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NXP Semiconductors SPC5644AF0MMG3
- Part No.:
- SPC5644AF0MMG3
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 208-BGA
- Datasheet:
-
SPC5644AF0MMG3.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 208MAPBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
SPC5644AF0MMG3 from NXP Semiconductors (formerly Freescale) is a 32-bit Power Architecture® microcontroller designed for automotive powertrain and chassis control systems. It features a 150 MHz e200z4 core, 4 MB on-chip flash with ECC and Read-While-Write, 192 KB SRAM with ECC, triple FlexCAN interfaces (64 message buffers each), FlexRay v2.1 up to 10 Mbit/s, and dual eQADCs supporting 40 12-bit channels with 688 ns minimum conversion time.
For engineers reviewing the SPC5644AF0MMG3 datasheet, SPC5644AF0MMG3 pinout, SPC5644AF0MMG3 application, or SPC5644AF0MMG3 equivalent, key selection considerations include its ASIL-B capable safety architecture (MPU, CRC, ECSM, temperature sensor), dual eTPU2 modules for real-time timing-critical actuation, and support for Nexus Class 3+ debug in production-grade 324-ball TEPBGA packaging.
Technical Context
The SPC5644AF0MMG3 implements a superscalar e200z4 core with VLE encoding, dual execution units, and SPE/FP support - enabling up to 2 integer or floating-point instructions per cycle and 4 MAC operations per cycle. Its memory subsystem integrates a 24-entry MMU, 8 KB configurable instruction cache, and 5×4 crossbar switch routing traffic among CPU, eDMA, FlexRay, EBI, and peripheral bridge.
Real-time I/O processing is handled by dedicated hardware: eMIOS (24 unified channels), eTPU2 (32 standard + 6 reaction module channels), and two eQADCs with 6 command queues, trigger/DMA support, and decimation filtering. Safety-critical operation is reinforced by a 16-entry MPU, CRC unit with three sub-modules, and junction temperature sensor with ±20°C accuracy.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | e200z4 Power Architecture® CPU, 150 MHz max frequency, VLE & SPE support |
| Flash Memory | 4 MB on-chip, with ECC (single-bit correction/double-bit detection), Read-While-Write capability |
| SRAM | 192 KB on-chip, 32 KB with standby mode, ECC protection enabled |
| FlexCAN Interfaces | 3 independent controllers, each supporting 64 message buffers and ISO 11898-1 compliance |
| FlexRay | Single-channel v2.1 module, 10 Mbit/s data rate, 128 message objects, ECC protected |
| eQADC | Dual 12-bit converters, 40 multiplexed input channels, 688 ns min conversion time, 6 command queues |
| Package | 324-ball TEPBGA (23 mm × 23 mm), RoHS-compliant, lead-free |
| Safety Features | 16-entry MPU, CRC unit (3 sub-modules), ECSM, junction temperature sensor (±20°C accuracy) |
Pinout & Package
SPC5644AF0MMG3 is housed in a 324-ball TEPBGA package (23 mm × 23 mm, 0.8 mm pitch), optimized for automotive thermal and mechanical reliability. Ballmap follows standardized MPC5xxx family layout, upwardly compatible with MPC5554/MPC5567/MPC5666.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_MAIN | Main supply rail | 5 V nominal input; powers core logic, flash, and most peripherals |
| VDD_IO | I/O supply rail | 3.3 V nominal; powers GPIO, CAN transceivers, and digital interface pads |
| VDD_RTC | Real-time clock supply | Independent 3.3 V domain enabling low-power RTC operation during stop mode |
| VRST_B | Reset input | Active-low asynchronous reset pin with glitch filter; initiates full system reset sequence |
| FSCLK | FlexRay clock input | Accepts external 10–20 MHz clock source for FlexRay module synchronization |
| EVTO | External trigger output | Nexus-triggered event output used for synchronized data acquisition with external debug tools |
| MSC_UPLINK_A | Micro Second Channel uplink | DSPI-based high-speed diagnostic bus for calibration and flash programming via BAM |
Key Features
| Feature | Design Value |
|---|---|
| Fail-Safe Protection | Integrated 16-entry MPU, CRC unit with three independent sub-modules, and error correction status monitoring (ECSM) for memory and bus integrity |
| Real-Time Timing Engine | eTPU2 with 32 standard channels + 6-reaction-module channels enables precise PWM generation, encoder capture, and closed-loop actuator control without CPU load |
