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STMicroelectronics SPC560B60L3B6E0X
- Part No.:
- SPC560B60L3B6E0X
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
SPC560B60L3B6E0X.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,176
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Product details
Overview
SPC560B60L3B6E0X from STMicroelectronics is a 32-bit automotive MCU based on the Power Architecture® e200z0h core, operating at 64 MHz with 60 DMIPs performance. It integrates 768 KB on-chip Code Flash with ECC, 64 KB Data Flash, 96 KB SRAM (all with ECC), and supports -40 to 125 °C operation in LQFP100 package. Designed for body electronics control units, it delivers deterministic real-time response for lighting, door module, and HVAC actuation.
For engineers reviewing the SPC560B60L3B6E0X datasheet, SPC560B60L3B6E0X pinout, SPC560B60L3B6E0X application, or SPC560B60L3B6E0X equivalent, key selection criteria include its dual ADC (10-bit + 12-bit, up to 53 channels), six FlexCAN 2.0B interfaces, dedicated lighting diagnostic module with PWM-synchronized ADC, and Nexus 1 debug interface - all validated for ASIL-B–capable automotive subsystems.
Technical Context
This MCU implements a variable-length encoding (VLE) Power Architecture® core enabling high code density and deterministic interrupt latency. Its memory subsystem includes ECC-protected Flash and SRAM, an 8-entry MPU, and CTU for cross-triggered peripheral synchronization - essential for time-critical automotive diagnostics.
The peripheral set is architected for body domain integration: six FlexCAN controllers (each with 64 message buffers), ten LINFlex/UART channels, six DSPI interfaces, and eMIOS with 64 PWM/MC/IC/OC channels - all mapped to 77 GPIOs in the LQFP100 variant and coordinated via a 16-channel eDMA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h Power Architecture® with VLE, 64 MHz max, 60 DMIPs - enables deterministic real-time task scheduling in safety-critical body control software. |
| Code Flash | 768 KB with ECC - supports robust firmware storage and in-field updates with error detection/correction for automotive lifecycle requirements. |
| Data Flash | 64 KB with ECC - provides reliable non-volatile parameter storage (e.g., calibration data, configuration settings) across temperature and voltage extremes. |
| SRAM | 96 KB with ECC - ensures data integrity for runtime variables, stack, and critical buffers during ASIL-B–compliant operation. |
| ADC System | One 10-bit + one 12-bit ADC, up to 53 total channels, CTU-triggered - enables synchronized sampling of sensor inputs (e.g., ambient light, temperature, potentiometer) for closed-loop lighting/HVAC control. |
| Communication | 6 × FlexCAN 2.0B (64 MB each), 10 × LINFlex/UART, 6 × DSPI, I²C - meets full CAN/LIN bus topology requirements for body domain ECUs without external protocol bridges. |
| Timers & PWM | 8 × PIT, 4 × STM, watchdog, RTC, eMIOS with 64 channels - supports precise timing for PWM dimming, window lift sequencing, and wake-up event management. |
| Operating Range | -40 to +125 °C, single 3.3 V or 5 V supply - qualified for under-hood and cabin-mounted automotive modules per AEC-Q100 Grade 1. |
Pinout & Package
LQFP100 package (14 × 14 × 1.4 mm), RoHS-compliant, ECOPACK® certified. Pin layout optimized for automotive PCB routing with dedicated voltage domains (VDD_BV/VDD_HV), isolated reset and clock inputs, and grouped peripheral signals (CAN, LIN, SPI) to minimize crosstalk.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_BV, VDD_HV | Power supply inputs | Dual-supply architecture isolates analog/digital domains; supports 3.3 V or 5 V operation with internal regulator and external ballast resistor option. |
| RESET_B | Active-low reset input | Asynchronous, Schmitt-triggered reset with noise filtering support - ensures reliable power-on and brownout recovery in noisy automotive environments. |
| OSC_IN / OSC_OUT | External crystal oscillator interface | Supports 4–16 MHz fast crystal or 32 kHz slow crystal - enables precise clock sourcing for CAN bit timing and RTC accuracy. |
| CAN0_TX / CAN0_RX | FlexCAN channel 0 differential interface | Direct connection to external CAN transceiver; compliant with ISO 11898-2; supports 1 Mbit/s operation with programmable sample point. |
| LIN0_TX / LIN0_RX | LINFlex channel 0 UART/LIN interface | Configurable as UART or LIN 2.1/2.2 master/slave; integrated LIN physical layer driver control - eliminates need for external LIN transceiver in basic nodes. |
| ADC0_IN0–ADC0_IN15 | Analog input channels (10-bit ADC) | Grouped pins with dedicated reference (VREFH/VREFL); support simultaneous sampling via CTU trigger - critical for multi-sensor diagnostics. |
