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STMicroelectronics SPC560B40L3B4E0X
- Part No.:
- SPC560B40L3B4E0X
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
SPC560B40L3B4E0X.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,109
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Product details
Overview
SPC560B40L3B4E0X from STMicroelectronics is a 32-bit automotive MCU based on the Power Architecture® e200z0h core, operating at 64 MHz with 60 DMIPs performance and Variable Length Encoding (VLE). It integrates 256 KB ECC-protected Code Flash, 64 KB Data Flash, 48 KB SRAM, six FlexCAN 2.0B interfaces, and a dedicated diagnostic module for lighting control in body electronics systems.
For engineers reviewing the SPC560B40L3B4E0X datasheet, SPC560B40L3B4E0X pinout, SPC560B40L3B4E0X application, or SPC560B40L3B4E0X equivalent, key selection criteria include its -40 to 125 °C operating range, LQFP100 package with 75 GPIOs, time-triggered PWM/ADC synchronization, and Nexus2+ debug support for safety-critical automotive development.
Technical Context
This MCU implements a deterministic real-time architecture with dual-clock domain operation: a high-speed domain (up to 64 MHz via FMPLL) for CPU and peripherals, and a low-speed domain (32 kHz SXOSC or 128 kHz SIRC) for RTC and standby monitoring. The cross-triggering unit (CTU) enables precise synchronization between PWM generation and ADC sampling-critical for LED current regulation and diagnostics.
Interrupt handling supports 16 priority levels with non-maskable interrupt (NMI), 34 external interrupt sources (18 of which serve as wakeup lines), and hardware-assisted context switching. Memory protection is enforced by an 8-entry MPU, while ECC coverage extends across all Flash and SRAM banks to meet ASIL-B requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h Power Architecture® core with VLE support, enabling code density improvement and deterministic execution for AUTOSAR-compliant software stacks. |
| Max Clock Frequency | 64 MHz system clock derived from FMPLL; delivers 60 DMIPs for real-time body control tasks including door module sequencing and seat position management. |
| Memory | 256 KB Code Flash + 64 KB Data Flash + 48 KB SRAM, all with ECC-ensures data integrity during voltage transients and radiation events in vehicle environments. |
| FlexCAN Interfaces | 6 × CAN 2.0B controllers with 64-message objects each, supporting multi-bus communication for gateway, lighting, and HVAC subsystems without external arbitration logic. |
| ADC System | 10-bit SAR ADC with up to 36 channels (extendable to 64 via external mux), individual conversion registers, and CTU-triggered sampling for synchronized diagnostics in LED driver feedback loops. |
| Operating Temperature | -40 to 125 °C ambient range-qualified for under-hood and cabin-mounted automotive ECUs per AEC-Q100 Grade 1 requirements. |
| Supply Voltage | Single 5 V or 3.3 V supply rail simplifies power architecture; internal regulators provide isolated domains for analog, digital, and I/O sections. |
Pinout & Package
LQFP100 package (14 × 14 × 1.4 mm), RoHS-compliant, with 100 leads arranged in quad flat pack configuration. Pin mapping validated per STMicroelectronics DocID14619 Rev 13, Figure 3 (LQFP100-pin configuration).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_HV / VDD_BV | Main power supply inputs | Dual-supply pins enable independent regulation of high-voltage (HV) and battery-voltage (BV) domains; critical for fault-isolated power sequencing during cold-cranking. |
| RESET_B | Active-low reset input | Asynchronous reset with internal pull-up; supports external RC timing and noise filtering per Figure 8 in datasheet for robust startup in noisy automotive environments. |
| OSC_IN / OSC_OUT | Fast external crystal oscillator interface | Supports 4–16 MHz crystals; connects to FXOSC circuit for primary clock source with programmable gain and margin tuning via NVUSRO register. |
| RTC_XIN / RTC_XOUT | Slow external crystal oscillator interface | 32 kHz crystal connection for RTC and ultra-low-power standby mode with CAN wake-up capability. |
| NEX_TDI / NEX_TDO / NEX_TMS / NEX_TCK | Nexus2+ debug interface | Provides real-time trace, data watchpoint, and instruction trace capabilities-required for ISO 26262 tool qualification and functional safety verification. |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated lighting diagnostic module | Enables time-triggered PWM output with synchronized ADC measurement for closed-loop LED current monitoring and open/short-circuit detection. |
| Ultra-low-power standby mode | Retains RTC, SRAM, and CAN monitoring functionality while consuming <5 µA-enables always-on vehicle presence detection without battery drain. |
| Cross-triggering unit (CTU) | Hardware event router that links PWM edge events to ADC start-of-conversion, eliminating software latency and jitter in lighting diagnostics. |
| Memory Protection Unit (MPU) | 8-entry MPU enforces privilege-level access control and prevents unintended memory access-essential for ASIL-B software partitioning. |
| Flexible clock generation | Four clock sources (FXOSC, SXOSC, FIRC, SIRC) with software-controlled FMPLL and Clock Monitor Unit (CMU) for fail-safe clock supervision. |
Applications
| Front Lighting Control Module | Rear Lighting Control Module |
|---|---|
Use Scenario: Adaptive front-lighting system managing high-beam assist, cornering lights, and dynamic leveling via LIN/CAN commands. IC Role / Device Role / Timing Role: Central controller executing PWM-modulated LED driver timing, CTU-synchronized current sensing, and real-time thermal derating algorithms. Use Value: Enables sub-millisecond PWM/ADC synchronization for accurate LED current feedback, meeting ECE R149 photometric stability requirements. |
