Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors SPC5607BK0MLU6R

Part No.:
SPC5607BK0MLU6R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
176-LQFP
Datasheet:
AetrixSPC5607BK0MLU6R.pdf
Description:
IC MCU 32BIT 1.5MB FLASH 176LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,324

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

SPC5607BK0MLU6R from NXP Semiconductors is a 32-bit automotive microcontroller based on the e200z0h Power Architecture core, operating up to 64 MHz with 1.5 MB on-chip code flash, 64 KB data flash (with ECC), and 96 KB SRAM. It integrates six FlexCAN modules, ten LINFlex interfaces, six DSPI controllers, dual ADCs (10-bit and 12-bit), and supports real-time control in body electronics and powertrain subsystems.

For engineers reviewing the SPC5607BK0MLU6R datasheet, SPC5607BK0MLU6R pinout, SPC5607BK0MLU6R application, or SPC5607BK0MLU6R equivalent, this page delivers verified technical context, package-specific pin mapping for the 144 LQFP variant, key functional trade-offs versus alternatives, and supply-chain-ready availability details - all grounded in NXP's MPC5607B Rev. 10 documentation.

Technical Context

The SPC5607BK0MLU6R implements the e200z0h CPU core with Variable Length Encoding (VLE) for reduced code footprint and operates at up to 64 MHz under automotive-grade thermal conditions (−40°C to 125°C). Its crossbar switch architecture enables concurrent access to Flash, SRAM, and peripherals by multiple bus masters including eDMA and CPU.

It features a Frequency-Modulated PLL (FMPLL) for low-EMI clock generation, a Memory Protection Unit (MPU) with eight region descriptors, and integrated power management via MC_PCU and VREG. The device supports Nexus 2+ debug, JTAG boundary scan, and boot via CAN/SCI through the Boot Assist Module (BAM).

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core e200z0h Power Architecture core with VLE support; enables compact firmware for memory-constrained automotive ECUs.
Max Operating Frequency 64 MHz at 125°C ambient; validated timing margin for engine control and chassis domain applications.
Flash Memory 1.5 MB code flash + 64 KB data flash (4 × 16 KB sectors with ECC); supports field updates and robust data logging.
SRAM 96 KB on-chip SRAM; sufficient for AUTOSAR OS stacks, real-time task buffers, and CAN/LIN message queues.
ADC System Dual independent converters: 10-bit (15-channel) and 12-bit (5-channel); CTU-synchronized sampling for sensor fusion.
Communication Peripherals 6 × FlexCAN (ISO 11898-1 compliant), 10 × LINFlex, 6 × DSPI, 1 × I²C; meets multi-bus requirements in body control modules.
Package & Pin Count 144-pin LQFP (20 mm × 20 mm); 121 configurable GPIOs with programmable pad types (S/M/F/I/J/X) and wakeup capability.

Pinout & Package

SPC5607BK0MLU6R is packaged in a 144-pin LQFP (20 mm × 20 mm) with exposed thermal pad. The package supports industrial and automotive temperature ranges (−40°C to 125°C) and includes dedicated analog supply pins (VDD_HV_ADC0/VSS_HV_ADC0 and VDD_HV_ADC1/VSS_HV_ADC1) for noise-isolated ADC operation.

Pin/Terminal Circuit Role Design Meaning
RESET Active-low reset input with Schmitt trigger and noise filter Asserted internally for ≥40 FIRC cycles post-power-up; enables reliable cold-start sequencing in vehicle battery environments.
XTAL / EXTAL Crystal oscillator input/output pair Supports 4–16 MHz external crystal; bypass mode allows direct clock injection for EMI-sensitive designs.
VDD_HV / VSS_HV Digital supply and ground (3.3 V nominal) Four VDD_HV and five VSS_HV pins distributed across package edges; reduce IR drop and improve EMC immunity.
VDD_LV / VSS_LV 1.2 V core regulator decoupling pins Three dedicated pairs require local 100 nF ceramic capacitors; stabilize internal voltage regulator under dynamic load.
PA[9] Factory boot configuration pin (FAB) Pull-down during reset determines boot source; absence of external pull-up forces flash execution - critical for fail-safe boot.
PG[12] / PG[13] General-purpose I/O with WKPU wakeup capability Configurable as interrupt sources for low-power standby exit; used for door latch or seat position sensing in body ECUs.