| EMIOS_0A–EMIOS_0F | eMIOS channel outputs | Programmable 16-bit counter/timer outputs supporting PWM generation, input capture, and output compare - used for LED dimming, motor phase control, and pulse counting. |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated lighting diagnostic module | Integrates advanced PWM generation, time-triggered diagnostics, and PWM-synchronized ADC measurements - enables ASIL-B–compliant headlight/interior lighting control with fault coverage reporting. |
| Cross-triggering unit (CTU) | Hardware-synchronized triggering between ADC, eMIOS, and DSPI - eliminates software overhead and jitter in sensor-to-actuator signal chains (e.g., light sensor → PWM dimming). |
| Nexus 1 debug interface | Real-time trace and breakpoint support over dedicated pins - enables non-intrusive debugging of time-critical automotive firmware without affecting system timing. |
| On-chip CAN/UART bootstrap loader | Enables field firmware updates via CAN or UART without external programmer - reduces service cost and supports OTA-like reprogramming in production vehicles. |
| Low-power standby with RTC | Ultra-low-power mode retaining RTC and CAN wake-up capability - extends battery life in always-on modules (e.g., door handle sensors, keyless entry receivers). |
Applications
| Front Lighting Control Unit | Door Module ECU |
|---|---|
Use Scenario: Adaptive front lighting system managing LED matrix dimming, beam shaping, and glare-free high-beam activation. IC Role / Device Role / Timing Role: Main controller executing real-time PWM modulation, synchronizing ADC readings from ambient/forward-light sensors with eMIOS outputs, and validating beam patterns via diagnostic module. Use Value: Achieves <5 µs PWM edge jitter and sub-millisecond sensor-to-actuator latency - required for dynamic beam cut-off compliance with UNECE R149. | Use Scenario: Centralized door module handling window lift, mirror fold, lock/unlock, and interior lighting control. IC Role / Device Role / Timing Role: Real-time coordinator of LIN slave devices (window motor, mirror actuator), CAN gateway to body domain network, and ADC-based anti-pinch detection. Use Value: Integrates 53-channel ADC for multi-point current sensing and eMIOS for precise motor commutation timing - eliminates need for external motor drivers in Class A/B vehicles. |
| HVAC Blower Control | Seat Occupancy Detection Interface |
Use Scenario: Brushless DC blower motor control in automotive HVAC systems with speed regulation and thermal protection. IC Role / Device Role / Timing Role: PWM generator driving external gate drivers, ADC monitor for motor current/temperature, and CAN interface for climate ECU coordination. Use Value: Uses eMIOS 64-channel PWM with dead-time insertion and ADC-triggered overcurrent shutdown - meets ISO 16750-2 vibration and surge immunity requirements. | Use Scenario: Capacitive seat occupancy detection node interfacing with pressure/weight sensors and communicating status via LIN to airbag control unit. IC Role / Device Role / Timing Role: Signal conditioner acquiring low-noise capacitive sensor data via 12-bit ADC, performing baseline drift compensation, and transmitting validated occupancy state over LIN. Use Value: Leverages 12-bit ADC with individual conversion registers and CTU-triggered sampling - achieves <1% measurement error across -40 to 85 °C for FMVSS 208 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC560B54L3B6E0X | Same LQFP100 package, but 512 KB Code Flash, 48 KB Data Flash, 64 KB SRAM - reduced memory footprint. | Suitable for simpler body nodes (e.g., single-zone lighting, basic door latch) without complex diagnostics or multi-sensor fusion. | Select when BOM cost sensitivity outweighs future firmware scalability needs; shares identical pinout and peripheral set. |
| SPC560B64L3B6E0X | Same LQFP100 package, with 1.5 MB Code Flash, 64 KB Data Flash, 96 KB SRAM - higher flash capacity for larger AUTOSAR stacks or OTA update partitions. | Targeted at next-gen body ECUs requiring ASIL-D software partitioning, secure boot, or dual-bank firmware updates. | Choose when long-term software maintainability and functional safety certification (ISO 26262) drive memory and ECC requirements beyond SPC560B60L3B6E0X. |
Compared with SPC560B54L3B6E0X, the SPC560B60L3B6E0X offers 50% more Code Flash for enhanced diagnostics and bootloader resilience; versus SPC560B64L3B6E0X, it balances cost and capacity for mid-tier body ECUs where full 1.5 MB is unused - optimizing die size and thermal profile.
