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NXP Semiconductors SPC5644AF0MVZ1R
- Part No.:
- SPC5644AF0MVZ1R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 324-BBGA
- Datasheet:
-
SPC5644AF0MVZ1R.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 324PBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,280
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Product details
Overview
SPC5644AF0MVZ1R from NXP Semiconductors (formerly Freescale) is a 32-bit Power Architecture® microcontroller designed for automotive powertrain and chassis control systems. It features a 150 MHz e200z4 core, 4 MB on-chip flash with ECC, 192 KB SRAM with ECC, triple FlexCAN interfaces (64 messages each), FlexRay v2.1 (10 Mbit/s), and dual eQADCs with 40 12-bit channels. It operates across –40°C to 125°C and supports ASIL-B functional safety requirements.
For engineers reviewing the SPC5644AF0MVZ1R datasheet, SPC5644AF0MVZ1R pinout, SPC5644AF0MVZ1R application, or SPC5644AF0MVZ1R equivalent, key selection criteria include dual-core-ready eTPU2 timing precision, FMPLL clock modulation for EMI reduction, Nexus Class 3+ debug support, and validated operation in engine control units requiring ISO 26262-compliant runtime diagnostics.
Technical Context
The SPC5644AF0MVZ1R implements a superscalar e200z4 core with VLE encoding, dual execution units, and SPE/FP support-enabling up to 2 integer or floating-point instructions per cycle and 4 MAC operations per cycle. Its memory subsystem includes 8 KB instruction cache (2-/4-way), 4 MB flash with Read-While-Write and ECC, and 192 KB SRAM with standby mode and ECC.
Peripherals are orchestrated via a 5×4 crossbar switch supporting concurrent master access (CPU, eDMA, FlexRay, EBI, instruction bus) to four slave domains (Flash, SRAM, Calibration/EBI bus, Peripheral Bridge). Safety-critical functions are reinforced by a 16-entry MPU, CRC unit with three submodules, junction temperature sensor (±20°C accuracy), and hardware-assisted boot integrity via BAM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | e200z4 Power Architecture® CPU @ 150 MHz - enables deterministic real-time execution with VLE compression and SPE/FP acceleration for control-law computation. |
| Flash Memory | 4 MB with ECC and Read-While-Write - supports safe over-the-air updates and concurrent code execution during firmware reprogramming. |
| SRAM | 192 KB with ECC and standby mode - retains critical state data during low-power stop modes while ensuring bit-error resilience. |
| FlexCAN | 3 × controllers, 64 message buffers each - provides redundant CAN communication paths for ASIL-B domain controllers without external arbitration logic. |
| FlexRay | v2.1, dual/single channel, 128 message objects, ECC - delivers deterministic, fault-tolerant time-triggered networking at up to 10 Mbit/s for brake-by-wire or steer-by-wire gateways. |
| eQADC | 2 × 12-bit converters, 40 multiplexed inputs, 688 ns min conversion - captures high-fidelity analog sensor data (e.g., crankshaft position, knock, pressure) with precise trigger synchronization. |
| eTPU2 | 32-channel second-generation enhanced timer - executes complex waveform generation (e.g., fuel injection timing, ignition spark control) autonomously without CPU intervention. |
Pinout & Package
SPC5644AF0MVZ1R is packaged in a 324-ball TEPBGA (23 mm × 23 mm, 0.8 mm pitch), optimized for automotive thermal and mechanical reliability under extended temperature operation. The package supports full I/O drive strength, differential signaling (LVDS on DSPI_B/C), and dedicated Nexus debug pins (NEXUS_TDI, NEXUS_TDO, etc.).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_MAIN | Main supply (5 V) | Power domain for core logic, I/O banks, and analog peripherals; requires external ballast resistor per datasheet Section 3.7. |
| VDD_3V3 | I/O and peripheral supply (3.3 V) | Supplies GPIO, CAN transceivers, DSPI, eSCI; decoupled separately to meet noise immunity requirements for automotive EMC. |
| VDD_1V2 | Core voltage supply (1.2 V) | Delivered via internal regulator; externally filtered to stabilize e200z4 core operation at 150 MHz under dynamic load. |
| OSC_IN / OSC_OUT | Crystal oscillator interface | Supports 4–40 MHz fundamental-mode crystals; integrated oscillator circuit eliminates need for external crystal driver. |
| FLEXRAY_A_TX / FLEXRAY_A_RX | FlexRay Channel A differential pair | Compliant with FlexRay v2.1 physical layer; supports bus guardian functionality and built-in termination control. |