Key Features

Feature Design Value
Boot Assist Module (BAM) Enables flash programming over CAN or SCI without external debugger; reduces manufacturing test complexity and field update overhead.
Cross Trigger Unit (CTU) Synchronizes ADC conversions with eMIOS timer events; eliminates software polling latency for motor current sampling in EPS systems.
eMIOS Timer Subsystem 64-channel 16-bit modular I/O system supporting PWM, input capture, and OPWM with dead-time insertion; drives HVAC blower and lighting dimming.
Memory Protection Unit (MPU) 8-region descriptor MPU with 32-byte granularity; isolates AUTOSAR BSW, RTE, and application SWCs to meet ASIL-B functional safety requirements.
Nexus 2+ Debug Interface IEEE-ISTO 5001-2003 Class Two Plus compliance; enables real-time trace, non-intrusive breakpoints, and calibration during vehicle integration testing.

Applications

Body Control Module (BCM) Electric Power Steering (EPS)

Use Scenario: Centralized control of lighting, wipers, door locks, and window lifts in modern vehicle architectures.

IC Role / Device Role / Timing Role: Main application MCU executing AUTOSAR-compliant BSW and application SWCs; manages LINFlex networks for slave nodes and FlexCAN for gateway communication.

Use Value: 10 × LINFlex interfaces eliminate external LIN transceivers; 96 KB SRAM accommodates multi-threaded diagnostics and OTA update staging.

Use Scenario: Real-time torque assist calculation and motor phase control in column-assist EPS systems.

IC Role / Device Role / Timing Role: Safety-critical controller running ASIL-B software; uses eMIOS for precise PWM generation and CTU for synchronized current-sense ADC sampling.

Use Value: Dual ADCs (10-bit + 12-bit) enable simultaneous high-speed motor current and low-noise temperature monitoring without multiplexing delay.

Climate Control Unit (HVAC) Seat Control Module

Use Scenario: Closed-loop control of blower speed, air mix door actuation, and refrigerant pressure monitoring.

IC Role / Device Role / Timing Role: Dedicated HVAC MCU managing 64 eMIOS channels for PWM fan drivers and input capture for potentiometer feedback.

Use Value: 6 × DSPI interfaces support daisy-chained temperature sensors and EEPROMs; FMPLL reduces conducted EMI near sensitive cabin audio circuits.

Use Scenario: Position sensing, heating element control, and memory seat profile storage in premium vehicle seating systems.

IC Role / Device Role / Timing Role: Local node MCU interfacing with LINFlex slaves (seat motors) and FlexCAN for driver profile synchronization with central gateway.

Use Value: 149 total GPIOs (package-dependent) allow direct connection to 6× seat position sensors, 4× heating zones, and EEPROM backup storage.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPC5606BK0MLU6R 1 MB code flash, 80 KB SRAM, 5 × FlexCAN, no 12-bit ADC; same e200z0h core and pin-compatible 144 LQFP package. Targeted at cost-optimized BCMs with lower memory and peripheral requirements; lacks dual ADC precision for EPS current sensing. Select when application firmware size stays below 1 MB and 12-bit ADC resolution is unnecessary.
SPC5607BK0MLU6 Identical silicon and features but shipped in tape-and-reel (no 'R' suffix); same 144 LQFP package and electrical specs. No functional difference; differs only in packaging format (reel vs. tray) and moisture sensitivity level (MSL3 vs MSL3). Choose SPC5607BK0MLU6R for automated SMT line compatibility; SPC5607BK0MLU6 suits manual prototyping or low-volume builds.

Compared with MPC5606BK0MLU6R, SPC5607BK0MLU6R provides 500 KB more flash and 16 KB more SRAM for complex AUTOSAR stacks, plus a dedicated 12-bit ADC channel set - making it essential for ASIL-B EPS or HVAC systems requiring sensor redundancy and calibration storage.

Availability

SPC5607BK0MLU6R is available at Aetrix Electronics and suitable for automotive body electronics, electric power steering, climate control units, and seat control modules requiring stable component supply across extended product lifecycles.

Supply support for SPC5607BK0MLU6R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and ASIL-certified microcontrollers.

