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NXP Semiconductors SPC5644AF0MVZ3R
- Part No.:
- SPC5644AF0MVZ3R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 324-BBGA
- Datasheet:
-
SPC5644AF0MVZ3R.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 324PBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,496
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Product details
Overview
SPC5644AF0MVZ3R from NXP Semiconductors (formerly Freescale) is a 32-bit Power Architecture® microcontroller designed for automotive powertrain and chassis control systems. It features a 150 MHz e200z4 core with VLE, 4 MB on-chip flash with ECC and Read-While-Write, 192 KB SRAM with ECC, triple FlexCAN interfaces (64 messages each), and integrated FlexRay v2.1 up to 10 Mbit/s - enabling real-time engine management and advanced driver assistance modules.
For engineers reviewing the SPC5644AF0MVZ3R datasheet, SPC5644AF0MVZ3R pinout, SPC5644AF0MVZ3R application, or SPC5644AF0MVZ3R equivalent, key selection considerations include its dual-channel eTPU2 with 32 channels, 24-channel eMIOS timer subsystem, 40-channel 12-bit eQADC with 688 ns minimum conversion time, and Class 3+ Nexus debug support for deterministic automotive firmware development.
Technical Context
The SPC5644AF0MVZ3R implements a superscalar e200z4 core with two execution units, supporting up to two integer or floating-point instructions per cycle and four multiply-accumulate operations per cycle. Its memory hierarchy includes an 8 KB configurable instruction cache (2- or 4-way), 192 KB SRAM with standby mode, and 4 MB flash with ECC and RWW capability.
Peripherals are interconnected via a 5×4 crossbar switch supporting concurrent transactions across CPU instruction/data buses, eDMA, FlexRay, and EBI. The device integrates fail-safe mechanisms including a 16-entry MPU, CRC unit with three sub-modules, junction temperature sensor (±20°C accuracy), and software watchdog with windowing functionality - all aligned with ISO 26262 ASIL-B requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | e200z4 Power Architecture® CPU, 150 MHz max, VLE support, superscalar dual-issue |
| Flash Memory | 4 MB on-chip, with ECC (single-bit correction/double-bit detection) and Read-While-Write capability |
| SRAM | 192 KB on-chip, 32 KB with standby mode, full ECC protection |
| eQADC | Two 12-bit converters, 40 multiplexed input channels, 688 ns min conversion time, 6 command queues |
| FlexCAN | Three independent controllers, each supporting 64 message buffers, CAN FD-ready timing architecture |
| FlexRay | Single FlexRay module v2.1, dual/single channel, 128 message objects, ECC-protected RAM |
| eTPU2 | 32 standard channels + 6-channel reaction module, dedicated for high-precision timing-critical tasks like ignition control |
| Package | 324-ball TEPBGA (23 mm × 23 mm), RoHS-compliant, lead-free |
Pinout & Package
SPC5644AF0MVZ3R is housed in a 324-ball Thin Enhanced Plastic Ball Grid Array (TEPBGA) package measuring 23 mm × 23 mm with 0.8 mm ball pitch. This package supports thermal dissipation required for under-hood automotive operation and provides signal integrity for high-speed FlexRay and DSPI interfaces.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_MAIN | Main supply rail | 5 V nominal input; powers core logic, flash, and analog peripherals - requires external ballast resistor per datasheet |
| VDD_IO | I/O supply rail | 3.3 V nominal; powers GPIO, eSCI, DSPI, and FlexCAN transceivers - independently regulated |
| VDD_CORE | Digital core supply | 1.2 V nominal; powers e200z4 core and cache - supplied via internal regulator or external source |
| VRST | Reset input | Active-low asynchronous reset; accepts 5 V tolerant signal; glitch-filtered by SIU |
| EVTO | External trigger output | Nexus debug trigger signal; used for synchronized data acquisition with external tools |
| FRAY_TXD/FRAY_RXD | FlexRay differential pair | LVDS-compatible pins for FlexRay bus communication at up to 10 Mbit/s |
| ADC0_IN0–ADC0_IN15 | Analog inputs | 12-bit eQADC channel group A inputs; support programmable hysteresis and oversampling |
| ETPU2_CH0–ETPU2_CH31 | eTPU2 I/O | Dedicated pins for eTPU2 standard channels; support edge-triggered capture and waveform generation |
Key Features
| Feature | Design Value |
|---|---|
| Class 3+ Nexus debug | Full real-time trace and non-intrusive debugging of e200z4 core, including instruction and data trace with timestamping |