| CAN_A_TX / CAN_A_RX | FlexCAN A differential transceiver interface | Direct connection to external CAN transceiver; supports ISO 11898-2 compliant signaling with programmable slew rate. |
| NEXUS_TDI / TDO / TCK / TMS | Nexus Class 3+ debug interface | Enables real-time trace, non-intrusive breakpoints, and memory inspection during ASIL-B runtime validation. |
Key Features
| Feature | Design Value |
|---|---|
| FMPLL with frequency modulation | Reduces electromagnetic interference by spreading spectrum of system clock; configurable depth (0–2%) and frequency (up to 100 kHz) via register control. |
| Boot Assist Module (BAM) | Enables secure, authenticated boot from CAN/SCI/FlexRay; validates firmware signature before execution to prevent unauthorized code injection. |
| Junction temperature sensor | Monitors die temperature with ±20°C accuracy (–40°C to 150°C range); triggers thermal shutdown or derating when threshold exceeded. |
| eMIOS with 24 unified channels | Configurable as input capture, output compare, or PWM generator; supports synchronized multi-phase motor control with <100 ns jitter. |
| Development Trigger Semaphore (DTS) | 32-bit semaphore register + EVTO pin enables coordinated, time-stamped data acquisition across multiple tools during HIL testing. |
Applications
| Engine Control Unit (ECU) | Brake-by-Wire Controller |
|---|---|
Use Scenario: Real-time combustion management in gasoline/diesel engines using crank/cam sensors, wideband O2, and knock detection. IC Role / Device Role / Timing Role: Primary controller executing closed-loop fuel injection, spark timing, and variable valve actuation with sub-microsecond interrupt latency. Use Value: eTPU2 handles high-precision cam phasing waveforms; eQADC captures knock sensor signals at 688 ns resolution; FlexCAN A/B/C enable redundancy between ECU and transmission/gearbox modules. | Use Scenario: Fault-tolerant hydraulic pressure control in electro-hydraulic brake systems with dual-redundant actuators and pedal feel simulators. IC Role / Device Role / Timing Role: Safety-critical domain controller coordinating brake pressure modulation, pedal travel sensing, and fail-safe fallback logic per ISO 26262 ASIL-D decomposition. Use Value: FlexRay v2.1 ensures deterministic 10 Mbit/s communication with 128 message objects and ECC; MPU enforces memory isolation between safety and non-safety partitions; CRC unit validates RAM/flash integrity at runtime. |
| Electric Power Steering (EPS) | Chassis Domain Controller |
Use Scenario: Torque assist calculation and motor current regulation in column- or rack-mounted EPS systems with torque, angle, and speed feedback. IC Role / Device Role / Timing Role: High-bandwidth servo controller managing field-oriented motor control (FOC) loops at ≥10 kHz update rate with synchronized ADC sampling. Use Value: Dual eQADCs provide simultaneous sampling of motor phase currents and resolver signals; eMIOS generates PWM with <100 ns jitter; FMPLL reduces conducted EMI near sensitive analog sensor paths. | Use Scenario: Centralized coordination of suspension damping, active roll stabilization, and adaptive air ride across vehicle platforms. IC Role / Device Role / Timing Role: High-integration gateway aggregating CAN FD, FlexRay, and LIN traffic while performing real-time chassis dynamics calculations. Use Value: External Bus Interface (EBI) connects to external SRAM for large lookup tables; 3× FlexCAN and 1× FlexRay enable seamless integration with legacy and next-gen ECUs; 120 GPIOs support discrete valve/solenoid control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5643L | Same e200z4 core, but 2 MB flash, 128 KB SRAM, no FlexRay, single eQADC, 176 LQFP only. | Limited to non-FlexRay chassis modules (e.g., HVAC, body control) where ASIL-B is not required. | Select when cost-sensitive, lower-peripheral-count applications eliminate need for FlexRay, dual eQADC, or 4 MB flash. |
| SPC574Sxx | ARM Cortex-R5F core, 3 MB flash, 512 KB SRAM, dual FlexCAN, no FlexRay, ISO 26262 ASIL-D certified. | Targeted at next-gen ASIL-D systems requiring higher compute throughput and formal safety certification evidence. | Select when migrating to ARM-based toolchains, requiring ASIL-D certification, or needing >150 MHz deterministic performance with lockstep cores. |
Compared with SPC5644AF0MVZ1R, MPC5643L lacks FlexRay and has reduced memory/peripherals for cost-constrained applications, while SPC574Sxx offers ARM-based ASIL-D readiness at the expense of Power Architecture ecosystem continuity and FlexRay support.
