My Inquiry
My Account
NXP Semiconductors SPC5607BK0VLL6R
- Part No.:
- SPC5607BK0VLL6R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
SPC5607BK0VLL6R.pdf
- Description:
- IC MCU 32BIT 1.5MB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,654
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC5607BK0VLL6R from NXP Semiconductors (formerly Freescale) is a 32-bit automotive MCU based on the e200z0 Power Architecture core, operating up to 64 MHz, featuring 1.5 MB Flash, 96 KB RAM, 6 FlexCAN interfaces, 10 LINFlex modules, and dual ADCs (12-bit/16-ch + 10-bit/32-ch), deployed in central body controllers and gateway systems.
For engineers reviewing the SPC5607BK0VLL6R datasheet, SPC5607BK0VLL6R pinout, SPC5607BK0VLL6R application, or SPC5607BK0VLL6R equivalent, key selection criteria include CAN/LIN channel count, Flash/RAM sizing for AUTOSAR-compliant firmware, temperature grade (–40 °C to +125 °C), LQFP-176 package compatibility, and eMIOS200 timer flexibility for PWM-synchronized diagnostics.
Technical Context
The SPC5607BK0VLL6R integrates an e200z0 core with Variable Length Encoding (VLE) support, FMPLL clock generation, and memory protection unit (MPU) for ASIL-B–capable partitioning. It employs a crossbar switch (XBAR) to arbitrate access between CPU, DMA, and peripherals including FlexCAN, LINFlex, and eMIOS200.
Its analog subsystem includes two independent ADCs-12-bit with 16 channels and 10-bit with 32 channels-synchronized via CTU to eMIOS200 PWM outputs. The cross-triggering unit enables deterministic timing between analog sampling and PWM edge events for motor control and diagnostic applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0 Power Architecture core with VLE support, enabling compact code footprint and deterministic real-time execution. |
| Max Clock Speed | 64 MHz - supports real-time control loops with sub-10 µs interrupt latency for body domain functions. |
| Flash Memory | 1.5 MB main Flash + 64 KB data Flash with ECC - enables dual-bank operation and safe firmware updates in automotive ECUs. |
| RAM | 96 KB SRAM with ECC - sufficient for AUTOSAR OS, BSW stacks, and application task buffers at extended temperature. |
| CAN Interfaces | 6 FlexCAN modules with FIFO/mailbox support - allows concurrent handling of high-priority event-driven and low-latency periodic traffic in gateways. |
| LIN Interfaces | 10 LINFlex modules with hardware protocol handling - offloads CPU from LIN scheduling, reducing jitter and enabling <100 µs response time per node. |
| ADC System | Dual ADC: 12-bit/16-ch + 10-bit/32-ch, CTU-synchronized - supports simultaneous sampling of sensor arrays (e.g., HVAC, lighting, door position) with correlated timing. |
| Timer Subsystem | eMIOS200 with 64 channels - provides flexible input capture, output compare, and phase-shifted PWM for EMI reduction in motor drivers and LED dimming. |
Pinout & Package
SPC5607BK0VLL6R is housed in a 176-pin LQFP (Low-Profile Quad Flat Package) with 0.5 mm pitch, thermally enhanced for under-hood automotive environments. Pin assignment follows the MPC560xB/C/D family standard layout documented in MPC560XBFAMFS REV 6.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_HV | High-voltage supply rail | Provides regulated 5 V to internal voltage regulators; requires external decoupling for EMC compliance in 12 V vehicle systems. |
| VDD_LV | Core logic supply | Supplies 1.2 V to e200z0 core and digital peripherals; monitored by internal POR and BOR circuits. |
| XTAL_IN / XTAL_OUT | Crystal oscillator interface | Supports 4–40 MHz crystal; enables precise clock source for FMPLL with ±50 ppm stability over –40 °C to +125 °C. |
| CAN0_TX / CAN0_RX | FlexCAN Channel 0 differential I/O | CMOS-level signals requiring external transceiver (e.g., TJA1042) for ISO 11898-2 physical layer compliance. |
| LIN0_TX / LIN0_RX | LINFlex Channel 0 single-wire I/O | Drives LIN bus directly via internal pull-up; supports LIN 2.1/2.2 with automatic checksum and header detection. |
| ADC0_SE0–ADC0_SE15 | Analog input channels (12-bit) | Accept 0–5 V inputs; internally multiplexed to 12-bit SAR ADC with programmable sample-and-hold timing. |
| EMIOS0_CH0–CH63 | eMIOS200 channel I/O | Configurable as input capture, output compare, or PWM; supports dead-time insertion and complementary output for half-bridge control. |
Key Features
