26262 tool qualification. |
Applications
| Body Control Module (BCM) | LED Headlight Driver |
|---|---|
Use Scenario: Centralized control of door locks, windows, mirrors, and interior lighting in modern vehicles. IC Role / Device Role / Timing Role: Main system controller executing AUTOSAR-compliant BSW and application software; manages CAN/LIN communication with distributed nodes. Use Value: 6 FlexCAN modules enable redundant network routing; 10 LINFlex interfaces support up to 10 LIN slaves (e.g., seat motors, ambient lighting) with hardware-assisted scheduling. | Use Scenario: Dynamic LED matrix control with adaptive beam shaping and thermal derating. IC Role / Device Role / Timing Role: Real-time PWM generator and current-sense ADC processor; synchronizes 12-bit ADC sampling with eMIOS timer-triggered PWM edges. Use Value: CTU-linked ADC/timer operation achieves <1 µs timing correlation - critical for closed-loop current regulation and flicker-free dimming. |
| Climate Control Unit | Rear Occupancy Detection System |
Use Scenario: HVAC actuator control with cabin temperature feedback, blower speed regulation, and refrigerant pressure monitoring. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating thermistor, pressure transducer, and PWM-driven stepper motor signals. Use Value: Dual ADC allows simultaneous acquisition of 10-bit cabin temp and 12-bit pressure data; 96 KB SRAM buffers time-series logs for diagnostics. | Use Scenario: Ultrasonic or capacitive sensing of rear seat occupancy for airbag suppression logic. IC Role / Device Role / Timing Role: Time-of-flight measurement controller using eMIOS input capture and high-resolution PIT timers. Use Value: 16-channel eDMA offloads burst ADC reads from CPU; FMPLL jitter reduction ensures sub-nanosecond timing stability for echo detection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5606BK0MLQ6 | 1 MB code flash, 80 KB SRAM, 5 DSPI, 8 LINFlex, no 12-bit ADC - lower peripheral count and memory. | Suitable for cost-sensitive BCMs with fewer LIN nodes and no high-precision analog sensing. | Select when design does not require dual ADC resolution or >1 MB firmware space. |
| SPC560B50L5 | Same e200z0h core but 100-pin LQFP, 1 MB flash, 64 KB SRAM, only 4 FlexCAN modules. | Targeted at compact modules like mirror control where I/O count and CAN bandwidth are constrained. | Choose for space-constrained layouts where 144-pin footprint is prohibitive and 6 CAN channels are unnecessary. |
Compared with SPC5607BK0MLQ6R, MPC5606BK0MLQ6 offers reduced memory and peripheral count for simpler body nodes, while SPC560B50L5 trades pin count and CAN capacity for smaller board area - both serve distinct cost and integration tiers within the same automotive platform family.
Availability
SPC5607BK0MLQ6R is available at Aetrix Electronics and suitable for automotive body electronics, LED lighting control, and climate management systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 Grade 1 qualification.
Supply support for SPC5607BK0MLQ6R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and automotive-grade reliability.
The SPC5607BK0MLQ6R belongs to NXP's SPC5607B automotive MCU family, designed specifically for body electronics controllers requiring ASIL-B compliance, robust EMC performance, and scalable peripheral integration across vehicle platforms.
FAQ
What is the maximum operating temperature range for the SPC5607BK0MLQ6R?
The SPC5607BK0MLQ6R is qualified for operation from –40°C to +125°C ambient temperature, meeting AEC-Q100 Grade 1 requirements for under-hood and cabin-mounted automotive ECUs. This rating is validated per JEDEC JESD22-A108 and applies to all specified electrical characteristics in the MPC5607B datasheet Rev. 10.
Does the SPC5607BK0MLQ6R support AUTOSAR-compliant real-time operating systems?
Yes, the SPC5607BK0MLQ6R supports AUTOSAR-compliant RTOS deployment through its STM (System Timer Module) for OS tick generation, PIT timers for task scheduling, and eMIOS for hardware-accelerated PWM and input capture - all accessible via standardized MCAL drivers provided by NXP and third-party AUTOSAR partners.
How many CAN interfaces does the SPC5607BK0MLQ6R include, and what protocol versions are supported?
The SPC5607BK0MLQ6R integrates six independent FlexCAN modules supporting CAN 2.0A/B protocols and ISO 11898-1 physical layer compliance. Each module features configurable message buffers, loopback mode for self-test, and error counters - enabling redundant CAN networks in body domain architectures.
Is the SPC5607BK0MLQ6R pin-compatible with other members of the MPC5607B family?
No - the SPC5607BK0MLQ6R (144-pin LQFP) shares the same die as other MPC5607B variants but has unique pin mapping per package option. It is not pin-compatible with the 100-pin LQFP, 176-pin LQFP, or 208-ball MAPBGA variants due to differing I/O allocations and power pin placements defined in NXP's MPC5607B datasheet Figure 3.
What debug interface does the SPC5607BK0MLQ6R provide, and is it production-ready?
The SPC5607BK0MLQ6R implements a Nexus 2+ debug interface compliant with IEEE-ISTO 5001-2003 Class Two Plus, supporting real-time trace, data watchpoints, and non-intrusive profiling. It is production-ready and qualified for use in certified ISO 26262 development workflows, with full toolchain support from Lauterbach, iSYSTEM, and PLS.
SPC5607BK0MLQ6R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- MPC56xx Qorivva
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit
- Speed:
- 64MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 149
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V, 4.5V ~ 5.5V
- Data Converters:
- A/D 34x10b, 24x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5607BK0MLQ6R FAQ
1.How can I place an order for SPC5607BK0MLQ6R through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5607BK0MLQ6R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5607BK0MLQ6R reliable?
The price and inventory of SPC5607BK0MLQ6R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5607BK0MLQ6R is usually 5 days.
3.What payment methods are accepted for SPC5607BK0MLQ6R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5607BK0MLQ6R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5607BK0MLQ6R?
SPC5607BK0MLQ6R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5607BK0MLQ6R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5607BK0MLQ6R?
For technical support, including SPC5607BK0MLQ6R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5607BK0MLQ6R requirements.
6.How does Aetrix verify that SPC5607BK0MLQ6R is sourced from the original manufacturer or authorized distributors?
All SPC5607BK0MLQ6R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5607BK0MLQ6R meets industry standards.
7.What is the process for return or replacement of SPC5607BK0MLQ6R?
All SPC5607BK0MLQ6R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5607BK0MLQ6R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5607BK0MLQ6R part is unused and in its original packaging.
Return procedure for SPC5607BK0MLQ6R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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