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STMicroelectronics SPC560P50L3BEFAY
- Part No.:
- SPC560P50L3BEFAY
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
SPC560P50L3BEFAY.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,674
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Product details
Overview
SPC560P50L3BEFAY from STMicroelectronics is a 32-bit Power Architecture® automotive MCU featuring a 64 MHz e200z0h CPU core, 576 KB on-chip Flash memory with ECC, 40 KB SRAM with ECC, and integrated FlexCAN 2.0B, FlexRay V2.1, LINFlex, DSPI, ADC, and FlexPWM peripherals - deployed in airbag control units and chassis domain controllers requiring ASIL-B functional safety compliance.
For engineers reviewing the SPC560P50L3BEFAY datasheet, SPC560P50L3BEFAY pinout, SPC560P50L3BEFAY application, or SPC560P50L3BEFAY equivalent, key selection criteria include dual-channel FlexRay support (up to 10 Mbit/s), safety port capability (7.5 Mbit/s CAN), 10-bit ADC with <1 µs conversion time, and Nexus L2+ debug interface for real-time trace in safety-critical automotive firmware development.
Technical Context
The SPC560P50L3BEFAY implements a single-issue e200z0h core compliant with Power Architecture® embedded category and supports Variable Length Encoding (VLE) for code density optimization. Its memory subsystem integrates 576 KB Flash with ECC and erase/program controller, plus 40 KB SRAM with ECC, enabling robust code execution and data retention in harsh automotive environments.
It features a dedicated safety port derived from FlexCAN with 32 message objects and up to 7.5 Mbit/s, functionally separable from the main FlexCAN interface. The FlexRay module supports selectable dual/single channel operation at up to 10 Mbit/s and includes 32 message objects - critical for time-triggered communication in chassis control networks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h, 64 MHz, Power Architecture® embedded category, VLE support for compact firmware footprint |
| Flash Memory | 576 KB on-chip, with ECC and dedicated erase/program controller for safe over-the-air updates |
| SRAM | 40 KB on-chip, with ECC for fault-tolerant data storage in safety-critical variables |
| ADC | Two 10-bit converters, 2×11 + 4 shared input channels, <1 µs full-precision conversion time |
| FlexRay | V2.1 compliant, selectable dual/single channel, 32 message objects, up to 10 Mbit/s (576 KB device only) |
| Safety Port | Dedicated FlexCAN-based interface with 32 message objects and up to 7.5 Mbit/s; usable as second CAN when not configured for safety |
| Nexus Interface | L2+ debug interface supporting real-time trace, hardware breakpoints, and non-intrusive monitoring for ISO 26262 validation |
Pinout & Package
LQFP100 package (14 × 14 × 1.4 mm), RoHS-compliant, ECOPACK® certified, rated for automotive temperature range (–40 °C to 125 °C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_HV_IOx | High-voltage I/O supply | Supports 3.0–5.5 V operation; powers GPIO, LINFlex, DSPI, and eTimer I/O buffers |
| VDD_HV_REG | Independent ADC reference supply | Separate 3.0–5.5 V rail for analog subsystem; enables noise-isolated high-precision sampling |
| RESET | Asynchronous reset input | Active-low, Schmitt-triggered, with internal pull-up; meets automotive brown-out timing requirements per Figure 20 |
| CLKIN | Main oscillator input | Accepts external crystal (4–20 MHz) or clock source; feeds FMPLL for system clock generation |
| FRAY_TXD / FRAY_RXD | FlexRay differential transmit/receive | LVDS-compatible pins for FlexRay physical layer; require external bus driver and termination per ISO 11898-4 |
| CAN0_TX / CAN0_RX | Main FlexCAN 2.0B channel | CMOS-level signals; require external transceiver (e.g., TJA1042) for bus coupling |
| CAN1_TX / CAN1_RX | Safety port FlexCAN channel | Electrically isolated from CAN0; supports independent message filtering and error handling for ASIL-B separation |
Key Features
| Feature | Design Value |
|---|---|
| Fault Collection Unit (FCU) | Hardware-accelerated fault logging with timestamping and priority-based storage for ISO 26262 diagnostic event recording |
| Programmable Watchdog Timer (SWT) | Configurable timeout window with windowed mode; supports fail-safe state transition via NMI on timeout |
| ADC Cross Triggering Unit (CTU) | Hardware-synchronized sampling across both ADCs using eTimer or FlexPWM events - eliminates software jitter in motor control loops |
| Boot Assist Module (BAM) | On-chip CAN/UART bootloader enabling field firmware updates without external programmer; supports secure signature verification |
| eDMA Controller | 16-channel, scatter-gather capable; offloads CPU during ADC result buffering, CAN message transfers, and SPI DMA operations |
Applications
| Airbag Control Unit | Electronic Stability Control (ESC) |
|---|---|
|
Use Scenario: Real-time crash detection and pyrotechnic deployment sequencing in passenger vehicles. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-B algorithms with deterministic interrupt latency (<5 µs) and dual-core lockstep not required due to FCU + ECC coverage. Use Value: Integrated safety port FlexCAN ensures redundant communication with seatbelt pretensioners and sensor fusion modules without external arbitration logic. |
Use Scenario: Closed-loop yaw rate and lateral acceleration regulation during emergency maneuvers. IC Role / Device Role / Timing Role: Chassis domain master managing torque vectoring commands via FlexRay while synchronizing wheel speed inputs via eTimer quadrature decode. Use Value: Dual 10-bit ADCs with CTU enable simultaneous sampling of 4 wheel speed sensors with sub-microsecond phase alignment for precise slip calculation. |
| Electric Power Steering (EPS) | Brake-by-Wire Actuator |
|
Use Scenario: High-bandwidth motor current and position feedback processing for assist torque generation. IC Role / Device Role / Timing Role: Real-time motor control unit running FOC algorithms with FlexPWM outputs synchronized to ADC sampling via hardware triggers. Use Value: 8-channel FlexPWM with complementary output pairs and dead-time insertion supports three-phase inverter gate driving with <100 ns timing resolution. |