| Fail-safe memory protection | 16-entry MPU enforces supervisor/user access rights across SRAM, flash, and peripheral bridge - critical for ASIL-B compliance |
| Hardware CRC acceleration | Three independent CRC sub-modules support concurrent checksum generation for flash, RAM, and communication buffers |
| Bootloader integration | On-chip CAN/SCI/FlexRay Bootstrap Loader with Boot Assist Module (BAM) enables field firmware updates without external programmer |
| Temperature sensing | Integrated junction temperature sensor with ±20°C accuracy over full operating range - used for thermal throttling and diagnostics |
| Power management | Multiple low-power modes (slow, stop, stand-by) with fast wake-up (< 5 µs from stop mode) for duty-cycled automotive subsystems |
Applications
| Engine Control Unit (ECU) | Advanced Driver Assistance Systems (ADAS) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection sequencing, and knock detection in gasoline and diesel powertrains. IC Role / Device Role / Timing Role: Primary controller executing safety-critical engine management algorithms with deterministic latency via eTPU2 and eMIOS timers. Use Value: 150 MHz e200z4 core with SPE extension delivers >1.2 DMIPS/MHz for complex control loops; 4 MB flash stores multiple calibration maps and diagnostic logs. | Use Scenario: Sensor fusion and actuator coordination in lane departure warning, automatic emergency braking, and adaptive cruise control. IC Role / Device Role / Timing Role: Central domain controller interfacing radar, camera, and ultrasonic sensors via FlexRay and CAN, synchronizing data with eTPU2 timestamps. Use Value: Triple FlexCAN and FlexRay v2.1 enable deterministic multi-bus communication; 40-channel eQADC acquires analog sensor signals with <688 ns latency. |
| Electric Power Steering (EPS) | Brake Control Module |
Use Scenario: Torque assist calculation, motor current control, and fault monitoring in steer-by-wire and column-assist EPS systems. IC Role / Device Role / Timing Role: Safety-certified controller managing motor drive signals through DSPI and PWM outputs while monitoring torque sensor feedback via eQADC. Use Value: Dual eQADC with 6 command queues allows simultaneous sampling of position, current, and temperature sensors; ECC-protected SRAM ensures data integrity during transient faults. | Use Scenario: ABS, ESC, and electronic parking brake actuation with real-time wheel speed analysis and hydraulic pressure modulation. IC Role / Device Role / Timing Role: High-integrity controller using MPU-enforced memory partitioning to isolate safety-critical braking logic from diagnostics and communication stacks. Use Value: 16-entry MPU prevents unauthorized access to brake actuation registers; Class 3+ Nexus enables end-to-end traceability for ISO 26262 tool qualification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5644AF0MVZ1 | Same die, 176-pin LQFP package (24 mm × 24 mm); no TEPBGA ballmap compatibility | Limited I/O count (120 vs. 144 GPIO); lower thermal performance; unsuitable for high-density FlexRay routing | Select only when board space constraints prohibit BGA or thermal budget permits LQFP |
| SPC5643LK0MLL3 | 128 MB flash, 128 KB SRAM, single FlexCAN, no FlexRay; 133 MHz e200z4 core | Targeted for mid-tier body control modules; lacks eTPU2 and reaction module for precision timing | Choose for cost-sensitive non-powertrain applications where FlexRay and dual eQADC are unnecessary |
Compared with SPC5644AF0MVZ3R, MPC5644AF0MVZ1 offers identical functionality in a less thermally efficient LQFP package, while SPC5643LK0MLL3 reduces complexity and cost by removing FlexRay, eTPU2, and half the flash - making it suitable for non-safety-critical domains but inadequate for ASIL-B powertrain use.
Availability
SPC5644AF0MVZ3R is available at Aetrix Electronics and suitable for automotive powertrain control, ADAS domain controllers, electric power steering systems, and brake control modules requiring stable component supply across extended product lifecycles.
Supply support for SPC5644AF0MVZ3R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and embedded processing.
The SPC5644AF0MVZ3R belongs to NXP's SPC56x automotive MCU family, engineered specifically for ASIL-B compliant powertrain and chassis control - emphasizing real-time determinism, hardware safety mechanisms, and multi-protocol vehicle network integration.
FAQ
What is the maximum operating frequency of the SPC5644AF0MVZ3R core?
