My Inquiry
My Account
STMicroelectronics SPC560P50L3CEFAR
- Part No.:
- SPC560P50L3CEFAR
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
SPC560P50L3CEFAR.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,787
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPC560P50L3CEFAR from STMicroelectronics is a 32-bit Power Architecture® e200z0h-based automotive MCU with 576 KB on-chip Flash (ECC-protected), 40 KB SRAM (ECC-protected), and integrated FlexCAN 2.0B, FlexRay V2.1, LINFlex, DSPI, ADC, and FlexPWM modules. It targets chassis control units, airbag controllers, and electronic stability control systems requiring ASIL-B functional safety compliance.
For engineers reviewing the SPC560P50L3CEFAR datasheet, SPC560P50L3CEFAR pinout, SPC560P50L3CEFAR application, or SPC560P50L3CEFAR equivalent, key selection criteria include dual-channel FlexRay support (up to 10 Mbit/s), safety port CAN capability (7.5 Mbit/s), 10-bit ADC with <1 µs conversion time, and Nexus L2+ debug interface for real-time trace in safety-critical automotive firmware development.
Technical Context
The SPC560P50L3CEFAR implements a single-issue, 64 MHz e200z0h CPU core compliant with Power Architecture® embedded category and supports Variable Length Encoding (VLE) for code density optimization. Its memory subsystem includes 512 KB main Flash with ECC and erase/program controller, plus 64 KB data Flash (4 × 16 KB banks) for EEPROM emulation.
It integrates a fault-tolerant system architecture featuring a programmable watchdog timer, non-maskable interrupt (NMI), Fault Collection Unit (FCU), and ECC protection across Flash and SRAM. The crossbar switch (XBAR) enables concurrent access to peripherals and memory by multiple masters including eDMA, CPU, and FlexRay.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h @ 64 MHz, Power Architecture® embedded category, VLE support for compact firmware footprint |
| Flash Memory | 576 KB total: 512 KB code Flash + 64 KB data Flash; both with ECC and hardware erase/program control |
| SRAM | 40 KB on-chip SRAM with full ECC protection for runtime data integrity in safety-critical tasks |
| ADC | Two 10-bit ADCs, 2×11 dedicated + 4 shared input channels, <1 µs conversion time at full precision |
| FlexRay | Single/dual channel support per configuration, 32 message objects, up to 10 Mbit/s (enabled only on 576 KB Flash variant) |
| FlexCAN Safety Port | Dedicated safety channel with 32 message objects and 7.5 Mbit/s capability; usable as second CAN when not configured for safety |
| Package | LQFP100 (14 × 14 × 1.4 mm), lead-free ECOPACK®, rated for –40°C to 125°C ambient operation |
Pinout & Package
LQFP100 package with 100 leads, 0.5 mm pitch, exposed thermal pad, RoHS-compliant ECOPACK® construction. Designed for automotive PCB layouts requiring thermal reliability and EMI robustness in under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_HV_IO0–VDD_HV_IO3 | High-voltage I/O supply | Independent 3.3 V or 5.0 V power domains for GPIO groups; supports mixed-voltage interfacing |
| VDD_HV_REG | ADC reference supply | Dedicated 3.3 V or 5.0 V analog supply for ADC accuracy and noise immunity |
| VRH/VRP | ADC reference inputs | External high/low reference voltage pins enabling ratiometric or absolute measurement modes |
| FMPLL_IN / FMPLL_OUT | Fractional PLL clock input/output | Supports frequency synthesis from crystal or external clock; enables precise domain clocking for CAN/FlexRay timing |
| CAN0_TX / CAN0_RX | FlexCAN 2.0B channel 0 interface | Differential signaling pair for primary CAN bus; compatible with ISO 11898-2 transceivers |
| FRAY_TXA / FRAY_RXA | FlexRay channel A interface | Differential transmit/receive pair for FlexRay communication; supports up to 10 Mbit/s data rate |
Key Features
| Feature | Design Value |
|---|---|
| Nexus L2+ debug interface | Real-time instruction trace, data watchpoints, and non-intrusive debugging essential for ISO 26262 ASIL-B software validation |
| Safety Port FlexCAN | Hardware-isolated CAN channel with independent message RAM and error counters-enables redundant communication for fail-operational systems |
| ADC Cross Triggering Unit (CTU) | Hardware-synchronized sampling across both ADCs using eTimer or PWM events-critical for motor current sensing in EPS or brake-by-wire |
| Boot Assist Module (BAM) | On-chip UART/CAN bootloader enabling field firmware updates without external programming hardware |
| Fail-safe protection suite | Programmable watchdog (SWT), NMI, FCU, and ECC reporting-provides layered fault detection for ISO 26262 diagnostic coverage |
Applications
| Airbag Control Unit | Electronic Power Steering (EPS) |
|---|---|
Use Scenario: Real-time crash event detection and pyrotechnic deployment sequencing in passenger vehicles. IC Role / Device Role / Timing Role: Primary safety controller executing ASIL-B algorithms with deterministic response to accelerometer and seatbelt sensor inputs. Use Value: Integrated safety port CAN ensures isolated communication with satellite sensors; ECC-protected SRAM prevents corruption of critical deployment flags during EMI events. |
Use Scenario: Closed-loop torque assist control using motor current, steering angle, and vehicle speed feedback. IC Role / Device Role / Timing Role: Motor control MCU synchronizing ADC sampling, PWM generation, and CAN status reporting within ≤100 µs loop time. Use Value: CTU-triggered dual ADC sampling eliminates phase skew between current and position measurements; FlexPWM provides 8 complementary outputs for 3-phase inverter gate drive. |
| Brake-by-Wire Actuator | Electronic Stability Control (ESC) |