Use Scenario: Redundant actuation control for hydraulic pressure modulation in brake-by-wire systems. IC Role / Device Role / Timing Role: Safety-critical actuator controller implementing dual-channel FlexCAN (main + safety port) and independent ADC monitoring of pressure transducers. Use Value: 4 analog watchdogs monitor critical voltage rails and sensor outputs, triggering immediate shutdown on out-of-range conditions per ISO 26262 ASIL-D decomposition. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive chassis and safety applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K144 | ARM Cortex-M4F core, 80 MHz, 512 KB Flash, no FlexRay, single CAN FD channel | Lacks FlexRay and dual FlexCAN safety port; targets lower-tier chassis modules where time-triggered networking is not required | Select when migrating to ARM ecosystem and FlexRay is unnecessary; requires revalidation of safety mechanisms |
| Renesas RH850/F1L | 32-bit RXv2 core, 120 MHz, 1 MB Flash, dual CAN FD, no FlexRay, 12-bit ADC | Higher ADC resolution but no FlexRay support; uses different safety architecture (lockstep cores vs. FCU+ECC) | Prefer for CAN FD–centric architectures needing higher compute throughput; not drop-in for FlexRay-dependent designs |
Compared with SPC560P50L3BEFAY, the S32K144 offers higher clock speed and ARM toolchain familiarity but omits FlexRay and safety-port CAN - limiting suitability for time-triggered chassis domains. The RH850/F1L provides greater Flash and ADC precision but replaces FlexRay with CAN FD and uses core lockstep instead of FCU-based diagnostics.
Availability
SPC560P50L3BEFAY is available at Aetrix Electronics and suitable for airbag control units, electronic stability control systems, and electric power steering modules requiring stable component supply under AEC-Q100 Grade 1 qualification and long-term automotive lifecycle support.
Supply support for SPC560P50L3BEFAY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power solutions with broad IP portfolio and AEC-Q100–qualified manufacturing.
The SPC560P series belongs to ST's automotive microcontroller product line, designed specifically for chassis, safety, and body electronics applications demanding ASIL-B compliance, functional safety features, and multi-protocol connectivity (FlexRay/CAN/LIN).
FAQ
What is the maximum operating temperature range for SPC560P50L3BEFAY?
The SPC560P50L3BEFAY is qualified per AEC-Q100 Grade 1, supporting continuous operation from –40 °C to +125 °C ambient temperature. Junction temperature must remain ≤150 °C under all operating conditions, as verified by thermal characterization in Section 3.5 of the datasheet (Doc ID 14723 Rev 9).
Does SPC560P50L3BEFAY support JTAG debugging?
Yes, the device includes IEEE 1149.1 JTAG controller for boundary scan and flash programming. However, for real-time trace and safety-critical firmware analysis, ST recommends using the Nexus L2+ interface instead - which provides hardware-assisted instruction tracing, data watchpoints, and non-intrusive profiling not available via JTAG alone.
How is the safety port FlexCAN physically isolated from the main FlexCAN interface?
The safety port is implemented as a logically separate FlexCAN instance with its own message RAM, filter registers, and error counters - sharing only the physical CAN transceiver interface. Electrical isolation is achieved through separate TX/RX signal routing and independent configuration of bit timing, acceptance masks, and interrupt vectors, as detailed in Section 1.5.21 of the datasheet.
Can the 64 KB data flash be used for EEPROM emulation in production firmware?
Yes, the 4 × 16 KB data flash blocks support EEPROM emulation with built-in wear leveling and atomic write/erase operations managed by ST's SPC560P EEPROM Emulation Library (SPC5-STUDIO). Each block endures ≥100k erase cycles, and the library handles sector rotation to extend effective lifetime beyond 1 million simulated writes.
SPC560P50L3BEFAY Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 100-LQFP
- Series:
- SPC56
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 64MHz
- Connectivity:
- CANbus, LINbus, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 67
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 40K x 8
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 5.5V
- Data Converters:
- A/D 26x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC560P50L3BEFAY FAQ
1.How can I place an order for SPC560P50L3BEFAY through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC560P50L3BEFAY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC560P50L3BEFAY reliable?
The price and inventory of SPC560P50L3BEFAY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC560P50L3BEFAY is usually 5 days.
3.What payment methods are accepted for SPC560P50L3BEFAY?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC560P50L3BEFAY transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC560P50L3BEFAY?
SPC560P50L3BEFAY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC560P50L3BEFAY order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC560P50L3BEFAY?
For technical support, including SPC560P50L3BEFAY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC560P50L3BEFAY requirements.
6.How does Aetrix verify that SPC560P50L3BEFAY is sourced from the original manufacturer or authorized distributors?
All SPC560P50L3BEFAY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC560P50L3BEFAY meets industry standards.
7.What is the process for return or replacement of SPC560P50L3BEFAY?
All SPC560P50L3BEFAY units undergo pre-shipment inspection (PSI). If there is an issue with SPC560P50L3BEFAY, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC560P50L3BEFAY part is unused and in its original packaging.
Return procedure for SPC560P50L3BEFAY:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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