| Feature | Design Value |
|---|---|
| FlexCAN with FIFO and mailbox modes | Enables scalable CAN message filtering and prioritization without CPU polling-critical for multi-bus gateways managing Body, Chassis, and Infotainment traffic. |
| LINFlex hardware protocol engine | Reduces CPU load by >70% during LIN frame transmission/reception, allowing same-core resources to handle higher-layer diagnostics (UDS, UDS over CAN). |
| eMIOS200 with phase-shifted PWM | Generates interleaved PWM signals across multiple channels to lower conducted EMI peaks by spreading spectral energy-validated per CISPR 25 Class 5. |
| Cross-triggering unit (CTU) | Synchronizes ADC conversions to PWM edges with ≤1 cycle jitter, enabling accurate current sensing in BLDC motor drivers and adaptive lighting control. |
| Scalable e200z0 core with VLE | Delivers 1.2 DMIPS/MHz while reducing code size by ~30% vs. legacy Power Architecture, easing migration from MPC5606B/MPC5605B in software-reuse programs. |
Applications
| Central Body Controller | Gateway Controller |
|---|---|
Use Scenario: Manages power distribution, lighting, wipers, and door locks in modern vehicle architectures with centralized domain control. IC Role / Device Role / Timing Role: Primary host MCU executing body domain software stack, coordinating LIN slaves and CAN subnets via integrated FlexCAN and LINFlex. Use Value: 1.5 MB Flash accommodates AUTOSAR BSW + complex application logic; 6 CAN interfaces enable direct connection to chassis, infotainment, and ADAS subnets without external bridge ICs. | Use Scenario: Bridges communication between low-speed body networks (LIN, UART-based sensors) and high-speed CAN FD or Ethernet backbones in zonal architectures. IC Role / Device Role / Timing Role: Protocol translation and message routing hub with real-time arbitration, leveraging FlexCAN FIFOs for prioritized traffic and LINFlex auto-scheduling for slave node management. Use Value: 10 LINFlex modules support full vehicle-wide LIN topology (e.g., 8 doors + trunk + sunroof); 6 CAN channels allow dual-CAN backbone redundancy plus dedicated diagnostic port. |
| Comfort Control Module | Seat & Mirror Control Unit |
Use Scenario: Controls HVAC actuators, seat position memory, ambient lighting, and climate sensors in premium interior domains. IC Role / Device Role / Timing Role: Sensor fusion and actuator driver MCU using dual ADCs for simultaneous temperature/humidity/position feedback and eMIOS200 for PWM-controlled motor drives. Use Value: CTU-synchronized ADC sampling ensures phase-aligned current/voltage measurements for brushless fan motors, improving efficiency and acoustic noise performance. | Use Scenario: Drives multi-axis seat motors, mirror positioning, and heating elements with closed-loop feedback and thermal protection. IC Role / Device Role / Timing Role: Precision motion controller using eMIOS200 PWM with dead-time insertion and ADC0/ADC1 for Hall-effect and thermistor monitoring. Use Value: Phase-shifted PWM reduces EMI in proximity to RF-sensitive modules (e.g., keyless entry receivers); 96 KB RAM supports real-time PID tuning tables and fault history logging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive body MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5606BK0VLL6R | 1 MB Flash, 80 KB RAM, 6 CAN, up to 8 LINFlex, same 176 LQFP package and 64 MHz speed. | Lower Flash/RAM margin for AUTOSAR Classic + complex application layers; suitable for cost-optimized body nodes without gateway routing. | Select when BOM cost sensitivity outweighs future software scalability needs and no LIN expansion beyond 8 channels is required. |
| MPC5605BK0VLL6R | 768 KB Flash, 64 KB RAM, 6 CAN, up to 8 LINFlex, same 176 LQFP package and 64 MHz speed. | Reduced memory headroom for multi-layer diagnostics and OTA update staging; limited to non-gateway body controllers with ≤6 LIN nodes. | Choose for entry-level central body modules where feature set aligns with current requirements and no near-term software growth is planned. |
Compared with MPC5606BK0VLL6R and MPC5605BK0VLL6R, the SPC5607BK0VLL6R provides 50% more Flash and 20–50% more RAM-enabling robust AUTOSAR OS partitioning, dual-bank firmware updates, and integration of advanced diagnostics (e.g., UDS routine controls, secure boot), making it the preferred choice for gateway and high-feature body ECUs.