Availability
SPC5644AF0MVZ1R is available at Aetrix Electronics and suitable for engine control units, brake-by-wire systems, electric power steering modules, and chassis domain controllers requiring stable component supply across extended automotive lifecycles.
Supply support for SPC5644AF0MVZ1R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, with deep expertise in functional safety and secure processing.
The SPC5644AF0MVZ1R belongs to the Qorivva MPC56xx family-designed specifically for ASIL-B automotive powertrain and chassis control, emphasizing real-time determinism, hardware safety mechanisms, and robust EMI resilience.
FAQ
What is the maximum operating temperature range for the SPC5644AF0MVZ1R?
The SPC5644AF0MVZ1R is rated for operation from –40°C to +125°C ambient temperature, validated per AEC-Q100 Grade 1 requirements. Its integrated junction temperature sensor provides real-time die monitoring with ±20°C accuracy, enabling thermal derating or shutdown actions in high-load automotive environments such as under-hood engine control units.
Does the SPC5644AF0MVZ1R support ISO 26262 functional safety compliance?
Yes, the SPC5644AF0MVZ1R is designed to support ASIL-B compliance per ISO 26262. It includes hardware safety features such as ECC on flash and SRAM, a 16-entry MPU for memory partitioning, CRC units with three independent submodules, lockstep-capable Nexus debug, and a junction temperature sensor. While the device itself is not pre-certified, its architecture enables systematic development of ASIL-B software and hardware safety mechanisms.
What packages are available for the SPC5644AF0MVZ1R?
The SPC5644AF0MVZ1R is offered exclusively in a 324-ball TEPBGA package (23 mm × 23 mm, 0.8 mm pitch), optimized for thermal dissipation and mechanical reliability in automotive under-hood applications. This package is upwardly compatible with standardized Freescale MPC5xxx family ballmaps (e.g., MPC5554, MPC5567) and supports all I/O, FlexRay, and Nexus debug signals required for full-featured automotive control.
How does the FMPLL in the SPC5644AF0MVZ1R reduce electromagnetic interference?
The FMPLL in the SPC5644AF0MVZ1R implements programmable triangle-wave frequency modulation (0–2% depth, up to 100 kHz), spreading the spectral energy of the 150 MHz system clock. This reduces peak emissions in narrowband EMI tests-critical for passing CISPR 25 Class 5 automotive EMC requirements-without impacting timing determinism or requiring external spread-spectrum clock generators.
Can the SPC5644AF0MVZ1R execute code while programming flash memory?
Yes, the SPC5644AF0MVZ1R supports Read-While-Write (RWW) operation in its 4 MB flash memory. This allows the e200z4 core to execute code from one flash bank while simultaneously erasing or programming another, enabling safe in-field firmware updates without halting real-time control tasks-a requirement for ASIL-B-compliant OTA updates in modern engine control units.
SPC5644AF0MVZ1R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 324-BBGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 150MHz
- Connectivity:
- CANbus, EBI/EMI, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 151
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 5.25V
- Data Converters:
- A/D 40x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5644AF0MVZ1R FAQ
1.How can I place an order for SPC5644AF0MVZ1R through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5644AF0MVZ1R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5644AF0MVZ1R reliable?
The price and inventory of SPC5644AF0MVZ1R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5644AF0MVZ1R is usually 5 days.
3.What payment methods are accepted for SPC5644AF0MVZ1R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5644AF0MVZ1R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5644AF0MVZ1R?
SPC5644AF0MVZ1R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5644AF0MVZ1R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5644AF0MVZ1R?
For technical support, including SPC5644AF0MVZ1R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5644AF0MVZ1R requirements.
6.How does Aetrix verify that SPC5644AF0MVZ1R is sourced from the original manufacturer or authorized distributors?
All SPC5644AF0MVZ1R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5644AF0MVZ1R meets industry standards.
7.What is the process for return or replacement of SPC5644AF0MVZ1R?
All SPC5644AF0MVZ1R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5644AF0MVZ1R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5644AF0MVZ1R part is unused and in its original packaging.
Return procedure for SPC5644AF0MVZ1R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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