| Automotive Network Integration | Triple FlexCAN (ISO 11898-1), FlexRay v2.1 (10 Mbit/s), and DSPI with LVDS support for deterministic multi-bus communication in powertrain ECUs |
| Calibration & Debug Support | Nexus Class 3+ for e200z4 core, Class 1 for eTPU, JTAG (5-pin), and Boot Assist Module (BAM) with MSC uplink for field firmware updates |
| Power Management | Multiple low-power modes (slow, stop, stand-by), programmable voltage regulator controller (VRC), and flexible supply scheme (5 V/3.3 V/1.2 V) |
| Analog Signal Acquisition | Dual eQADCs with 40-channel multiplexing, 6 command queues, DMA-triggered conversions, and decimation filtering for engine sensor signal conditioning |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
Use Scenario: Real-time management of fuel injection timing, ignition spark advance, throttle position, and exhaust gas recirculation in gasoline and diesel engines. IC Role / Device Role / Timing Role: Primary host controller executing ASAM-compliant calibration algorithms, managing CAN/FlexRay network coordination, and performing sub-microsecond timing-critical eTPU2-based actuator control. Use Value: Enables deterministic 150 MHz execution of ISO 26262 ASIL-B compliant control loops with hardware-enforced memory protection and CRC-verified flash updates. | Use Scenario: Closed-loop hydraulic pressure control, gear shift scheduling, torque converter clutch management, and adaptive learning in automatic transmissions. IC Role / Device Role / Timing Role: Central timing and communication hub synchronizing solenoid drivers, speed sensors, and CAN-based vehicle network messages using eMIOS and FlexCAN. Use Value: Delivers <688 ns ADC sampling resolution and eTPU2-based PWM generation for precise 10–100 Hz pressure modulation across multiple hydraulic circuits. |
| Electric Power Steering (EPS) | Brake Control Unit (BCU) |
Use Scenario: Torque assist calculation, motor current regulation, fault detection, and CAN-based driver assistance integration in column- and rack-mounted EPS systems. IC Role / Device Role / Timing Role: Safety-monitored controller running dual-core lockstep software (via MPU partitioning), interfacing with torque sensor, motor encoder, and CAN FD gateway. Use Value: Supports ASIL-C decomposition through hardware MPU isolation, CRC-protected RAM/flash, and temperature-aware derating based on integrated junction sensor. | Use Scenario: ABS, EBD, and ESC functionality requiring synchronized wheel speed sampling, hydraulic valve actuation, and VSA coordination via FlexRay backbone. IC Role / Device Role / Timing Role: High-integrity real-time node with FlexRay v2.1 interface, dual eQADCs for analog sensor fusion, and eTPU2 for valve timing precision. Use Value: Achieves <10 µs jitter in valve driver timing and 12-bit analog resolution across 40 channels for simultaneous wheel speed and pressure monitoring. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5644AF0MLG3 | Same die, 208-ball MAPBGA package (24 mm × 24 mm); lower I/O count and thermal dissipation vs. TEPBGA | Preferred for space-constrained modules where 324-ball footprint is prohibitive; reduced FlexRay/EBI routing flexibility | Select when board area is constrained and full 324-ball thermal/mechanical performance is not required |
| SPC5643LK0MLL3 | 120 MHz e200z3 core, 2 MB flash, no FlexRay, single eQADC, 176 LQFP package | Targeted at cost-sensitive chassis modules (e.g., body control) lacking FlexRay or dual ADC requirements | Choose for non-safety-critical or lower-performance applications where FlexRay and ASIL-B certification are not mandated |
Compared with SPC5644AF0MMG3, MPC5644AF0MLG3 offers identical functionality in a smaller package but with reduced thermal margin and pin count, while SPC5643LK0MLL3 provides a lower-cost, lower-performance alternative without FlexRay or dual eQADC - making it suitable only for non-safety-critical automotive domains.
Availability
SPC5644AF0MMG3 is available at Aetrix Electronics and suitable for automotive powertrain control, transmission management, electric power steering, and brake control systems requiring stable component supply, long-term lifecycle assurance, and ASIL-B functional safety compliance.