Availability
SPC5607BK0VLL6R is available at Aetrix Electronics and suitable for automotive body control units, gateway modules, comfort electronics, and seat/mirror control systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for SPC5607BK0VLL6R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in Power Architecture and automotive MCU innovation.
The Qorivva MPC560xB/C/D product line was engineered specifically for ASIL-B–compliant automotive body electronics, emphasizing functional safety, peripheral integration (CAN/LIN/ADC/timers), and toolchain continuity across scalable memory and I/O configurations.
FAQ
What is the operating temperature range for SPC5607BK0VLL6R?
The SPC5607BK0VLL6R is qualified for operation from –40 °C to +125 °C, meeting AEC-Q100 Grade 1 requirements. This range supports placement in demanding under-hood and cabin locations, including junction boxes and gateway modules exposed to thermal cycling and vibration. The device's internal thermal monitoring and voltage regulation ensure reliable execution of safety-critical body control tasks across the full range. SPC5607BK0VLL6R maintains timing accuracy and Flash integrity without derating.
Does SPC5607BK0VLL6R support AUTOSAR Classic?
Yes, SPC5607BK0VLL6R is fully supported by AUTOSAR Classic R4.x through NXP's S32K-compatible MCAL drivers and configuration tools. Its memory layout (1.5 MB Flash with ECC, 96 KB RAM), interrupt latency (<1 µs), and peripheral abstraction (FlexCAN, LINFlex, eMIOS200) meet AUTOSAR BSW requirements. SPC5607BK0VLL6R has been validated in production body ECUs running AUTOSAR OS with multiple COM modules and DCM for UDS diagnostics.
What package type and pin count does SPC5607BK0VLL6R use?
SPC5607BK0VLL6R uses a 176-pin LQFP (Low-Profile Quad Flat Package) with 0.5 mm pitch and exposed thermal pad. This package is mechanically and electrically compatible with other MPC560xB/C/D variants in the same pinout family (e.g., MPC5606B, MPC5605B), enabling PCB reuse across platform variants. SPC5607BK0VLL6R's pin mapping is defined in the MPC560XBFAMFS REV 6 reference manual and matches the 176 LQFP daughter card XDC560B176SB15M.
How many CAN and LIN interfaces does SPC5607BK0VLL6R integrate?
SPC5607BK0VLL6R integrates six FlexCAN modules and ten LINFlex modules. All six CAN interfaces support ISO 11898-1 with configurable bit rates up to 1 Mbps and built-in error counters. All ten LINFlex modules implement LIN 2.1/2.2 with hardware header detection, checksum calculation, and sleep/wake handling-no CPU intervention required. This configuration makes SPC5607BK0VLL6R uniquely suited for high-channel-count gateways and distributed body networks.
Is SPC5607BK0VLL6R pin-compatible with earlier MPC560x devices?
SPC5607BK0VLL6R is pin-compatible with other MPC560xB/C/D family members in the 176 LQFP package, including MPC5606BK0VLL6R and MPC5605BK0VLL6R. Signal assignments, power domains, and peripheral pin mappings are identical across these variants per the MPC560XBFAMFS specification. This allows drop-in replacement in existing designs when upgrading Flash/RAM capacity or adding LIN channels, provided software is updated to leverage expanded resources. SPC5607BK0VLL6R retains full backward compatibility at the hardware level.
SPC5607BK0VLL6R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LQFP
- Series:
- MPC56xx Qorivva
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 64MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 77
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 7x10b, 5x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5607BK0VLL6R FAQ
1.How can I place an order for SPC5607BK0VLL6R through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5607BK0VLL6R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5607BK0VLL6R reliable?
The price and inventory of SPC5607BK0VLL6R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5607BK0VLL6R is usually 5 days.
3.What payment methods are accepted for SPC5607BK0VLL6R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5607BK0VLL6R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5607BK0VLL6R?
SPC5607BK0VLL6R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5607BK0VLL6R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5607BK0VLL6R?
For technical support, including SPC5607BK0VLL6R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5607BK0VLL6R requirements.
6.How does Aetrix verify that SPC5607BK0VLL6R is sourced from the original manufacturer or authorized distributors?
All SPC5607BK0VLL6R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5607BK0VLL6R meets industry standards.
7.What is the process for return or replacement of SPC5607BK0VLL6R?
All SPC5607BK0VLL6R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5607BK0VLL6R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5607BK0VLL6R part is unused and in its original packaging.
Return procedure for SPC5607BK0VLL6R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC5607BK0VLL6R Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
