STMicroelectronics SPC560B60L5C6E0X
- Part No.:
- SPC560B60L5C6E0X
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
SPC560B60L5C6E0X.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SPC560B60L5C6E0X from STMicroelectronics is a 32-bit automotive MCU based on the Power Architecture® e200z0h core, operating at 64 MHz (60 DMIPs), featuring 1 MB on-chip Code Flash with ECC, 64 KB Data Flash, and 96 KB SRAM with ECC. It integrates six FlexCAN 2.0B interfaces, ten LINFlex/UART channels, and dedicated lighting diagnostics for body electronics control in door modules and seat control units.
For engineers reviewing the SPC560B60L5C6E0X datasheet, SPC560B60L5C6E0X pinout, SPC560B60L5C6E0X application, or SPC560B60L5C6E0X equivalent, key selection considerations include CAN/LIN interface count, ECC-protected memory sizing, LQFP144 package thermal profile, and automotive-grade (-40 to 125 °C) operation with Nexus 1 debug support.
Technical Context
This MCU implements a variable-length encoding (VLE) Power Architecture® core optimized for deterministic real-time execution in automotive body domain controllers. Its peripheral set includes an 8-channel periodic interrupt timer, 4-channel system timer, and system watchdog - all synchronized via a cross-triggering unit (CTU) that coordinates PWM generation, ADC sampling, and diagnostic events.
The device supports dual ADC subsystems: a 10-bit ADC_0 (up to 53 channels) and a 12-bit ADC_1 (extendable to 81 channels), both with individual conversion registers and CTU-triggered acquisition. Clocking combines a 4–16 MHz external crystal oscillator, 32 kHz slow clock, and software-controlled FMPLL for flexible frequency synthesis across low-power and high-performance modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h Power Architecture® with VLE; enables compact code footprint and deterministic interrupt latency for ASIL-B–capable body control tasks. |
| Max Operating Frequency | 64 MHz (60 DMIPs); delivers sufficient compute headroom for concurrent CAN message handling, LIN scheduling, and PWM-driven lighting control. |
| Code Flash | 1 MB with ECC; supports robust firmware storage and over-the-air update resilience in automotive ECU designs. |
| Data Flash | 64 KB with ECC; provides reliable non-volatile parameter storage for calibration data and configuration settings. |
| SRAM | 96 KB with ECC; accommodates real-time task stacks, CAN message buffers, and diagnostic state variables without external memory. |
| FlexCAN Interfaces | 6 × CAN 2.0B with 64 message buffers each; enables full vehicle network integration including gateway, body domain, and sensor fusion nodes. |
| ADC Resolution & Channels | 10-bit + 12-bit dual ADCs; supports simultaneous high-speed (light sensing) and high-precision (temperature, voltage) measurements with CTU synchronization. |
| Operating Temperature | -40 to 125 °C; certified for under-hood and interior automotive environments per AEC-Q100 Grade 1 requirements. |
Pinout & Package
LQFP144 (24 × 24 × 1.4 mm) package with 121 GPIOs, single 3.3 V or 5 V supply, and dedicated voltage regulator pins (VDD_HV, VDD_BV, VDDA, VSSA).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_HV / VDD_BV | Main power supply inputs | Accept 3.3 V or 5 V; internal regulator generates core voltage - simplifies board-level power architecture. |
| VDDA / VSSA | Analog power/ground | Isolated analog domain supply ensures ADC accuracy and noise immunity for sensor signal conditioning. |
| CANH / CANL (x6) | Differential CAN bus terminals | Direct connection to ISO 11898-2 transceivers; supports wake-up on bus activity in low-power modes. |
| LIN_RX / LIN_TX (x10) | Single-wire LIN physical layer I/O | Configurable per channel for master/slave roles; integrated LINFlex modules eliminate external UART-LIN bridge ICs. |
| ADC0_IN0–ADC0_IN52 | Analog input channels | Support multiplexed sampling of up to 53 sensors; CTU-triggered acquisition enables time-aligned diagnostics. |
| EMIOS_CH0–CH63 | Enhanced modular I/O subsystem outputs | Programmable 16-bit PWM, input capture, and output compare - used for LED dimming, motor control, and pulse counting. |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated lighting diagnostic module | Enables time-triggered PWM fault detection and synchronized ADC measurement - meets functional safety requirements for adaptive lighting systems. |
| On-chip CAN/UART bootstrap loader | Allows field firmware updates via CAN or LIN without external programming hardware - reduces service cost and enables remote calibration. |
| 8-entry memory protection unit (MPU) | Provides hardware-enforced isolation between application, bootloader, and safety monitor partitions - foundational for ASIL-B software partitioning. |
| Nexus 1 debug interface | Supports real-time trace, breakpoint, and register inspection across all LQFP packages - accelerates validation of timing-critical automotive software. |
| Ultra-low-power standby with RTC | Retains real-time clock and communication wake-up capability while drawing <10 µA - extends battery life in always-on vehicle modules. |
Applications
| Door Control Module | Seat Position Control |
|---|---|
Use Scenario: Centralized management of power windows, locks, mirrors, and intrusion detection sensors. IC Role / Device Role / Timing Role: Main controller executing LIN slave protocols for mirror/lock actuators, CAN gateway for body domain communication, and ADC-based sensor monitoring. Use Value: Integrated 6× CAN and 10× LINFlex eliminate external protocol bridges; ECC memory ensures firmware integrity during frequent power cycling. | Use Scenario: Motorized adjustment of seat position, lumbar support, and heating elements with occupancy sensing. IC Role / Device Role / Timing Role: Real-time PWM motor control via eMIOS, current-sense ADC feedback, and CAN-based HMI status reporting. Use Value: CTU-synchronized PWM and ADC enable precise closed-loop positioning; 125 °C rating supports under-seat mounting near HVAC ducts. |