Availability
SPC560B60L3B6E0X is available at Aetrix Electronics and suitable for automotive body control units, lighting modules, and HVAC actuators requiring stable component supply across extended vehicle lifecycles and AEC-Q100-compliant manufacturing.
Supply support for SPC560B60L3B6E0X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, with design, manufacturing, and sales operations across Europe, Asia, and the Americas.
The SPC560B series belongs to ST's automotive-qualified Power Architecture® MCU portfolio, engineered specifically for body electronics applications demanding ASIL-B compliance, robust EMC performance, and seamless integration with CAN/LIN networks.
FAQ
What is the maximum operating frequency and core architecture of the SPC560B60L3B6E0X?
The SPC560B60L3B6E0X features a 32-bit e200z0h CPU core based on the Power Architecture® instruction set, operating at a maximum frequency of 64 MHz and delivering up to 60 DMIPs. It supports Variable Length Encoding (VLE) for improved code density and deterministic interrupt latency - critical for real-time automotive control loops.
Does this MCU support functional safety standards such as ISO 26262?
Yes, the SPC560B60L3B6E0X is designed for ASIL-B–capable systems per ISO 26262. It includes hardware safety mechanisms such as ECC on Flash/SRAM, lockstep-capable peripherals, memory protection unit (MPU), and built-in self-test (BIST) support - verified in ST's SPC560B Functional Safety Manual (UM1815).
How many CAN interfaces does the SPC560B60L3B6E0X provide, and what protocol versions are supported?
The SPC560B60L3B6E0X integrates up to six FlexCAN controllers, each compliant with CAN 2.0B active protocol and supporting bit rates up to 1 Mbit/s. Each controller includes 64 message buffers with configurable acceptance filtering, enabling robust communication across multiple vehicle body domain networks without external CAN controllers.
What debug interface is available, and is Nexus 2+ supported on this part?
The SPC560B60L3B6E0X provides Nexus 1 debug interface across all packages, including LQFP100. Nexus 2+ is only available on the LBGA208 package variant (e.g., SPC560B60L7B6E0X). Nexus 1 supports real-time trace, hardware breakpoints, and memory access - sufficient for ASIL-B development and production diagnostics.
SPC560B60L3B6E0X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 100-LQFP
- Series:
- SPC56
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 64MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 77
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 80K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 53x10/12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC560B60L3B6E0X FAQ
1.How can I place an order for SPC560B60L3B6E0X through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC560B60L3B6E0X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC560B60L3B6E0X reliable?
The price and inventory of SPC560B60L3B6E0X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC560B60L3B6E0X is usually 5 days.
3.What payment methods are accepted for SPC560B60L3B6E0X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC560B60L3B6E0X transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC560B60L3B6E0X?
SPC560B60L3B6E0X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC560B60L3B6E0X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC560B60L3B6E0X?
For technical support, including SPC560B60L3B6E0X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC560B60L3B6E0X requirements.
6.How does Aetrix verify that SPC560B60L3B6E0X is sourced from the original manufacturer or authorized distributors?
All SPC560B60L3B6E0X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC560B60L3B6E0X meets industry standards.
7.What is the process for return or replacement of SPC560B60L3B6E0X?
All SPC560B60L3B6E0X units undergo pre-shipment inspection (PSI). If there is an issue with SPC560B60L3B6E0X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC560B60L3B6E0X part is unused and in its original packaging.
Return procedure for SPC560B60L3B6E0X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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