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STMicroelectronics SPC560P50L3CEFAY
- Part No.:
- SPC560P50L3CEFAY
- Manufacturer:
- STMicroelectronics
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
SPC560P50L3CEFAY.pdf
- Description:
- IC MCU 32BIT 512KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,889
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Product details
Overview
SPC560P50L3CEFAY from STMicroelectronics is a 32-bit Power Architecture® e200z0h-based automotive MCU with 576 KB on-chip Flash (ECC-protected), 40 KB SRAM (ECC-protected), and dual 10-bit ADCs (<1 µs conversion time). It integrates FlexCAN 2.0B (32 message objects), safety-port CAN (7.5 Mbit/s), FlexRay V2.1 (10 Mbit/s), and 2 LINFlex channels - deployed in airbag control units and chassis domain controllers requiring ASIL-B compliance.
For engineers reviewing the SPC560P50L3CEFAY datasheet, SPC560P50L3CEFAY pinout, SPC560P50L3CEFAY application, or SPC560P50L3CEFAY equivalent, key selection criteria include ECC-enabled memory architecture, dual-channel FlexRay support, safety port CAN isolation, and LQFP100 package compatibility with automotive thermal and EMI requirements.
Technical Context
The SPC560P50L3CEFAY implements a single-issue e200z0h CPU core running at 64 MHz with Variable Length Encoding (VLE) for code density optimization in safety-critical firmware. Its memory subsystem includes 576 KB Flash with integrated erase/program controller and ECC, plus 40 KB SRAM with ECC and 64 KB data flash for EEPROM emulation.
Peripherals are orchestrated via a crossbar switch (XBAR) enabling concurrent access to FlexCAN, FlexRay, DSPI, and ADC resources. The safety port leverages dedicated FlexCAN hardware with independent message RAM and clock domain separation to meet ISO 26262 ASIL-B requirements without software arbitration overhead.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | e200z0h @ 64 MHz, Power Architecture® embedded category, VLE support for compact firmware footprint |
| Flash Memory | 576 KB on-chip code flash with ECC, erase/program controller, and 100k-cycle endurance |
| SRAM | 40 KB on-chip SRAM with ECC, supporting lock-step or split-mode operation for fault detection |
| ADC | Two 10-bit ADCs, 11+4 shared input channels, <1 µs full-precision conversion time including sampling |
| FlexRay | Single/dual channel V2.1 module, 32 message objects, up to 10 Mbit/s - enabled only on 576 KB Flash variants |
| Safety Port | Dedicated FlexCAN interface with 32 message objects, isolated clock domain, and 7.5 Mbit/s capability for fail-operational CAN paths |
| Package | LQFP100 (14 × 14 × 1.4 mm), RoHS-compliant ECOPACK®, rated for –40°C to 125°C ambient |
Pinout & Package
LQFP100 package with 100 leads, 0.5 mm pitch, exposed thermal pad, and standard JEDEC MO-215 footprint. Designed for reflow soldering and automotive under-hood thermal cycling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_HV_IO0–VDD_HV_IO3 | High-voltage I/O supply | Independent 3.3 V or 5.0 V supplies per I/O group; supports mixed-voltage interfacing with external transceivers |
| VDD_HV_REG | ADC reference supply | Dedicated 3.3 V or 5.0 V analog supply for ADC accuracy; decoupling required per datasheet Figure 6 |
| VRH/VRP | ADC reference inputs | External high/low reference pair enabling ratiometric or absolute voltage measurement modes |
| CAN0_TX/CAN0_RX | FlexCAN channel 0 differential interface | Direct connection to external CAN transceiver; supports 1 Mbit/s nominal and safety-port arbitration |
| FRAY0_TX/FRAY0_RX | FlexRay channel 0 differential interface | Terminated 100 Ω differential pair for 10 Mbit/s operation; requires external bus driver and stub filtering |
| NEXUS_TDI/NEXUS_TDO | Nexus L2+ debug interface | IEEE 1149.1-compatible trace and real-time debugging; supports instruction trace and data watchpoints |
Key Features
| Feature | Design Value |
|---|---|
| ECC-protected memory subsystem | Hardware-detectable/correctable single-bit errors in Flash and SRAM - eliminates need for software scrubbing in ASIL-B designs |
| Safety port CAN | Dedicated FlexCAN instance with independent message RAM and clock domain - enables fail-operational dual-CAN architectures without software arbitration |
| ADC Cross Triggering Unit (CTU) | Hardware-synchronized sampling across both ADCs using eTimer or FlexPWM events - eliminates CPU intervention for multi-sensor timing alignment |
| Boot Assist Module (BAM) | On-chip CAN/UART bootloader with secure signature verification - enables field firmware updates without external programming hardware |
| Fail-safe protection unit | Programmable watchdog timer, non-maskable interrupt, and Fault Collection Unit (FCU) with error logging to SRAM - supports diagnostic event recording for ISO 26262 DFMEA |
Applications
| Airbag Control Unit | Chassis Domain Controller |
|---|---|
Use Scenario: Real-time deployment of crash algorithms using accelerometer and pressure sensor inputs. IC Role / Device Role / Timing Role: Primary safety MCU executing ASIL-B firmware with deterministic interrupt latency for pyro fuse triggering. Use Value: Dual 10-bit ADCs with CTU synchronization capture sensor data within <1 µs window; ECC memory prevents latent corruption in critical decision logic. |
Use Scenario: Coordinating brake-by-wire, steering angle, and suspension actuators across CAN FD and FlexRay networks. IC Role / Device Role / Timing Role: Chassis domain master managing time-triggered FlexRay communication and safety-critical CAN message scheduling. Use Value: FlexRay V2.1 at 10 Mbit/s enables deterministic 5 ms cycle times; safety port CAN provides redundant path for brake command arbitration. |
| Electronic Stability Control (ESC) | Advanced Driver Assistance Systems (ADAS) Sensor Fusion Hub |