The SPC5644AF0MVZ3R features a 150 MHz e200z4 Power Architecture® core. This maximum frequency is achievable under specified voltage (1.2 V core, 3.3 V I/O, 5 V main) and temperature (–40°C to 125°C ambient) conditions per the MPC5644A Rev. 7 datasheet. The FMPLL supports dynamic clock scaling, and the core maintains full instruction set compatibility including VLE and SPE extensions at all supported frequencies. SPC5644AF0MVZ3R operates reliably at this rate in automotive under-hood environments when thermal design guidelines are followed.
Does the SPC5644AF0MVZ3R support ISO 26262 functional safety certification?
Yes, the SPC5644AF0MVZ3R includes hardware safety features required for ASIL-B compliance, including a 16-entry MPU, ECC on flash and SRAM, CRC acceleration units, lock-step capable peripherals, and Class 3+ Nexus debug for traceability. While the device itself is not pre-certified, NXP provides safety manuals, FMEDA reports, and diagnostic software libraries to support customer-led ISO 26262 development. SPC5644AF0MVZ3R has been deployed in production ASIL-B powertrain ECUs meeting automotive OEM safety requirements.
What are the supported boot sources for the SPC5644AF0MVZ3R?
The SPC5644AF0MVZ3R supports boot from internal flash, external memory via EBI, or serial interfaces using its integrated CAN/SCI/FlexRay Bootstrap Loader (BAM). Boot mode is selected via external pins (BS[2:0]) at reset. The BAM enables field firmware updates over CAN or FlexRay without external programming hardware. SPC5644AF0MVZ3R also supports secure boot via user-configurable flash protection bits and MPU-enforced code execution boundaries.
How many ADC channels does the SPC5644AF0MVZ3R provide, and what is their resolution?
The SPC5644AF0MVZ3R integrates two enhanced queued analog-to-digital converters (eQADCs) supporting up to 40 multiplexed 12-bit input channels - expandable to 56 with external multiplexers. Each converter has six command queues, DMA and trigger support, and achieves a minimum conversion time of 688 ns. SPC5644AF0MVZ3R uses these ADCs for real-time acquisition of engine temperature, throttle position, oxygen sensor voltage, and other critical analog signals in automotive control loops.
Is the SPC5644AF0MVZ3R pin-compatible with other members of the MPC56xx family?
The SPC5644AF0MVZ3R shares the same 324-ball TEPBGA ballmap with upward compatibility to standardized Freescale MPC5xxx family packages (e.g., MPC5554, MPC5567, MPC5666), but is not pin-compatible with LQFP or MAPBGA variants of the MPC5644A series. Its 324 TEPBGA footprint differs from the 208 MAPBGA (MPC5644AF0MVY3R) and 176 LQFP (MPC5644AF0MVZ1) variants. SPC5644AF0MVZ3R requires dedicated PCB layout; migration between packages necessitates board redesign.
SPC5644AF0MVZ3R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 324-BBGA
- Series:
- MPC56xx Qorivva
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 80MHz
- Connectivity:
- CANbus, EBI/EMI, LINbus, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 151
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.14V ~ 5.25V
- Data Converters:
- A/D 40x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
SPC5644AF0MVZ3R FAQ
1.How can I place an order for SPC5644AF0MVZ3R through Aetrix?
Please submit a Request for Quotation (RFQ) for SPC5644AF0MVZ3R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPC5644AF0MVZ3R reliable?
The price and inventory of SPC5644AF0MVZ3R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPC5644AF0MVZ3R is usually 5 days.
3.What payment methods are accepted for SPC5644AF0MVZ3R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPC5644AF0MVZ3R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPC5644AF0MVZ3R?
SPC5644AF0MVZ3R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPC5644AF0MVZ3R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPC5644AF0MVZ3R?
For technical support, including SPC5644AF0MVZ3R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPC5644AF0MVZ3R requirements.
6.How does Aetrix verify that SPC5644AF0MVZ3R is sourced from the original manufacturer or authorized distributors?
All SPC5644AF0MVZ3R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPC5644AF0MVZ3R meets industry standards.
7.What is the process for return or replacement of SPC5644AF0MVZ3R?
All SPC5644AF0MVZ3R units undergo pre-shipment inspection (PSI). If there is an issue with SPC5644AF0MVZ3R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPC5644AF0MVZ3R part is unused and in its original packaging.
Return procedure for SPC5644AF0MVZ3R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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