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NXP Semiconductors SPC5607BK0VLU6R

Part No.:
SPC5607BK0VLU6R
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
176-LQFP
Datasheet:
AetrixSPC5607BK0VLU6R.pdf
Description:
IC MCU 32BIT 1.5MB FLASH 176LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,871

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Product details

Overview

SPC5607BK0VLU6R from NXP Semiconductors (formerly Freescale) is a 32-bit automotive MCU in the Qorivva MPC560xB/C/D family, featuring an e200z0 Power Architecture core, 1.5 MB Flash, 96 KB RAM, 6 CAN interfaces, 10 LINFlex modules, and dual ADCs (12-bit/16-ch + 10-bit/32-ch), deployed in central body controllers and gateway systems.

For engineers reviewing the SPC5607BK0VLU6R datasheet, SPC5607BK0VLU6R pinout, SPC5607BK0VLU6R application, or SPC5607BK0VLU6R equivalent, key selection factors include CAN/LIN channel count, Flash/RAM sizing for AUTOSAR-compliant firmware, LQFP-176 thermal performance, and eMIOS200 timer flexibility for PWM-synchronized diagnostics.

Technical Context

The SPC5607BK0VLU6R implements a scalable e200z0 core with Variable Length Encoding (VLE) support, integrated FMPLL clock generation, and memory protection unit (MPU) for ASIL-B–capable partitioning. It integrates FlexCAN with FIFO/mailbox buffering and LINFlex with hardware message scheduling to reduce CPU intervention.

Cross-triggering between eMIOS200 PWM outputs and ADC conversions enables precise timing-critical diagnostics. The device supports up to 64 MHz operation across –40 °C to +125 °C, with ECC-protected Flash and SRAM for functional safety compliance.

Key Specifications

ParameterValue and Actual Design Meaning
Core Architecturee200z0 Power Architecture with VLE instruction set, enabling compact code footprint and deterministic real-time execution.
Flash Memory1.5 MB on-chip Flash with ECC, supporting robust firmware storage and over-the-air update resilience in automotive ECUs.
RAM96 KB SRAM with ECC, sufficient for AUTOSAR OS stacks, diagnostic buffers, and runtime data structures.
CAN Interfaces6 FlexCAN modules, each supporting ISO 11898-1, enabling multi-bus gateway routing and redundancy in body domain networks.
LIN Interfaces10 LINFlex modules with hardware protocol handling, allowing concurrent management of LIN clusters without CPU polling overhead.
ADC SystemDual ADC: 12-bit/16-channel + 10-bit/32-channel, supporting simultaneous sampling for sensor fusion and battery monitoring.
Package176-pin LQFP (24 × 24 mm, 0.5 mm pitch), compatible with standard automotive PCB assembly and thermal dissipation requirements.

Pinout & Package

SPC5607BK0VLU6R is housed in a 176-pin Low-Profile Quad Flat Package (LQFP) with exposed thermal pad, rated for automotive temperature range (–40 °C to +125 °C) and qualified per AEC-Q100 Grade 1.

Pin/TerminalCircuit RoleDesign Meaning
VDD_AAnalog power supplyProvides regulated 5 V or 3.3 V to analog peripherals including ADC and LIN transceivers.
VDD_IOI/O power supplySupplies configurable I/O voltage (3.3 V or 5 V) for interface compatibility with legacy automotive sensors and actuators.
RESET_INExternal reset inputAccepts active-low asynchronous reset signal from system supervisor IC for safe ECU recovery.
CAN0_TX / CAN0_RXFlexCAN0 differential pairDirect connection to external CAN transceiver for high-speed (up to 1 Mbps) bus communication.
LIN0_TX / LIN0_RXLINFlex0 UART interfaceSingle-wire physical layer interface supporting LIN 2.2A/B protocol with automatic checksum and scheduling.
ADC0_IN0–ADC0_IN15Analog input channels16 dedicated pins for 12-bit ADC inputs, supporting multiplexed sampling of temperature, voltage, and current sensors.

Key Features

FeatureDesign Value
FlexCAN with FIFO/mailbox modeEnables prioritized event-driven CAN traffic handling in gateways, reducing latency for critical messages like door lock status or lighting commands.
LINFlex hardware schedulingOffloads LIN frame generation and response timing from CPU, freeing >15% core bandwidth for application logic in comfort control modules.
eMIOS200 with cross-triggeringSynchronizes PWM edge transitions with ADC sampling windows, enabling accurate motor current measurement and closed-loop control in seat/mirror actuators.
ECC-protected Flash/SRAMSupports single-bit error correction and double-bit error detection, meeting ISO 26262 ASIL-B requirements for memory integrity in body electronics.
Scalable e200z0 coreAllows software reuse across MPC560xB/C/D family, reducing migration effort when upgrading from MPC5606B to SPC5607BK0VLU6R in next-gen platforms.

Applications

Central Body ControllerGateway Controller

Use Scenario: Integrated control of lighting, wipers, HVAC, and door modules in modern vehicle architectures.

IC Role / Device Role / Timing Role: Main host MCU executing body domain software stack with real-time task scheduling and CAN/LIN bridging.

Use Value: 6 CAN + 10 LINFlex interfaces eliminate need for external bridge ICs, reducing BOM cost and board space in centralized body ECUs.

Use Scenario: Routing messages between powertrain, chassis, infotainment, and body networks in multi-domain vehicle architectures.

IC Role / Device Role / Timing Role: High-throughput gateway processor managing protocol translation, filtering, and priority-based forwarding across 6 CAN buses.

Use Value: FlexCAN FIFO architecture ensures low-latency handling of urgent messages (e.g., brake light activation) while mailbox mode manages periodic diagnostics.