| Roof Module Controller | Lighting Control Unit |
Use Scenario: Sunroof actuation, ambient lighting, and rain/light sensor processing in overhead console assemblies. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating analog light/rain inputs, driving RGB LED strips via PWM, and communicating via LIN to body gateway. Use Value: Dual ADC subsystems allow concurrent high-resolution light measurement and fast-response rain detection; LQFP144 footprint fits constrained roof module PCB area. | Use Scenario: Adaptive front-lighting system (AFS) with dynamic beam shaping, diagnostics, and thermal derating. IC Role / Device Role / Timing Role: Dedicated lighting diagnostic engine generating synchronized PWM outputs and triggering ADC measurements for LED current/voltage monitoring. Use Value: Hardware-accelerated time-triggered diagnostics reduce CPU load and ensure compliance with ISO 26262 ASIL-B timing constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC560B64L5C6E0X | 1.5 MB Code Flash, 149 GPIOs (LQFP176), same core/peripherals | Higher memory and I/O count for complex gateway or multi-sensor fusion nodes | Select when firmware size exceeds 1 MB or >121 GPIOs required. |
| SPC560B54L5C6E0X | 768 KB Code Flash, identical LQFP144 package and peripheral set | Cost-optimized variant for entry-level body modules with smaller firmware footprint | Select when application fits within 768 KB Flash and requires no additional peripherals. |
Compared with SPC560B60L5C6E0X, the SPC560B64L5C6E0X offers scalable memory for future firmware growth, while the SPC560B54L5C6E0X reduces BOM cost where feature set is fully utilized but memory headroom is unnecessary - enabling tiered platform design across vehicle trims.
Availability
SPC560B60L5C6E0X is available at Aetrix Electronics and suitable for automotive door modules, seat control units, and roof console systems requiring stable component supply across extended production lifecycles.
Supply support for SPC560B60L5C6E0X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in automotive, industrial, and power management solutions with broad AEC-Q100-qualified product portfolios.
The SPC560B series targets automotive body electronics, delivering Power Architecture® performance with integrated safety features, robust communication stacks, and automotive-qualified packaging for cost-sensitive yet reliability-critical ECU designs.
FAQ
What is the maximum junction temperature specification for SPC560B60L5C6E0X?
The device is rated for operation up to 125 °C ambient temperature and supports junction temperatures up to 150 °C under defined thermal conditions. This rating is validated per AEC-Q100 Grade 1 requirements and confirmed in Section 4.5 of the datasheet, with thermal resistance values (θJA = 30.5 °C/W for LQFP144) enabling accurate board-level thermal modeling.
Does SPC560B60L5C6E0X support JTAG debugging?
Yes, it supports IEEE 1149.1 JTAG boundary scan for production testing and debug access. The JTAG interface operates at up to 10 MHz and is fully compliant with standard tools; however, for real-time trace and advanced debug, the Nexus 1 interface is recommended as it provides deeper visibility into program flow and peripheral states.
How many CAN message buffers are available per FlexCAN module?
Each of the six FlexCAN modules provides 64 dedicated message buffers, configurable as transmit or receive objects. These buffers support mailbox-style prioritization and automatic ID filtering, enabling efficient handling of mixed CAN traffic (e.g., diagnostic, control, and sensor messages) without CPU intervention.
Is external crystal required for SPC560B60L5C6E0X operation?
No - the MCU includes a 16 MHz fast internal RC oscillator and 128 kHz slow internal RC oscillator, enabling full functionality without external crystals. However, for CAN timing accuracy and EMI reduction, a 4–16 MHz external crystal is recommended; the 32 kHz external crystal is optional and used only when higher RTC precision than the internal oscillator provides is needed.
SPC560B60L5C6E0X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 144-LQFP
- Series:
- SPC56
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 64MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 121
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 80K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 53x10/12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC560B60L5C6E0X FAQ
1.How can I place an order for SPC560B60L5C6E0X through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC560B60L5C6E0X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC560B60L5C6E0X reliable?
The price and inventory of SPC560B60L5C6E0X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC560B60L5C6E0X is usually 5 days.
3.What payment methods are accepted for SPC560B60L5C6E0X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC560B60L5C6E0X transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC560B60L5C6E0X?
SPC560B60L5C6E0X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC560B60L5C6E0X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC560B60L5C6E0X?
For technical support, including SPC560B60L5C6E0X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC560B60L5C6E0X requirements.
6.How does Aetrix verify that SPC560B60L5C6E0X is sourced from the original manufacturer or authorized distributors?
All SPC560B60L5C6E0X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC560B60L5C6E0X meets industry standards.
7.What is the process for return or replacement of SPC560B60L5C6E0X?
All SPC560B60L5C6E0X units undergo pre-shipment inspection (PSI). If there is an issue with SPC560B60L5C6E0X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC560B60L5C6E0X part is unused and in its original packaging.
Return procedure for SPC560B60L5C6E0X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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