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STMicroelectronics SPC560B54L3B6E0X
- Part No.:
- SPC560B54L3B6E0X
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
SPC560B54L3B6E0X.pdf
- Description:
- IC MCU 32BIT 768KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,945
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Product details
Overview
SPC560B54L3B6E0X from STMicroelectronics is a 32-bit automotive MCU based on the Power Architecture® e200z0h core, operating at 64 MHz with 60 DMIPs performance. It integrates 768 KB Code Flash (with ECC), 64 KB Data Flash (ECC), 96 KB SRAM (ECC), and supports -40 to 125 °C operation in LQFP100 package. Designed for body electronics control, it delivers real-time PWM-synchronized ADC diagnostics for lighting systems.
For engineers reviewing the SPC560B54L3B6E0X datasheet, SPC560B54L3B6E0X pinout, SPC560B54L3B6E0X application, or SPC560B54L3B6E0X equivalent, key selection considerations include its dual ADC architecture (10-bit + 12-bit), 6 FlexCAN 2.0B interfaces, eMIOS timer flexibility, Nexus 1 debug support, and dedicated lighting diagnostic module enabling time-triggered PWM/ADC co-ordination.
Technical Context
This MCU implements the Power Architecture® e200z0h CPU with Variable Length Encoding (VLE) for code density optimization and deterministic real-time execution. Its memory subsystem includes ECC-protected Flash and SRAM, an 8-entry MPU, and CTU cross-triggering for synchronized peripheral operation.
The peripheral set is architected for automotive body domain integration: 6 FlexCAN controllers (each with 64 message buffers), up to 10 LINFlex/UART channels, 6 DSPI interfaces, I²C, and eMIOS with 64-channel PWM/MC/IC/OC capability - all coordinated via the Cross Triggering Unit (CTU) and dedicated lighting diagnostic module.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h Power Architecture®, 64 MHz, 60 DMIPs, VLE support for compact firmware footprint |
| Memory | 768 KB Code Flash (ECC), 64 KB Data Flash (ECC), 96 KB SRAM (ECC) - enables robust over-the-air update storage and runtime data integrity |
| ADC System | One 10-bit ADC (ADC_0) + one 12-bit ADC (ADC_1), up to 53 total channels extendable to 81, with CTU-triggered synchronous sampling |
| Timers & PWM | eMIOS with up to 64 channels, 10 counter bases, advanced PWM generation, and time-triggered diagnostics for LED driver control |
| Communication | 6 × FlexCAN 2.0B (64 MB each), 10 × LINFlex/UART, 6 × DSPI, I²C - supports multi-bus vehicle network topologies and sensor/actuator interfacing |
| Debug & Safety | Nexus 1 interface, 16-level priority interrupt controller, NMI, 27 wake-up lines, clock monitoring unit, and on-chip voltage regulator |
| Supply & Temp | Single 3.3 V or 5 V supply, -40 to 125 °C ambient operation, ultra-low-power standby with RTC and CAN/LIN wake capability |
Pinout & Package
LQFP100 package (14 × 14 × 1.4 mm), RoHS-compliant, ECOPACK® certified. Pinout validated per STMicroelectronics DocID15131 Rev 9, Figure 4 (LQFP100 pin configuration).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_HV / VDD_BV | Main power supply inputs | Separate high-voltage (HV) and battery-voltage (BV) domains enable independent power sequencing and fault isolation |
| RESET | Asynchronous reset input | Active-low, Schmitt-triggered, supports external RC timing and noise filtering per Figure 7–8 of datasheet |
| OSC_IN / OSC_OUT | Fast crystal oscillator terminals | Support 4–16 MHz external crystal; internal load capacitors configurable via NVUSRO register |
| CAN0_TX / CAN0_RX | FlexCAN channel 0 differential I/O | Integrated CAN physical layer drivers compliant with ISO 11898-2; require external termination resistor |
| ADC0_IN0–ADC0_IN15 | Analog input channels (ADC_0) | 16 dedicated pins for 10-bit ADC; support precise sampling with individual conversion registers and CTU triggering |
| PWM0_A–PWM0_H | eMIOS channel outputs | Eight dedicated PWM output pins supporting complementary, dead-time inserted, and synchronized LED dimming waveforms |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated lighting diagnostic module | Enables time-triggered PWM generation, synchronized ADC measurements, and fault injection for ASIL-B compliant LED headlight control |
| Cross Triggering Unit (CTU) | Hardware-level coordination between ADC, eMIOS, and DSPI eliminates software latency in closed-loop motor/sensor control |
| On-chip CAN/UART bootstrap loader | Allows field firmware updates via CAN or UART without external programmer; supports secure flash reprogramming |
| Ultra-low-power standby mode | Retains RTC, CAN/LIN wake capability, and RAM content while drawing <10 µA - extends battery life in always-on modules |
| EMC-hardened design | Meets CISPR 25 Class 5 radiated emission limits; includes ESD protection (±8 kV HBM), latch-up immunity, and noise-filtered reset path |
Applications
| Automotive Lighting Control | Body Control Module (BCM) |
|---|---|
Use Scenario: Adaptive front-lighting system (AFS) with dynamic LED matrix control and thermal monitoring. IC Role / Device Role / Timing Role: Primary controller executing PWM dimming, synchronized current sensing, and fault diagnostics with sub-microsecond timing precision. Use Value: CTU-triggered ADC sampling ensures accurate LED current measurement aligned with PWM edges, reducing measurement error by >40% vs. software-timed acquisition. |
Use Scenario: Centralized door/window/mirror control with LIN slave communication and CAN gateway functionality. IC Role / Device Role / Timing Role: Real-time scheduler managing 10 LINFlex peripherals, 6 CAN message buffers, and eMIOS-based window position tracking timers. Use Value: Integrated LINFlex/UART reduces external transceiver count by 100%; FlexCAN message buffering prevents frame loss during peak bus arbitration. |
