Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors SPC5607BK0VLQ6R

Part No.:
SPC5607BK0VLQ6R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixSPC5607BK0VLQ6R.pdf
Description:
IC MCU 32BIT 1.5MB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,982

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

SPC5607BK0VLQ6R from NXP Semiconductors (formerly Freescale) is a 32-bit automotive MCU based on the e200z0 Power Architecture core, operating up to 64 MHz, featuring 1.5 MB Flash, 96 KB RAM, 6 CAN interfaces, 10 LINFlex modules, and dual ADCs (12-bit/16-ch + 10-bit/32-ch), deployed in central body controllers and gateway systems.

For engineers reviewing the SPC5607BK0VLQ6R datasheet, SPC5607BK0VLQ6R pinout, SPC5607BK0VLQ6R application, or SPC5607BK0VLQ6R equivalent, key selection criteria include CAN/LIN channel count, Flash/RAM sizing for AUTOSAR-compliant firmware, LQFP-176 thermal and routing constraints, and eMIOS200 timer flexibility for PWM-synchronized diagnostics.

Technical Context

The SPC5607BK0VLQ6R integrates an e200z0 core with Variable Length Encoding (VLE) support, FMPLL clock generation, and memory protection unit (MPU) for ASIL-B–capable partitioning. It employs a crossbar switch (XBAR) to arbitrate access between Flash, SRAM, and peripherals including FlexCAN, LINFlex, and eMIOS200.

Its analog subsystem combines two independent ADCs-12-bit/16-channel and 10-bit/32-channel-with CTU-triggered sampling, while the eMIOS200 provides 64 channels of input capture, output compare, and PWM with shifted-phase capability for EMI reduction.

Key Specifications

ParameterValue and Actual Design Meaning
CPU Coree200z0 Power Architecture core with VLE support, enabling compact code density and deterministic real-time execution.
Max Clock Speed64 MHz - defines worst-case instruction throughput and peripheral timing budgets for CAN FD readiness and LIN scheduling.
Flash Memory1.5 MB main Flash + 64 KB data Flash with ECC - supports dual-bank operation, OTA update partitioning, and ASIL-B fault containment.
RAM96 KB SRAM with ECC - sufficient for AUTOSAR OS stacks, CAN message buffers, and diagnostic data logging.
CAN Interfaces6 FlexCAN modules with FIFO/mailbox support - enables multi-bus gateway routing (e.g., powertrain ↔ body ↔ infotainment) without CPU polling overhead.
LIN Interfaces10 LINFlex modules with hardware protocol handling - offloads UART-based LIN frame assembly/disassembly, reducing CPU load below 5% per node.
ADC SystemDual ADC: 12-bit/16-ch + 10-bit/32-ch, CTU-synchronized - allows simultaneous sampling of critical sensors (e.g., battery voltage + cabin temp) with sub-microsecond phase alignment.
Timer SubsystemeMIOS200 with 64 channels - supports complex PWM generation (e.g., LED dimming + motor control), input capture for wheel speed, and pulse-width measurement for throttle position.

Pinout & Package

SPC5607BK0VLQ6R is housed in a 176-pin LQFP package (16 × 16 mm, 0.4 mm pitch), RoHS-compliant, with exposed thermal pad for enhanced heat dissipation in under-hood environments.

Pin/TerminalCircuit RoleDesign Meaning
VDD_MAIN / VDD_IOCore & I/O supply railsSeparate 3.3 V domains enable independent power sequencing and noise isolation between analog/digital sections.
VDDA / VREFH / VREFLAnalog supply & referenceDedicated 5 V analog rail and precision reference inputs ensure ±1 LSB linearity for safety-critical sensor readings.
CAN0_TX / CAN0_RXController Area Network channel 0 differential pairDirect connection to external CAN transceiver; supports ISO 11898-2 compliant signaling up to 1 Mbps.
LIN0_TX / LIN0_RXLINFlex channel 0 single-wire interfaceHardware-managed LIN physical layer signaling (UART + slew-rate control) compliant with LIN 2.2A specification.
ADC0_SE0–ADC0_SE15Analog input channels (12-bit ADC)Supports multiplexed sampling of up to 16 sensors (e.g., HVAC thermistors, door lock current sense) with programmable gain.
EMIOS0_CH0–EMIOS0_CH63eMIOS200 timer channelsConfigurable as input capture (wheel speed), output compare (ignition timing), or PWM (headlight dimming) with cross-triggering to ADC.