Supply support for SPC5644AF0MMG3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in Power Architecture® MCU development.
The SPC5644AF0MMG3 belongs to the Qorivva MPC56xx family - engineered specifically for ASIL-B automotive powertrain and chassis control, emphasizing real-time determinism, functional safety, and multi-network integration (CAN, FlexRay, LIN).
FAQ
What is the maximum operating frequency of the SPC5644AF0MMG3?
The SPC5644AF0MMG3 operates at a maximum core frequency of 150 MHz. This is achieved using the on-chip FMPLL with programmable multiplication factors and supported by the e200z4 superscalar architecture, which delivers up to 2 integer or floating-point instructions per cycle. The SPC5644AF0MMG3 maintains this frequency under full industrial temperature range (–40°C to +125°C) with appropriate voltage and cooling conditions.
Does the SPC5644AF0MMG3 support functional safety standards like ISO 26262?
Yes, the SPC5644AF0MMG3 is designed to support ASIL-B compliance per ISO 26262. It includes hardware safety mechanisms such as a 16-entry MPU for memory access control, CRC unit with three independent sub-modules for data path integrity, Error Correction Status Module (ECSM), and a junction temperature sensor with ±20°C accuracy. These features are documented in the MPC5644A Functional Safety Manual and enable systematic fault mitigation in safety-critical automotive applications.
What packages are available for the SPC5644AF0MMG3, and which one does this part number correspond to?
The SPC5644AF0MMG3 corresponds exclusively to the 324-ball TEPBGA package (23 mm × 23 mm, 0.8 mm pitch). Other variants include MPC5644AF0MLG3 (208-ball MAPBGA) and MPC5644AF0MKG3 (176-pin LQFP). The 'MM' in SPC5644AF0MMG3 explicitly denotes the TEPBGA variant per NXP's ordering nomenclature, and this package supports full pinout compatibility with MPC5554/MPC5567/MPC5666 ballmaps.
Can the SPC5644AF0MMG3 execute code from internal flash while simultaneously writing to another flash sector?
Yes, the SPC5644AF0MMG3 supports Read-While-Write (RWW) operation in its 4 MB on-chip flash memory. This allows concurrent CPU instruction fetch or data read from one flash block while programming or erasing another block - essential for safe over-the-air (OTA) firmware updates. RWW is enabled via flash controller configuration and requires proper sector locking/unlocking sequences defined in the MPC5644A Flash Programming User's Manual.
What debug and calibration interfaces does the SPC5644AF0MMG3 provide?
The SPC5644AF0MMG3 provides Nexus Class 3+ debug for the e200z4 core and Class 1 for the eTPU, plus a 5-pin JTAG interface and Development Trigger Semaphore (DTS) with EVTO pin for synchronized data acquisition. It also includes a Boot Assist Module (BAM) with Micro Second Channel (MSC) uplink support via DSPI, enabling calibration and flash programming using Freescale's VertiCal Calibration System and compatible third-party tools.
SPC5644AF0MMG3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 208-BGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 80MHz
- Connectivity:
- CANbus, EBI/EMI, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 1.32V
- Data Converters:
- A/D 40x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5644AF0MMG3 FAQ
1.How can I place an order for SPC5644AF0MMG3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5644AF0MMG3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5644AF0MMG3 reliable?
The price and inventory of SPC5644AF0MMG3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5644AF0MMG3 is usually 5 days.
3.What payment methods are accepted for SPC5644AF0MMG3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5644AF0MMG3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5644AF0MMG3?
SPC5644AF0MMG3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5644AF0MMG3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5644AF0MMG3?
For technical support, including SPC5644AF0MMG3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5644AF0MMG3 requirements.
6.How does Aetrix verify that SPC5644AF0MMG3 is sourced from the original manufacturer or authorized distributors?
All SPC5644AF0MMG3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5644AF0MMG3 meets industry standards.
7.What is the process for return or replacement of SPC5644AF0MMG3?
All SPC5644AF0MMG3 units undergo pre-shipment inspection (PSI). If there is an issue with SPC5644AF0MMG3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5644AF0MMG3 part is unused and in its original packaging.
Return procedure for SPC5644AF0MMG3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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