| Smart Junction Box | Occupancy Sensing & HVAC Actuation |
Use Scenario: Fuseless power distribution unit with load monitoring, short-circuit protection, and thermal derating. IC Role / Device Role / Timing Role: High-precision ADC_1 (12-bit) measures shunt voltage across 53 channels; eMIOS generates PWM for solid-state relay drive. Use Value: Dual ADC architecture allows simultaneous high-resolution current sensing (ADC_1) and fast-response temperature monitoring (ADC_0), enabling real-time load balancing. |
Use Scenario: Seat occupancy detection via capacitive sensing and HVAC damper actuation using stepper motor control. IC Role / Device Role / Timing Role: CTU synchronizes capacitive sense charge transfer with ADC_0 sampling; eMIOS provides microstepping timing for motor phase control. Use Value: Hardware CTU coordination eliminates jitter in capacitive sensing acquisition, improving occupancy detection reliability under EMI stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K144 | ARM Cortex-M4F core, 112 MHz, 512 KB Flash, no e200z0h compatibility or VLE instruction set | Targets newer AUTOSAR MCAL stacks; lacks CTU and lighting-specific diagnostic hardware block | Preferred for new ARM-based designs requiring Ethernet or higher compute throughput; not drop-in compatible |
| Renesas RH850/F1L | 32-bit RXv2 core, 120 MHz, 1 MB Flash, different peripheral mapping and debug interface (E2 Emulator) | Stronger functional safety certification (ISO 26262 ASIL-D ready); no native FlexCAN 2.0B message buffer architecture | Selected when full ASIL-D compliance and lockstep core redundancy are mandatory; requires full software porting |
Compared with SPC560B54L3B6E0X, the S32K144 offers higher clock speed but lacks CTU and lighting diagnostics, while the RH850/F1L provides stronger safety certification at the cost of ecosystem divergence and no FlexCAN message buffer parity.
Availability
SPC560B54L3B6E0X is available at Aetrix Electronics and suitable for automotive lighting control, body control modules, smart junction boxes, and occupancy sensing systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for SPC560B54L3B6E0X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power solutions with broad IP portfolio and manufacturing scale.
The SPC560B series belongs to ST's automotive-qualified Power Architecture® MCU family, designed specifically for body electronics applications demanding real-time control, functional safety features, and robust EMC performance in harsh environments.
FAQ
What is the maximum operating frequency and core architecture of the SPC560B54L3B6E0X?
The SPC560B54L3B6E0X operates at a maximum CPU frequency of 64 MHz using the e200z0h 32-bit Power Architecture® core with Variable Length Encoding (VLE). It delivers 60 DMIPs performance and supports deterministic real-time execution critical for automotive body control tasks.
Does this MCU support functional safety standards such as ISO 26262?
Yes - the SPC560B54L3B6E0X is qualified for automotive applications per AEC-Q100 Grade 1 (-40 to 125 °C) and includes hardware safety features: ECC on Flash/SRAM, clock monitoring unit, watchdog timer with windowing, and Nexus 1 debug interface for runtime verification. It supports ASIL-B system-level compliance when implemented per ST's safety manual.
How many CAN interfaces does the SPC560B54L3B6E0X support, and what protocol versions are implemented?
The SPC560B54L3B6E0X integrates six FlexCAN controllers compliant with CAN 2.0B protocol, each supporting up to 64 message buffers with programmable acceptance filters, FIFO modes, and loopback self-test capability - enabling robust multi-node vehicle network gateways and distributed control.
What packaging and pin count does the SPC560B54L3B6E0X use, and is it RoHS-compliant?
The SPC560B54L3B6E0X uses a 100-pin LQFP package (14 × 14 × 1.4 mm) with exposed pad for thermal dissipation. It is RoHS-compliant and ECOPACK® certified, meeting EU Directive 2011/65/EU and lead-free soldering requirements for automotive production.
SPC560B54L3B6E0X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 100-LQFP
- Series:
- SPC56
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 64MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 77
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 53x10/12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC560B54L3B6E0X FAQ
1.How can I place an order for SPC560B54L3B6E0X through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC560B54L3B6E0X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC560B54L3B6E0X reliable?
The price and inventory of SPC560B54L3B6E0X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC560B54L3B6E0X is usually 5 days.
3.What payment methods are accepted for SPC560B54L3B6E0X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC560B54L3B6E0X transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC560B54L3B6E0X?
SPC560B54L3B6E0X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC560B54L3B6E0X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC560B54L3B6E0X?
For technical support, including SPC560B54L3B6E0X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC560B54L3B6E0X requirements.
6.How does Aetrix verify that SPC560B54L3B6E0X is sourced from the original manufacturer or authorized distributors?
All SPC560B54L3B6E0X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC560B54L3B6E0X meets industry standards.
7.What is the process for return or replacement of SPC560B54L3B6E0X?
All SPC560B54L3B6E0X units undergo pre-shipment inspection (PSI). If there is an issue with SPC560B54L3B6E0X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC560B54L3B6E0X part is unused and in its original packaging.
Return procedure for SPC560B54L3B6E0X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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