Key Features

FeatureDesign Value
FlexCAN with FIFO + mailbox modeEnables concurrent handling of high-priority event-driven messages (e.g., crash detection) and low-priority periodic updates (e.g., window position) without CPU intervention.
LINFlex hardware protocol engineEliminates software UART overhead, guarantees <10 µs jitter on LIN response timing, and supports auto-baud detection for legacy slave compatibility.
eMIOS200 with PWM phase shiftingReduces conducted EMI by distributing switching harmonics across frequency spectrum - critical for CISPR 25 Class 3 compliance in body control modules.
Cross Trigger Unit (CTU)Synchronizes PWM edge transitions with ADC sampling windows, enabling precise duty-cycle–dependent current/voltage measurements for motor diagnostics.
Memory Protection Unit (MPU)Enforces spatial isolation between AUTOSAR OS, BSW, and application SWCs, satisfying ISO 26262 ASIL-B memory safety requirements.

Applications

Central Body ControllerGateway Controller

Use Scenario: Manages lighting, wipers, door locks, and seat controls in modern vehicle architectures.

IC Role / Device Role / Timing Role: Primary host MCU executing body domain ECU software stack with real-time task scheduling and CAN/LIN bridging.

Use Value: 10 LINFlex modules allow direct control of >30 LIN slaves (e.g., mirror motors, seat position sensors), eliminating need for secondary LIN masters.

Use Scenario: Routes messages between powertrain CAN, body CAN, and infotainment LIN networks in zonal architecture.

IC Role / Device Role / Timing Role: Multi-CAN gateway processor with hardware-accelerated message filtering and store-and-forward logic.

Use Value: Six independent FlexCAN modules support full-duplex routing across three isolated CAN buses at 500 kbps, with <50 µs latency per frame.

Comfort Control ModuleRoof Module Controller

Use Scenario: Controls sunroof, panoramic roof, ambient lighting, and HVAC actuators in premium vehicles.

IC Role / Device Role / Timing Role: High-integration MCU managing PWM-driven actuators, ADC-monitored temperature/humidity, and LIN-connected sensors.

Use Value: eMIOS200's 64-channel flexibility enables simultaneous control of 8+ PWM outputs (e.g., RGB ambient LEDs) with synchronized fade profiles.

Use Scenario: Integrates rain/light sensors, interior camera, and rearview mirror dimming in overhead console.

IC Role / Device Role / Timing Role: Sensor fusion hub with time-aligned ADC sampling and LIN communication to body domain master.

Use Value: Dual ADC subsystem captures correlated light intensity and rain droplet capacitance signals within 1 µs skew, enabling adaptive headlight activation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive body controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MPC5606BK0VLQ6R1 MB Flash, 80 KB RAM, 8 LINFlex, no 12-bit ADC - lacks dual-ADC resolution and 200 KB Flash margin.Suitable for cost-optimized gateways with fewer LIN nodes and no high-precision analog sensing.Select when Flash/RAM headroom and 12-bit ADC are non-critical; retains same LQFP-176 footprint and CAN count.
SPC560B50L5CEFBRNXP SPC560B series, 1 MB Flash, 64 KB RAM, 6 CAN, 8 LINFlex, 12-bit/16-ch ADC only - no 10-bit/32-ch auxiliary ADC.Targeted at mid-tier body ECUs where extended LIN count and dual-ADC channel depth are not required.Choose for simplified toolchain migration from MPC560xB family; shares identical peripheral register map but reduced analog subsystem.

Compared with MPC5606BK0VLQ6R and SPC560B50L5CEFBR, the SPC5607BK0VLQ6R delivers higher Flash/RAM headroom for AUTOSAR MCAL expansion, dual-ADC precision for sensor fusion, and 10 LINFlex channels for scalable body network growth - making it optimal for next-generation central body and gateway platforms requiring long-term software maintainability.

Availability

SPC5607BK0VLQ6R is available at Aetrix Electronics and suitable for automotive body electronics, gateway controllers, and comfort control modules requiring stable component supply across extended vehicle lifecycles.

Supply support for SPC5607BK0VLQ6R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive microcontrollers and radar technology.

The Qorivva MPC560xB/C/D product line was designed specifically for ASIL-B–compliant automotive body and gateway ECUs, emphasizing CAN/LIN integration, functional safety features, and scalable memory/peripheral configurations.

FAQ

What is the maximum operating temperature range for the SPC5607BK0VLQ6R?