Use Scenario: Smart rear combination lamp with brake light intensity modulation, turn signal animation, and reverse light ramp-up. IC Role / Device Role / Timing Role: Safety-critical lighting sequencer using time-triggered I/O and watchdog-monitored state machine execution. Use Value: Guarantees deterministic response to CAN/LIN commands within 2 ms, satisfying UNECE R65 visibility timing mandates. |
| Body Control Module (BCM) | Door Control Module |
Use Scenario: Centralized vehicle body controller managing window lift, mirror fold, interior lighting, and theft-deterrent functions. IC Role / Device Role / Timing Role: Real-time scheduler coordinating multiple CAN/FlexCAN buses, LINFlex UARTs, and GPIO-driven relays with precise interrupt latency control. Use Value: Supports concurrent handling of 34 external interrupts-including 18 wakeup-capable lines-for immediate response to door-open or key-fob events. |
Use Scenario: Intelligent door module controlling power windows, anti-pinch sensors, lock actuators, and proximity-based entry. IC Role / Device Role / Timing Role: High-integrity motor control unit using 16-bit counter-timers for precise window position tracking and emergency stop detection. Use Value: Delivers ±1% PWM duty cycle accuracy and <1 µs timer resolution for EN ISO 13849-1 compliant anti-pinch compliance testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC560B50L3B4E0X | 512 KB Code Flash (vs. 256 KB), same LQFP100 package and peripheral set. | Suitable for larger AUTOSAR BSW stacks or future-proofed designs requiring firmware expansion headroom. | Select when boot image size exceeds 200 KB or dual-bank OTA updates are required. |
| SPC560C40L3B4E0X | Same memory configuration but includes enhanced DSPI/I²C features and updated errata fixes per revision history. | Better suited for new designs targeting long-term production with latest silicon revisions and improved EMC immunity. | Prefer for green-field projects where latest device revision and extended peripheral reliability are prioritized. |
Compared with SPC560B40L3B4E0X, the B50 variant offers double flash capacity for complex diagnostics and bootloader redundancy, while the C40 provides silicon-level improvements in SPI timing margins and oscillator stability-both retain identical pinout and software compatibility.
Availability
SPC560B40L3B4E0X is available at Aetrix Electronics and suitable for automotive body electronics, lighting control modules, and door control units requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for SPC560B40L3B4E0X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive-grade microcontrollers, power management ICs, and sensor solutions.
The SPC560x family targets automotive body electronics with focus on functional safety, low-power operation, and integrated diagnostic capabilities-designed specifically for ASIL-B compliant lighting, gateway, and comfort control applications.
FAQ
What is the maximum operating junction temperature for SPC560B40L3B4E0X?
The device is qualified for operation up to 150 °C junction temperature, with ambient operating range specified from -40 to 125 °C. Thermal derating curves and θJA values (35 °C/W for LQFP100) are provided in Section 3.14 of the datasheet to support PCB thermal design validation.
Does SPC560B40L3B4E0X support AUTOSAR OS and MCAL drivers?
Yes-ST provides certified AUTOSAR 4.2.2 MCAL drivers (including CAN, ADC, PWM, GPT, ICU) and reference OS configurations compatible with this part. Integration is validated with leading AUTOSAR toolchains including Vector DaVinci and ETAS ISOLAR.
How many CAN message objects does each FlexCAN interface support?
Each of the six FlexCAN 2.0B interfaces supports up to 64 message objects in dedicated RAM, configurable as transmit, receive, or FIFO buffers. This allows full mailbox implementation for priority-based CAN communication without CPU polling overhead.
Is Nexus2+ debug support available on the production SPC560B40L3B4E0X package?
No-Nexus2+ is only available on the LBGA208 emulation package (e.g., SPC560B40L3B4E0Y). The LQFP100 production part (SPC560B40L3B4E0X) implements Nexus1, providing basic trace and breakpoint functionality sufficient for ASIL-B development and certification.
SPC560B40L3B4E0X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 100-LQFP
- Series:
- SPC56
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 64MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 79
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 24K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 28x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC560B40L3B4E0X FAQ
1.How can I place an order for SPC560B40L3B4E0X through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC560B40L3B4E0X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC560B40L3B4E0X reliable?
The price and inventory of SPC560B40L3B4E0X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC560B40L3B4E0X is usually 5 days.
3.What payment methods are accepted for SPC560B40L3B4E0X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC560B40L3B4E0X transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC560B40L3B4E0X?
SPC560B40L3B4E0X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC560B40L3B4E0X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC560B40L3B4E0X?
For technical support, including SPC560B40L3B4E0X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC560B40L3B4E0X requirements.
6.How does Aetrix verify that SPC560B40L3B4E0X is sourced from the original manufacturer or authorized distributors?
All SPC560B40L3B4E0X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC560B40L3B4E0X meets industry standards.
7.What is the process for return or replacement of SPC560B40L3B4E0X?
All SPC560B40L3B4E0X units undergo pre-shipment inspection (PSI). If there is an issue with SPC560B40L3B4E0X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC560B40L3B4E0X part is unused and in its original packaging.
Return procedure for SPC560B40L3B4E0X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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