Use Scenario: Redundant hydraulic pressure modulation based on yaw rate, lateral acceleration, and wheel speed signals. IC Role / Device Role / Timing Role: Dual-core-equivalent execution via lockstep-capable peripherals and fault collection unit for ASIL-D decomposition. Use Value: FlexRay interface delivers deterministic 10 Mbit/s messaging for time-critical actuator commands; safety port CAN handles fallback diagnostics and status reporting. |
Use Scenario: Coordinating ABS, traction control, and yaw damping functions across distributed ECUs. IC Role / Device Role / Timing Role: Central chassis domain controller managing multi-sensor fusion and CAN/FlexRay gateway functionality. Use Value: 4 DSPI channels enable direct SPI connectivity to IMU, pressure, and temperature sensors; LINFlex interfaces with low-cost body ECUs for cost-optimized architecture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive chassis microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC560P44L3CEFAR | 448 KB Flash, no FlexRay support, same LQFP100 package and peripheral set except FlexRay module disabled | Targeted at cost-sensitive airbag or basic chassis modules where FlexRay is unnecessary | Select when FlexRay bandwidth and redundancy are not required; reduces BOM cost while retaining identical pinout and toolchain compatibility |
| MC9S12XEQ512CPV | 16-bit HCS12X core, 512 KB Flash, no FlexRay or safety port CAN; legacy Freescale architecture | Legacy platform migration path with mature toolchain but lacks ASIL-B-ready features like ECC SRAM or Nexus L2+ | Choose only for brownfield designs requiring minimal firmware rework; lacks modern safety mechanisms and FlexRay timing precision |
Compared with SPC560P44L3CEFAR, the SPC560P50L3CEFAR adds FlexRay and larger Flash for future-proofing, while MC9S12XEQ512CPV offers architectural continuity but falls short on ISO 26262 diagnostic coverage and real-time trace capability.
Availability
SPC560P50L3CEFAR is available at Aetrix Electronics and suitable for automotive airbag control units, electronic power steering systems, and brake-by-wire actuators requiring stable component supply, long-term lifecycle assurance, and ASIL-B-certified silicon.
Supply support for SPC560P50L3CEFAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in automotive, industrial, and power management ICs with strong ISO/TS 16949 manufacturing certification.
The SPC560P series belongs to ST's SPC5 automotive MCU family, designed specifically for chassis and safety applications demanding ASIL-B compliance, functional safety support, and integration of FlexRay, CAN FD-capable FlexCAN, and high-precision analog peripherals.
FAQ
What is the maximum operating junction temperature for SPC560P50L3CEFAR?
The device is qualified for operation up to 150°C junction temperature, with recommended ambient range of –40°C to 125°C. Thermal derating curves and θJA = 35°C/W (LQFP100, 4-layer board) are specified in Section 3.5 of the datasheet to ensure safe thermal design in engine compartment placements.
Does SPC560P50L3CEFAR support CAN FD?
No, it implements FlexCAN 2.0B Active only, supporting up to 1 Mbit/s classical CAN. CAN FD is not supported in this generation; the safety port operates strictly as a 2.0B channel with enhanced isolation and message object partitioning.
How is the 64 KB data flash organized for EEPROM emulation?
It consists of four independent 16 KB sectors, each with full ECC and dedicated erase/program control logic. ST's SPC560P EEPROM Emulation Library (SPC5Studio) manages wear leveling, atomic write operations, and sector rotation across these banks to achieve >100k endurance cycles.
Is the Nexus L2+ interface compatible with standard JTAG debuggers?
Yes-it uses IEEE 1149.1 JTAG for boundary scan and includes Nexus-specific TDI/TDO extensions for real-time trace. Compatible debug probes include Lauterbach TRACE32, iSystem winIDEA, and PLS UDE, all supporting Nexus L2+ event triggering and streaming trace over cJTAG or SWD physical layers.
SPC560P50L3CEFAR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 100-LQFP
- Series:
- SPC56
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 64MHz
- Connectivity:
- CANbus, LINbus, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 67
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 40K x 8
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 5.5V
- Data Converters:
- A/D 26x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC560P50L3CEFAR FAQ
1.How can I place an order for SPC560P50L3CEFAR through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC560P50L3CEFAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC560P50L3CEFAR reliable?
The price and inventory of SPC560P50L3CEFAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC560P50L3CEFAR is usually 5 days.
3.What payment methods are accepted for SPC560P50L3CEFAR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC560P50L3CEFAR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC560P50L3CEFAR?
SPC560P50L3CEFAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC560P50L3CEFAR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC560P50L3CEFAR?
For technical support, including SPC560P50L3CEFAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC560P50L3CEFAR requirements.
6.How does Aetrix verify that SPC560P50L3CEFAR is sourced from the original manufacturer or authorized distributors?
All SPC560P50L3CEFAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC560P50L3CEFAR meets industry standards.
7.What is the process for return or replacement of SPC560P50L3CEFAR?
All SPC560P50L3CEFAR units undergo pre-shipment inspection (PSI). If there is an issue with SPC560P50L3CEFAR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC560P50L3CEFAR part is unused and in its original packaging.
Return procedure for SPC560P50L3CEFAR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPC560P50L3CEFAR Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