Comfort Control ModuleSeat/Mirror Actuator Control

Use Scenario: Managing window lift, sunroof, and seat position memory functions with anti-pinch detection.

IC Role / Device Role / Timing Role: Dedicated comfort MCU coordinating LIN-connected switches/sensors and driving H-bridge drivers via PWM outputs.

Use Value: eMIOS200's shifted PWM output reduces EMI during motor commutation, improving EMC test margin for Class 3 automotive emissions compliance.

Use Scenario: Closed-loop position control of electric seat motors and mirror actuators using hall-effect feedback.

IC Role / Device Role / Timing Role: Real-time controller synchronizing 12-bit ADC sampling of hall sensors with eMIOS200 PWM drive signals.

Use Value: Cross-triggering unit guarantees sub-microsecond alignment between ADC capture and PWM edges, enabling <±0.5° position accuracy.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive body MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MPC5606BK0VLU6R1 MB Flash, 80 KB RAM, 8 LINFlex, no 12-bit ADC - reduced memory and analog capability.Suitable for mid-tier body controllers with fewer LIN nodes and simpler diagnostics.Select when Flash/RAM headroom and dual ADC resolution are not required for target ECU functionality.
SPC5607BK0MLU6RSame core/package/feature set but with 125 °C max junction temperature rating instead of 125 °C ambient; different thermal derating profile.Used in under-hood applications requiring extended junction temperature tolerance.Choose SPC5607BK0VLU6R for cabin-mounted modules where ambient-rated operation suffices and cost optimization is critical.

Compared with MPC5606BK0VLU6R, SPC5607BK0VLU6R delivers higher Flash/RAM and dual ADC resolution for complex AUTOSAR gateways; versus SPC5607BK0MLU6R, it offers identical functionality at lower thermal qualification cost for interior body ECUs.

Availability

SPC5607BK0VLU6R is available at Aetrix Electronics and suitable for central body controllers, gateway controllers, and comfort control modules requiring stable component supply, long-term automotive lifecycle support, and AEC-Q100 Grade 1 qualification.

Supply support for SPC5607BK0VLU6R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and embedded processing.

The Qorivva MPC560xB/C/D product line was designed specifically for automotive body and gateway electronics, emphasizing CAN/LIN integration, real-time determinism, and ASIL-B–ready memory subsystems.

FAQ

What is the maximum operating frequency of the SPC5607BK0VLU6R?

The SPC5607BK0VLU6R operates at up to 64 MHz across its full automotive temperature range (–40 °C to +125 °C). This frequency is sustained using the integrated FMPLL with external crystal or oscillator input, and is validated for timing-critical tasks such as CAN message processing and ADC-synchronized PWM generation in the SPC5607BK0VLU6R.

Does the SPC5607BK0VLU6R support AUTOSAR-compliant software stacks?

Yes, the SPC5607BK0VLU6R supports AUTOSAR 4.x-compliant software stacks through NXP's S32DS IDE and MCAL drivers. Its 1.5 MB ECC Flash, 96 KB ECC SRAM, MPU, and deterministic e200z0 core meet memory, safety, and timing requirements for ASIL-B–compliant ECUs, making the SPC5607BK0VLU6R suitable for production body control modules.

What package type and pin count does the SPC5607BK0VLU6R use?

The SPC5607BK0VLU6R uses a 176-pin LQFP package (24 × 24 mm, 0.5 mm pitch) with exposed thermal pad. This package is standardized across the MPC560xB/C/D family and supports automated optical inspection and reflow soldering in automotive manufacturing, confirming mechanical compatibility for the SPC5607BK0VLU6R.

How many CAN and LIN interfaces does the SPC5607BK0VLU6R integrate?

The SPC5607BK0VLU6R integrates six FlexCAN modules and ten LINFlex modules. Each FlexCAN supports ISO 11898-1 at up to 1 Mbps, and each LINFlex handles full LIN 2.2A/B protocol with hardware scheduling - a configuration confirmed in the MPC560XBFAMFS REV 6 selector guide for the SPC5607BK0VLU6R.

Is the SPC5607BK0VLU6R qualified for automotive use?

Yes, the SPC5607BK0VLU6R is AEC-Q100 Grade 1 qualified (–40 °C to +125 °C ambient), with ECC-protected memories, built-in self-test (BIST) support, and failure-in-time (FIT) rate documentation. These qualifications are specified in NXP's official qualification reports and apply directly to the SPC5607BK0VLU6R device marking.

SPC5607BK0VLU6R Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
176-LQFP
Series:
MPC56xx Qorivva
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
e200z0h
Core Size:
32-Bit Single-Core
Speed:
64MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
149
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
96K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 29x10b, 5x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SPC5607BK0VLU6R FAQ

1.How can I place an order for SPC5607BK0VLU6R through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC5607BK0VLU6R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC5607BK0VLU6R reliable?

The price and inventory of SPC5607BK0VLU6R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5607BK0VLU6R is usually 5 days.

3.What payment methods are accepted for SPC5607BK0VLU6R?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5607BK0VLU6R transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC5607BK0VLU6R?

SPC5607BK0VLU6R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC5607BK0VLU6R order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC5607BK0VLU6R?

For technical support, including SPC5607BK0VLU6R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5607BK0VLU6R requirements.

6.How does Aetrix verify that SPC5607BK0VLU6R is sourced from the original manufacturer or authorized distributors?

All SPC5607BK0VLU6R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5607BK0VLU6R meets industry standards.

7.What is the process for return or replacement of SPC5607BK0VLU6R?

All SPC5607BK0VLU6R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5607BK0VLU6R, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC5607BK0VLU6R part is unused and in its original packaging.

Return procedure for SPC5607BK0VLU6R:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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