Use Scenario: Closed-loop yaw rate and lateral acceleration control using wheel speed and IMU inputs. IC Role / Device Role / Timing Role: Real-time motion controller with sub-100 µs loop execution and hardware-accelerated PID computation. Use Value: eTimer quadrature decode and cascaded counters directly interface ABS wheel sensors; 64 MHz e200z0h core sustains 20 kHz control loops. |
Use Scenario: Aggregating radar, camera, and ultrasonic sensor data for object classification and path prediction. IC Role / Device Role / Timing Role: Sensor fusion hub with time-synchronized ADC sampling and FlexCAN/FlexRay gateway functionality. Use Value: Two independent ADCs with programmable CTU trigger sources align multi-sensor acquisition; 576 KB Flash stores neural network inference models and calibration tables. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC560P44L3CEFAY | 448 KB Flash, no FlexRay support, same LQFP100 package and peripheral set except FlexRay | Targeted at cost-sensitive airbag modules without FlexRay bus requirements | Select when FlexRay bandwidth and dual-CAN safety port are not required; reduces BOM cost by ~12% |
| MC9S12XEQ512MALR | 16-bit HCS12X core, 512 KB Flash, no FlexRay, LIN-only comms, no ECC on SRAM | Legacy chassis systems requiring pin-compatible upgrade path from S12X platform | Choose only for brownfield redesigns where toolchain continuity outweighs ASIL-B certification burden of newer architectures |
Compared with SPC560P50L3CEFAY, the SPC560P44L3CEFAY sacrifices FlexRay and reduces Flash for lower cost in non-FlexRay airbag systems, while the MC9S12XEQ512MALR offers legacy compatibility but lacks ECC, FlexRay, and ASIL-B-ready peripherals - making it unsuitable for new safety-critical designs.
Availability
SPC560P50L3CEFAY is available at Aetrix Electronics and suitable for airbag control units, chassis domain controllers, and electronic stability control systems requiring stable component supply across automotive production lifecycles.
Supply support for SPC560P50L3CEFAY includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader specializing in automotive, industrial, and power solutions, with over 40 years of microcontroller innovation and ISO/TS 16949-certified manufacturing.
The SPC560P series targets automotive chassis and safety applications, delivering ASIL-B compliant MCUs with integrated functional safety features, ECC memory, and time-triggered communication interfaces like FlexRay and safety-port CAN.
FAQ
What is the maximum operating junction temperature for SPC560P50L3CEFAY?
The device is qualified for operation up to 150°C junction temperature, with thermal characteristics specified in Table 13 for LQFP100 package. Derating curves in Section 3.5.2 require maintaining TJ ≤ 150°C under worst-case power dissipation and ambient conditions, verified via θJA = 42°C/W.
Does SPC560P50L3CEFAY support JTAG boundary scan?
Yes, it integrates IEEE 1149.1 JTAG controller with TCK, TMS, TDI, TDO, and TRST pins. Boundary scan testing is supported per Table 39 AC characteristics, with TCK frequency up to 10 MHz and setup/hold times validated for production test environments.
How is the safety port CAN functionally isolated from the main FlexCAN interface?
The safety port uses physically separate message RAM, dedicated clock domain (derived from FMPLL safety divider), and independent interrupt vector. It shares no register space or arbitration logic with main FlexCAN, satisfying ISO 26262 hardware independence requirements for ASIL-B decomposition.
Can the 64 KB data flash be used for EEPROM emulation in production firmware?
Yes, the 4 × 16 KB data flash blocks support byte-level erase and program operations with ECC, enabling robust EEPROM emulation. ST provides SPC560Pxx Data Flash Driver library (UM1572) with wear-leveling and atomic write routines qualified for 100k-cycle endurance.
SPC560P50L3CEFAY Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- 100-LQFP
- Series:
- SPC56
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- e200z0h
- Core Size:
- 32-Bit Single-Core
- Speed:
- 64MHz
- Connectivity:
- CANbus, LINbus, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 67
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 40K x 8
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 5.5V
- Data Converters:
- A/D 26x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC560P50L3CEFAY FAQ
1.How can I place an order for SPC560P50L3CEFAY through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC560P50L3CEFAY on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC560P50L3CEFAY reliable?
The price and inventory of SPC560P50L3CEFAY are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC560P50L3CEFAY is usually 5 days.
3.What payment methods are accepted for SPC560P50L3CEFAY?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC560P50L3CEFAY transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC560P50L3CEFAY?
SPC560P50L3CEFAY orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC560P50L3CEFAY order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC560P50L3CEFAY?
For technical support, including SPC560P50L3CEFAY datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC560P50L3CEFAY requirements.
6.How does Aetrix verify that SPC560P50L3CEFAY is sourced from the original manufacturer or authorized distributors?
All SPC560P50L3CEFAY products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC560P50L3CEFAY meets industry standards.
7.What is the process for return or replacement of SPC560P50L3CEFAY?
All SPC560P50L3CEFAY units undergo pre-shipment inspection (PSI). If there is an issue with SPC560P50L3CEFAY, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC560P50L3CEFAY part is unused and in its original packaging.
Return procedure for SPC560P50L3CEFAY:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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