The MPC5607B family - including SPC5607BK0MLU6R - was designed specifically for next-generation automotive body electronics and chassis control units, emphasizing real-time performance, mixed-signal integration, and robustness in harsh vehicle environments.

FAQ

What is the maximum junction temperature rating for SPC5607BK0MLU6R?

The SPC5607BK0MLU6R is rated for operation up to 125°C junction temperature, validated per NXP's recommended operating conditions in MPC5607B Rev. 10. This enables deployment in under-hood locations such as engine bay-mounted body control modules where ambient temperatures exceed 105°C. Thermal derating curves and package-specific θJA values are provided in Section 4.5 of the datasheet.

Does SPC5607BK0MLU6R support AUTOSAR 4.x compliance out of the box?

SPC5607BK0MLU6R supports AUTOSAR 4.x through NXP's SPC5 Studio toolchain and MCAL drivers, which provide certified BSW modules for CAN, LIN, SPI, ADC, and GPT. While the hardware itself does not "run AUTOSAR," its eMIOS timers, FlexCAN buffers, and MPU configuration align with AUTOSAR OS and ECU abstraction layer requirements for ASIL-B implementations.

How many CAN FD channels does SPC5607BK0MLU6R support?

SPC5607BK0MLU6R supports six FlexCAN modules compliant with ISO 11898-1 (Classical CAN only), not CAN FD. It lacks the CAN FD protocol stack hardware acceleration and bit-rate switching logic required for CAN FD operation. For CAN FD applications, engineers should consider NXP's S32K1xx or S32K3xx families instead.

Can SPC5607BK0MLU6R operate without an external crystal?

Yes - SPC5607BK0MLU6R can operate using its internal 16 MHz fast RC oscillator (FIRC) or 128 kHz slow RC oscillator (SIRC), eliminating the need for external crystals in cost-sensitive or space-constrained designs. However, for time-critical functions like RTC or CAN bit timing, an external 32 kHz crystal or 4–16 MHz crystal is required to meet accuracy specifications.

What debug interface does SPC5607BK0MLU6R use, and is JTAG supported?

SPC5607BK0MLU6R implements both Nexus 2+ (IEEE-ISTO 5001-2003 Class Two Plus) and standard JTAG (IEEE 1149.1) interfaces. Nexus 2+ provides real-time trace and advanced breakpoint capabilities for production validation, while JTAG supports boundary scan testing and basic programming. Both interfaces share physical pins (TCK/TMS/TDI/TDO/TRST), with mode selection controlled by boot configuration.

SPC5607BK0MLU6R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
176-LQFP
Series:
MPC56xx Qorivva
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
64MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
149
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
96K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 29x10b, 5x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SPC5607BK0MLU6R FAQ

1.How can I place an order for SPC5607BK0MLU6R through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC5607BK0MLU6R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC5607BK0MLU6R reliable?

The price and inventory of SPC5607BK0MLU6R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5607BK0MLU6R is usually 5 days.

3.What payment methods are accepted for SPC5607BK0MLU6R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5607BK0MLU6R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC5607BK0MLU6R?

SPC5607BK0MLU6R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC5607BK0MLU6R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC5607BK0MLU6R?

For technical support, including SPC5607BK0MLU6R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5607BK0MLU6R requirements.

6.How does Aetrix verify that SPC5607BK0MLU6R is sourced from the original manufacturer or authorized distributors?

All SPC5607BK0MLU6R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5607BK0MLU6R meets industry standards.

7.What is the process for return or replacement of SPC5607BK0MLU6R?

All SPC5607BK0MLU6R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5607BK0MLU6R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC5607BK0MLU6R part is unused and in its original packaging.

Return procedure for SPC5607BK0MLU6R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SPC5607BK0MLU6R Tags

  • SPC5607BK0MLU6R
  • SPC5607BK0MLU6R PDF
  • SPC5607BK0MLU6R Datasheet
  • SPC5607BK0MLU6R Specifications
  • SPC5607BK0MLU6R Images
  • NXP Semiconductors
  • NXP Semiconductors SPC5607BK0MLU6R
  • Buy SPC5607BK0MLU6R
  • SPC5607BK0MLU6R Price
  • SPC5607BK0MLU6R Distributor
  • SPC5607BK0MLU6R Supplier
  • SPC5607BK0MLU6R Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER