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NXP Semiconductors SPC5642AF2MVZ3

Part No.:
SPC5642AF2MVZ3
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
324-BBGA
Datasheet:
AetrixSPC5642AF2MVZ3.pdf
Description:
IC MCU 32BIT 2MB FLASH 324PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,849

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Product details

Overview

SPC5642AF2MVZ3 from NXP Semiconductors (formerly Freescale) is a 32-bit Power Architecture® automotive microcontroller featuring a 150 MHz e200z4 core, 2 MB on-chip flash with ECC and read-while-write, 128 KB SRAM with ECC and standby mode, and integrated FlexRay v2.1 (10 Mbit/s), triple FlexCAN (64 message buffers each), and dual eQADCs supporting 40 analog inputs. It targets engine control units (ECUs) and transmission control modules requiring ASIL-B functional safety compliance.

For engineers reviewing the SPC5642AF2MVZ3 datasheet, SPC5642AF2MVZ3 pinout, SPC5642AF2MVZ3 application, or SPC5642AF2MVZ3 equivalent, key selection considerations include its 208-ball MAPBGA package (13 × 13 mm), FMPLL clock generation with frequency modulation, junction temperature sensor (±20°C accuracy), and Nexus Class 3+ debug support for real-time trace in safety-critical development.

Technical Context

The SPC5642AF2MVZ3 implements a superscalar e200z4 core with VLE encoding, dual execution units, and SPE/EFPU2 extensions enabling both fixed-point SIMD and single-precision floating-point operations. Its memory subsystem includes 8 KB 2-/4-way instruction cache, 2 MB flash with RWW and ECC, and 128 KB SRAM with ECC and 32 KB low-power standby partition.

Peripherals are interconnected via a 4×4 crossbar switch supporting concurrent CPU, eDMA, FlexRay, and instruction bus access to flash, SRAM, calibration bus, and peripheral bridge. Safety features include a 16-entry MPU, CRC unit with three submodules, ECSM for ECC error reporting, and hardware-assisted reaction module (REACM) offloading current control loops from the CPU.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture e200z4 Power Architecture® with VLE, superscalar dual-issue, 150 MHz max frequency
Flash Memory 2 MB with ECC, read-while-write capability, and flash fetch accelerator (4×128-bit)
SRAM 128 KB total: 32 KB in standby mode with ECC, rest with ECC protection
FlexRay Interface V2.1 compliant, up to 10 Mbit/s, dual/single channel, 128 message objects, ECC support
eQADC Performance 40-channel 12-bit ADC, 688 ns minimum conversion time, 6 command queues with DMA trigger
Temperature Sensor Accuracy ±20°C over full operating range - enables on-die thermal monitoring without external sensors
Package 208-ball MAPBGA, 13 × 13 mm body, 0.8 mm pitch - pinout compatible with MPC5634M family

Pinout & Package

SPC5642AF2MVZ3 is housed in a 208-ball MAPBGA package (13 × 13 mm, 0.8 mm pitch) with exposed thermal pad. Pin assignments follow Freescale's standardized ballmap for MPC563xM family compatibility. Ball A1 is corner reference; power/ground balls are distributed across multiple banks for EMI suppression and thermal management.

Pin/Terminal Circuit Role Design Meaning
VDD_MAIN Main supply (5 V) Primary core and I/O domain power; requires external ballast resistor per datasheet Section 3.6.1
VDD_IO I/O supply (3.3 V) Separate rail for GPIO and peripheral I/O; supports programmable hysteresis thresholds
VDD_CORE Core supply (1.2 V) Internal regulator input; must be supplied externally or derived via integrated voltage regulator
FMPLL_REFCLK FMPLL reference input Accepts 4–40 MHz crystal or external clock; feeds frequency-modulated PLL for system clock synthesis
FLEXRAY_TXD / FLEXRAY_RXD FlexRay differential pair LVDS-capable pins supporting 10 Mbit/s differential signaling; require 100 Ω termination
EVTO Development Trigger Semaphore output Open-drain signal for synchronization with external debug tools (e.g., Lauterbach TRACE32)

Key Features

Feature Design Value
Nexus Class 3+ Debug Real-time instruction trace, data trace, and exception trace - enables ISO 26262 ASIL-B verification without code instrumentation
Reaction Module (REACM) 6-channel hardware co-processor that closes current control loops with eQADC/eTPU2 - eliminates CPU latency in motor control
Boot Assist Module (BAM) ROM-resident bootloader supporting CAN/SCI-based firmware update - enables field reprogramming without JTAG
FMPLL Frequency Modulation Reduces electromagnetic emissions by spreading clock spectrum - meets CISPR 25 Class 5 requirements for automotive EMI
eTPU2 Real-Time Processing 32-channel second-generation time processor with 6-reaction-module outputs - handles cam/crank timing, PWM generation, and encoder decoding autonomously

Applications

Engine Control Unit (ECU) Automatic Transmission Control Module (TCM)

Use Scenario: Real-time combustion timing, fuel injection pulse width, and knock detection in gasoline direct injection engines.

IC Role / Device Role / Timing Role: Primary controller executing closed-loop PID algorithms at 10 kHz sample rate using eTPU2 and REACM for deterministic timing.

Use Value: 150 MHz e200z4 core with SPE/EFPU2 delivers >1.2 DMIPS/MHz for simultaneous sensor fusion and actuator control - reduces need for companion DSP.

Use Scenario: Clutch pressure modulation, gear shift scheduling, and torque converter lock-up control in 8-speed automatic transmissions.

IC Role / Device Role / Timing Role: Safety-critical host MCU managing ASIL-B functions via MPU-enforced memory isolation and CRC-protected flash updates.

Use Value: Triple FlexCAN interfaces enable redundant communication with valve body controllers, while FlexRay provides deterministic 10 Mbit/s backbone for shift coordination.

Electric Power Steering (EPS) Controller Hybrid Vehicle Inverter Control

Use Scenario: Torque assist calculation, motor position feedback processing, and fault-tolerant steering angle validation.

IC Role / Device Role / Timing Role: Dual eQADCs acquire resolver signals at 688 ns resolution; eTPU2 generates precise 20 kHz PWM for BLDC motor drive.

Use Value: Junction temperature sensor (±20°C) enables real-time thermal derating of motor current - avoids external thermal sensors and PCB space.

Use Scenario: DC-link voltage monitoring, IGBT gate drive timing, and phase current reconstruction in 400 V traction inverters.

IC Role / Device Role / Timing Role: eMIOS channels generate synchronized dead-time-controlled PWM; eQADC triggers conversions on PWM edges for accurate current sampling.

Use Value: 2 MB flash with ECC and RWW allows safe over-the-air (OTA) firmware updates during vehicle idle - no runtime interruption required.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPC5643L Same e200z4 core but 128 MB flash, no FlexRay, only dual FlexCAN, 176 LQFP package Lacks FlexRay and reduced CAN capacity - suitable for cost-sensitive ECUs without high-speed backbone requirements Select when FlexRay is not required and LQFP assembly is preferred over BGA
SPC560P50L5 Lower-performance e200z0 core (80 MHz), 1 MB flash, no eTPU2 or REACM, 144 LQFP No hardware-accelerated real-time peripherals - requires CPU intervention for timing-critical tasks Choose for entry-level transmission control where deterministic sub-microsecond response is not mandated

Compared with SPC5642AF2MVZ3, MPC5643L sacrifices FlexRay and flash size for lower cost and simpler packaging, while SPC560P50L5 trades real-time peripheral acceleration and clock speed for reduced BOM and thermal footprint - neither offers drop-in replacement due to pinout, peripheral, or safety feature mismatches.

Availability

SPC5642AF2MVZ3 is available at Aetrix Electronics and suitable for engine control units, automatic transmission control modules, and electric power steering systems requiring stable component supply across extended automotive lifecycles.

Supply support for SPC5642AF2MVZ3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in Power Architecture® MCU design.

The SPC5642AF2MVZ3 belongs to NXP's Qorivva automotive MCU family, engineered specifically for ASIL-B compliant powertrain and chassis control applications demanding high computational throughput, functional safety, and real-time determinism.

FAQ

What is the maximum operating frequency of the SPC5642AF2MVZ3?

The SPC5642AF2MVZ3 operates at a maximum core frequency of 150 MHz, enabled by its e200z4 Power Architecture® core with superscalar dual-issue execution and variable-length instruction encoding (VLE). This frequency is sustained under full load with appropriate thermal management and voltage regulation per the datasheet's DC electrical specifications. The FMPLL supports dynamic frequency scaling within this range for power optimization.

Does the SPC5642AF2MVZ3 support functional safety standards like ISO 26262?

Yes, the SPC5642AF2MVZ3 is designed to support ISO 26262 ASIL-B compliance through integrated safety mechanisms including a 16-entry MPU for memory isolation, CRC units for data integrity, ECC on flash and SRAM, error-correcting status reporting via ECSM, and Nexus Class 3+ debug for trace-based verification. These features are documented in the device reference manual and safety manual (UM10292).

What package type and dimensions does the SPC5642AF2MVZ3 use?

The SPC5642AF2MVZ3 uses a 208-ball MAPBGA package measuring 13 × 13 mm with 0.8 mm ball pitch and an exposed thermal pad. It is pinout-compatible with Freescale's MPC5634M devices and upwardly compatible with the standardized MPC563xM family ballmap, facilitating migration and layout reuse in automotive ECU designs.

Can the SPC5642AF2MVZ3 perform firmware updates in the field without interrupting operation?

Yes, the SPC5642AF2MVZ3 supports read-while-write (RWW) functionality in its 2 MB flash memory, allowing background firmware updates via CAN or SCI bootloaders while executing application code from another flash bank. The Boot Assist Module (BAM) enables secure, authenticated updates without requiring JTAG access or system reset.

What is the role of the Reaction Module (REACM) in the SPC5642AF2MVZ3?

The Reaction Module (REACM) in the SPC5642AF2MVZ3 is a dedicated 6-channel hardware accelerator that works with eQADC and eTPU2 to close current control loops autonomously - for example, in electric power steering or inverter control. It eliminates CPU intervention for sub-microsecond timing-critical responses, reducing jitter and improving ASIL-B compliance by offloading deterministic real-time tasks.

SPC5642AF2MVZ3 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
324-BBGA
Series:
MPC56xx Qorivva
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
e200z4
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, LINbus, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
151
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
1.14V ~ 5.25V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

SPC5642AF2MVZ3 FAQ

1.How can I place an order for SPC5642AF2MVZ3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SPC5642AF2MVZ3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SPC5642AF2MVZ3 reliable?

The price and inventory of SPC5642AF2MVZ3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5642AF2MVZ3 is usually 5 days.

3.What payment methods are accepted for SPC5642AF2MVZ3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5642AF2MVZ3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SPC5642AF2MVZ3?

SPC5642AF2MVZ3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SPC5642AF2MVZ3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SPC5642AF2MVZ3?

For technical support, including SPC5642AF2MVZ3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5642AF2MVZ3 requirements.

6.How does Aetrix verify that SPC5642AF2MVZ3 is sourced from the original manufacturer or authorized distributors?

All SPC5642AF2MVZ3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5642AF2MVZ3 meets industry standards.

7.What is the process for return or replacement of SPC5642AF2MVZ3?

All SPC5642AF2MVZ3 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5642AF2MVZ3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SPC5642AF2MVZ3 part is unused and in its original packaging.

Return procedure for SPC5642AF2MVZ3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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