The SPC5607BK0VLQ6R is rated for operation from –40 °C to +125 °C, meeting AEC-Q100 Grade 1 requirements for under-hood and cabin-mounted automotive electronic control units. This range ensures reliable performance in extreme environmental conditions encountered in body control and gateway applications. The device includes on-chip temperature monitoring and thermal shutdown circuitry to protect against overheating during sustained high-load operation. SPC5607BK0VLQ6R maintains full specification compliance across this entire junction temperature range.

Does the SPC5607BK0VLQ6R support AUTOSAR-compliant software stacks?

Yes, the SPC5607BK0VLQ6R supports AUTOSAR 4.x-compliant MCAL drivers and OS configurations through NXP's S32DS IDE and configuration tools. Its MPU, ECC-protected memories, and deterministic e200z0 core meet ASIL-B requirements for memory protection and fault containment. SPC5607BK0VLQ6R has validated integration with leading AUTOSAR vendors including ETAS, Vector, and Elektrobit. Full MCAL coverage includes FlexCAN, LINFlex, ADC, eMIOS, and Flash EEPROM emulation layers.

How many CAN interfaces does the SPC5607BK0VLQ6R support, and what protocols are implemented?

The SPC5607BK0VLQ6R integrates six independent FlexCAN modules supporting ISO 11898-1 Classical CAN at data rates up to 1 Mbps. Each module implements full CAN 2.0B protocol handling, including identifier masking, FIFO/mailbox buffering, and error confinement. SPC5607BK0VLQ6R does not support CAN FD natively; however, its flexible message RAM and interrupt architecture allow software-based CAN FD frame segmentation for limited backward-compatible use cases.

Is the SPC5607BK0VLQ6R pin-compatible with other MPC560xB/C/D family members?

SPC5607BK0VLQ6R uses a 176-pin LQFP package that matches the footprint of MPC5606BK0VLQ6R and MPC5605BK0VLQ6R in the same package variant, enabling PCB reuse across performance tiers. However, pin functions differ for certain peripherals (e.g., ADC channel mapping, eMIOS channel assignments), so schematic review and signal validation are required before drop-in replacement. SPC5607BK0VLQ6R is not pin-compatible with 100- or 144-pin variants like MPC5604B or MPC5602C.

What development tools are recommended for SPC5607BK0VLQ6R firmware development?

NXP recommends the S32 Design Studio IDE with S32DS for Power Architecture, paired with the MPC5607B Evaluation Board (XDC560B176SB15M) and JDP Motherboard (XPC56XXMB2). Debugging is supported via JTAG/Nexus interface using P&E Multilink or Lauterbach TRACE32. SPC5607BK0VLQ6R firmware development benefits from NXP's Qorivva Peripheral Driver Library and AUTOSAR MCAL packages, all accessible through the NXP Developer Resources portal.

SPC5607BK0VLQ6R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
144-LQFP
Series:
MPC56xx Qorivva
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
64MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
121
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
96K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 15x10b, 5x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SPC5607BK0VLQ6R FAQ

1.How can I place an order for SPC5607BK0VLQ6R through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC5607BK0VLQ6R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC5607BK0VLQ6R reliable?

The price and inventory of SPC5607BK0VLQ6R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5607BK0VLQ6R is usually 5 days.

3.What payment methods are accepted for SPC5607BK0VLQ6R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5607BK0VLQ6R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC5607BK0VLQ6R?

SPC5607BK0VLQ6R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC5607BK0VLQ6R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC5607BK0VLQ6R?

For technical support, including SPC5607BK0VLQ6R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5607BK0VLQ6R requirements.

6.How does Aetrix verify that SPC5607BK0VLQ6R is sourced from the original manufacturer or authorized distributors?

All SPC5607BK0VLQ6R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5607BK0VLQ6R meets industry standards.

7.What is the process for return or replacement of SPC5607BK0VLQ6R?

All SPC5607BK0VLQ6R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5607BK0VLQ6R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC5607BK0VLQ6R part is unused and in its original packaging.

Return procedure for SPC5607BK0VLQ6R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SPC5607BK0VLQ6R Tags

  • SPC5607BK0VLQ6R
  • SPC5607BK0VLQ6R PDF
  • SPC5607BK0VLQ6R Datasheet
  • SPC5607BK0VLQ6R Specifications
  • SPC5607BK0VLQ6R Images
  • NXP Semiconductors
  • NXP Semiconductors SPC5607BK0VLQ6R
  • Buy SPC5607BK0VLQ6R
  • SPC5607BK0VLQ6R Price
  • SPC5607BK0VLQ6R Distributor
  • SPC5607BK0VLQ6R Supplier
  • SPC5607BK0VLQ6R Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER